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CC2652R
ZHCSHI3E –JANUARY 2018–REVISED JULY 2019
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修订历史记录
Copyright © 2018–2019, Texas Instruments Incorporated
内内容容
1 器器件件概概述述 .................................................... 1
1.1 特性 ................................................... 1
1.2 应用 ................................................... 2
1.3 说明 ................................................... 2
1.4 Functional Block Diagram ............................ 3
2 修修订订历历史史记记录录............................................... 4
3 Device Comparison ..................................... 5
4 Terminal Configuration and Functions.............. 6
4.1 Pin Diagram – RGZ Package (Top View) ............ 6
4.2 Signal Descriptions – RGZ Package ................. 7
4.3 Connections for Unused Pins and Modules.......... 8
5 Specifications ............................................ 9
5.1 Absolute Maximum Ratings .......................... 9
5.2 ESD Ratings.......................................... 9
5.3 Recommended Operating Conditions ................ 9
5.4 Power Supply and Modules .......................... 9
5.5 Power Consumption - Power Modes ............... 10
5.6 Power Consumption - Radio Modes ............... 11
5.7 Nonvolatile (Flash) Memory Characteristics ........ 11
5.8 Thermal Resistance Characteristics ................ 12
5.9 Bluetooth Low Energy - Receive (RX) .............. 13
5.10 Bluetooth Low Energy - Transmit (TX).............. 16
5.11 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz
(OQPSK DSSS1:8, 250 kbps) - RX................. 17
5.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz
(OQPSK DSSS1:8, 250 kbps) - TX ................. 18
5.13 Timing and Switching Characteristics ............... 19
5.14 Peripheral Characteristics ........................... 23
5.15 Typical Characteristics .............................. 31
6 Detailed Description ................................... 46
6.1 Overview ............................................ 46
6.2 System CPU ........................................ 46
6.3 Radio (RF Core)..................................... 47
6.4 Memory.............................................. 48
6.5 Sensor Controller ................................... 49
6.6 Cryptography ........................................ 50
6.7 Timers ............................................... 51
6.8 Serial Peripherals and I/O........................... 52
6.9 Battery and Temperature Monitor................... 52
6.10 µDMA................................................ 52
6.11 Debug ............................................... 52
6.12 Power Management................................. 53
6.13 Clock Systems ...................................... 54
6.14 Network Processor .................................. 54
7 Application, Implementation, and Layout ......... 55
7.1 Reference Designs.................................. 55
8 器器件件和和文文档档支支持持 .......................................... 56
8.1 工具和软件 .......................................... 56
8.2 文档支持............................................. 58
8.3 Community Resources .............................. 59
8.4 商标.................................................. 59
8.5 静电放电警告 ........................................ 59
8.6 Glossary............................................. 59
9 机机械械、、封封装装和和可可订订购购信信息息................................ 59
9.1 封装信息............................................. 59
2 修修订订历历史史记记录录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision D (May 2019) to Revision E Page
• 已删除 删除了 YBG 封装的所有引用 ............................................................................................... 1
• Deleted subsection 4.3 Pin Diagram – YBG Package (Top View) and subsection 4.4 Signal Descriptions – YBG
Package in Section 4. Subsequent subsections renumbered .................................................................. 8
• Deleted Connections for Unused Pins – YBG Package table in Section 4.3 ................................................ 8
• Added footnote to Table 5-10...................................................................................................... 23
• 已添加 节 5.15 ...................................................................................................................... 31
• 已添加 CC26x2REM-7ID Design Files to 节 7.1 ................................................................................ 55
• 已更改 更改了节 8.2中的“应用报告”小节 ......................................................................................... 58
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