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CC2642R
ZHCSHI2E –JANUARY 2018–REVISED JULY 2019
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修订历史记录
Copyright © 2018–2019, Texas Instruments Incorporated
内内容容
1 器器件件概概述述 .................................................... 1
1.1 特性 ................................................... 1
1.2 应用 ................................................... 2
1.3 说明 ................................................... 2
1.4 Functional Block Diagram ............................ 3
2 修修订订历历史史记记录录............................................... 4
3 Device Comparison ..................................... 5
4 Terminal Configuration and Functions.............. 6
4.1 Pin Diagram – RGZ Package (Top View) ............ 6
4.2 Signal Descriptions – RGZ Package ................. 7
4.3 Connections for Unused Pins and Modules.......... 8
5 Specifications ............................................ 9
5.1 Absolute Maximum Ratings .......................... 9
5.2 ESD Ratings.......................................... 9
5.3 Recommended Operating Conditions ................ 9
5.4 Power Supply and Modules .......................... 9
5.5 Power Consumption - Power Modes ............... 10
5.6 Power Consumption - Radio Modes ............... 11
5.7 Nonvolatile (Flash) Memory Characteristics ........ 11
5.8 Thermal Resistance Characteristics ................ 12
5.9 Bluetooth Low Energy - Receive (RX) .............. 13
5.10 Bluetooth Low Energy - Transmit (TX).............. 16
5.11 Timing and Switching Characteristics ............... 17
5.12 Peripheral Characteristics ........................... 21
5.13 Typical Characteristics .............................. 29
6 Detailed Description ................................... 42
6.1 Overview ............................................ 42
6.2 System CPU ........................................ 42
6.3 Radio (RF Core)..................................... 43
6.4 Memory.............................................. 44
6.5 Sensor Controller ................................... 45
6.6 Cryptography ........................................ 46
6.7 Timers ............................................... 47
6.8 Serial Peripherals and I/O........................... 48
6.9 Battery and Temperature Monitor................... 48
6.10 µDMA................................................ 48
6.11 Debug ............................................... 48
6.12 Power Management................................. 49
6.13 Clock Systems ...................................... 50
6.14 Network Processor .................................. 50
7 Application, Implementation, and Layout ......... 51
7.1 Reference Designs.................................. 51
8 器器件件和和文文档档支支持持 .......................................... 52
8.1 工具和软件 .......................................... 52
8.2 文档支持............................................. 54
8.3 Community Resources .............................. 55
8.4 商标.................................................. 55
8.5 静电放电警告 ........................................ 55
8.6 Glossary............................................. 55
9 机机械械、、封封装装和和可可订订购购信信息息................................ 55
9.1 封装信息............................................. 55
2 修修订订历历史史记记录录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision D (May 2019) to Revision E Page
• Added footnote to Table 5-10...................................................................................................... 21
• 已添加 节 5.13 ...................................................................................................................... 29
• 已添加 CC26x2REM-7ID Design Files to 节 7.1 ................................................................................ 51
• 已更改 更改了节 8.2中的“应用报告”小节 ......................................................................................... 54
m0_745259962023-02-01#完美解决问题 #运行顺畅 #内容详尽 #全网独家 #注释完整
