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TI-LMX5251.pdf
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TI-LMX5251.pdf
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Digital
Interface
&
Control
Unit
XTAL
Oscillator &
Baseband
PLL
CE
RESET#
CCB_CLOCK
CCB_LATCH
CCB_DATA
BBP_CLOCK
TX_RX_SYNC
TX_RX_DATA
XTAL_G
XTAL_D
FM
Discriminator
Complex Filter
Delta
Sigma
N/(N+1)
Charge
Pump
Loop
Filter
X
X
-
PA
LNA
GROUND PAD
RF_PORT_TX_A
RF_PORT_TX_B
RF_PORT_RX
VDD_ANA_OUT
VDD_ANA_IN
2.5V
Regulator
Digital
VDD_DIG_IN
VDD_DIG_OUT
VDD_DIG_PWR_D#
2.5V
Regulator
Analog
TR_SWITCH_P
TR_SWITCH_N
GPO1
GPO2
LMX5251
www.ti.com
SNOSCW3A –FEBRUARY 2004–REVISED APRIL 2013
LMX5251 Bluetooth™ CMOS Radio
Check for Samples: LMX5251
1
FEATURES
– Integrated Radio Frequency Voltage
Controlled Oscillator (RFVCO)
2
• Bluetooth Version 1.1 Qualified
– Dual on-chip Voltage Regulators:)
• Flexible Radio Frequency (RF) to Baseband
– Input Voltages 2.85V–3.6V
(BB) Interface
– Output Nominally 2.5VM
• LOW POWER
– 48-pin WQFN (Thin Quad Flatpack No lead)
– Low Current Consumption
Package
– Power Management Control Functions
– No Pb Leadframe – LMX5251SQ NOPB
• HIGH PERFORMANCE
– < -82 dBm Sensitivity
APPLICATIONS
– Class 2/3 Operation
• Bluetooth Compatible Interface Devices
– ± 1/12 Bit Sampling Resolution
• Cellular and Cordless Phones, PDAs
– Closed LoopM ΔΣ Modulation
• Desktop and Laptop PCs, Printers, Scanners
• HIGH INTEGRATION
• Other Wireless-Interfaced Appliances
– Low IF (Intermediate Frequency)
Architecture with Digital Demodulation
BLOCK DIAGRAM
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2Bluetooth is a trademark of Bluetooth Sig, Inc.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMX5251
SNOSCW3A –FEBRUARY 2004–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION
The LMX5251 is a high performance, monolithic, radio transceiver optimized for Bluetooth™™ communications
systems. When used in conjunction with a Bluetooth baseband controller, a complete Bluetooth node with a Host
Control Interface (HCI) can be implemented.
The LMX5251 radio architecture allows for minimal external components. The highly integrated design includes
the Low Noise Amplifier (LNA), mixer, on-chip filters, 2.5 GHz delta-sigma phase-lock loop (ΔΣ PLL), voltage
controlled oscillator, modem functions, and dual power supply regulators. Digital modulation and demodulation
techniques are utilized for a robust manufacturable design. Power management includes control over individual
chip functions and internal voltage regulation for optimum performance.
The LMX5251 modem circuitry provides the data communication link to the Bluetooth baseband controller. The
interface is flexible and works with solutions that require a standalone Bluetooth radio. The LMX5251 can be
placed in Sleep mode (reducing system current consumption) and is optimized for low power operation. It
operates from a single 2.85V to 3.6V power supply.
The LMX5251 is manufactured using a CMOS process and is available in a 48-pin WQFN (Thin Quad Flatpack,
No lead) package. Die processing is also available through Texas Instruments Die Products Group.
The LMX5251 is the most recent revision of the LMX5250 and is completely interoperable with the LMX5100
Bluetooth Baseband Controller.
CONTENTS
FEATURES ....................................................................................... ....................................................................................... 1
APPLICATIONS.................................................................................... .................................................................................... 1
DESCRIPTION .................................................................................... .................................................................................... 2
ELECTRICAL SPECIFICATIONS ...................................................................... ...................................................................... 6
ABSOLUTE MAXIMUM RATINGS ..................................................................... ..................................................................... 6
RECOMMENDED OPERATING CONDITIONS ........................................................... ........................................................... 7
POWER SUPPLY ELECTRICAL SPECIFICATIONS ....................................................... ....................................................... 7
DC CHARACTERISTICS DIGITAL I/O .................................................................. .................................................................. 7
RECEIVER PERFORMANCE CHARACTERISTICS ....................................................... ....................................................... 8
TRANSMITTER PERFORMANCE CHARACTERISTICS.................................................... .................................................... 8
CRYSTAL/OSCILLATOR PERFORMANCE CHARACTERISTICS ............................................ ............................................ 9
AC CHARACTERISTICS SERIAL INTERFACE TIMING ................................................... ................................................... 10
PERFORMANCE PARAMETERS (TYPICAL)............................................................ ............................................................ 11
FUNCTIONAL DESCRIPTION ....................................................................... ....................................................................... 13
APPLICATION INFORMATION....................................................................... ....................................................................... 20
Revision History................................................................................... ................................................................................... 34
2 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links :LMX5251
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
LMX5251
NC
NC
BBP_CLOCK
TX_RX_DATA
TX_RX_SYNC
CE
CCB_CLOCK
CCB_DATA
CCB_LATCH
RESET#
NC
NC
NC
VDD_IF2
VDD_PLL_72MHZ
VDD_D IG_PWR_D#
VDD_DIG_IN
VDD_DIG_OUT
VDD_DIG_WELL
VDD _DIG_SUPPLY
TR_SWITCH_P
TR_SWITCH_N
GPO1
GPO2
NC
VDD_LNA
RF_PORT_RX
VDD_MIX
VDD_FILTER
VDD_IF1
RF_PORT_TX_A
VDD_PA
RF_PORT_TX_B
VDD_ANA_IN
VDD_ANA_OUT
NC
NC
NC
NC
NC
VDD_VCO
VDD_PRE
VDD_SYNTH_DIG
NC
VDD_CP
XTAL_G
XTAL_D
VDD_XTAL
(Top View)
27
26
LMX5251
www.ti.com
SNOSCW3A –FEBRUARY 2004–REVISED APRIL 2013
CONNECTION DIAGRAM
(TOP VIEW)
NOTE: Ground pad layout under ground slug of LMX5251 is required. These are connected by vias through all layers to
ground plane. No pins on device are ground pins so center slug must be grounded. See detail in Figure 27
"Component Placement Layer 1 Ground Pad Detail".
PIN FUNCTIONS
PIN
I/O DESCRIPTION
NAME NO.
NC 1, 12, 13, – No Connect. Place pin but do not connect to VCC or Ground.
25, 26, 35,
36, 41,
45–48
VDD_LNA 2 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
RF_PORT_RX 3 I RF Input to Receiver.
VDD_MIX 4 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
VDD_FILTER 5 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
VDD_IF1 6 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
RF_PORT_TX_A 7 O Transmit Positive Differential Output. Typically connected along with RF_PORT_TX_B to
a balun and fed to the antenna.
VDD_PA 8 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links :LMX5251
LMX5251
SNOSCW3A –FEBRUARY 2004–REVISED APRIL 2013
www.ti.com
PIN FUNCTIONS (continued)
PIN
I/O DESCRIPTION
NAME NO.
RF_PORT_TX_B 9 O Transmit Inverted Differential Output. Typically connected along with RF_PORT_TX_A to
a balun and fed to the antenna.
VDD_ANA_IN 10 PWR 2.85V to 3.6V Input for the Internal Power Supply Regulator for the RF Circuitry.
Powered down when CE (pin 31) is held low.
VDD_ANA_OUT 11 PWR Voltage Regulator Output/Power Supply for Analog Circuitry. The bypass capacitor
should be placed as close as possible to this pin and be connected to Ground.
VDD_IF2 14 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
VDD_PLL_72MHZ 15 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
VDD_DIG_PWR_D# 16 I Power Down for the Internal Power Supply Regulator for the Digital Circuitry. Digital
regulator is powered down when low. Default operation is on, internal pull-up.
VDD_DIG_IN 17 PWR 2.85V to 3.6V Input for the Internal Power Supply Regulator for the Digital Circuitry.
VDD_DIG_OUT 18 PWR Voltage Regulator Output/Power Supply for Digital Circuitry. A bypass capacitor should
be placed as close as possible to this pin and be connected to Ground.
VDD_DIG_WELL 19 PWR Power Supply for Digital Circuitry. Must be connected to the VDD_DIG_OUT pin (pin 18)
or external supply. A bypass capacitor should be placed as close as possible to this pin and
be connected to Ground.
VDD_DIG_SUPPLY 20 PWR Power Supply for Digital Circuitry. Must be connected to the VDD_DIG_OUT pin (pin 18)
or external supply. A bypass capacitor should be placed as close as possible to this pin and
be connected to Ground.
TR_SWITCH_P 21 O Output Control for RF T/R Switch. The complement of TR_SWITCH_N. When the
LMX5251 is transmitting, TR_SWITCH_P is high.
TR_SWITCH_N 22 O Output Control for RF T/R Switch. The complement of TR_SWITCH_P. When the
LMX5251 is receiving, TR_SWITCH_N is high.
GPO1 23 O General Purpose Output 1. The multifunction output state is programmed by setting an
internal register.
GPO2 24 O General Purpose Output 2. The multifunction output state is programmed by setting an
internal register.
RESET# 27 I Master Power on Inverted Reset Input. Internal registers revert to default values while
RESET# is low. The power control register default state enables only the crystal oscillator
and BBP_CLOCK blocks.
CCB_LATCH 28 I Load Enable Signal of the Serial Interface. During write operations (baseband controller
writes into LMX5251 registers) the data received by the shift register of the LMX5251 is
copied into the address register on the next rising edge of CCB_CLOCK after the
CCB_LATCH signal has transitioned to high. During read operations (read from LMX5251
registers) the LMX5251 releases the CCB_DATA line on the next rising edge of
CCB_CLOCK after the CCB_LATCH signal has transitioned to high. Reference serial port
timing Figure 19 and Figure 20.
CCB_DATA 29 I/O Multiplexed Serial Data Receive and Transmit Signal Path. For a write operation, data is
clocked into the LMX5251 shift register in the direction from the most significant bit (MSB) to
the least significant bit (LSB). The data is shifted out of the baseband controller on the falling
edge of CCB_CLOCK, and sampled by the LMX5251 (CCB_DATA) on the rising edge of
CCB_CLOCK. For a read operation, data is clocked out of the LMX5251 shift register in the
direction from MSB to LSB. The data is shifted out of the LMX5251 (CCB_DATA) on the
rising edge of CCB_CLOCK, and sampled by the baseband controller on the falling edge of
CCB_CLOCK. Reference serial port timing Figure 19 and Figure 20.
CCB_CLOCK 30 I Serial Interface Shift Clock Signal. The baseband controller always acts as the master of
the serial interface and therefore always provides the shift clock. This clock can be
asynchronous with the BBP_CLOCK and is assumed to be gated by the baseband controller.
Reference serial port timing Figure 19 and Figure 20.
CE 31 I Chip Enable Input. All analog blocks and the analog regulator are off and there is no
BBP_CLOCK signal. All digital blocks and the digital regulator are on.
TX_RX_SYNC 32 I/O Transmit and Receive Slot Timing Synchronization.
4 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links :LMX5251
LMX5251
www.ti.com
SNOSCW3A –FEBRUARY 2004–REVISED APRIL 2013
PIN FUNCTIONS (continued)
PIN
I/O DESCRIPTION
NAME NO.
TX_RX_DATA 33 I/O Multiplexed Transmit and Receive Bluetooth Data. In receive mode (Bluetooth data
direction from LMX5251 to baseband controller), this signal is provided by the LMX5251
demodulator (RX_DATA) to the baseband coNtroller data receiver oversampled at a 12x
multiple of the 1.0 Mbit/s rate.
In transmit mode, (Bluetooth data direction from baseband controller to LMX5251) this signal
is provided by the baseband controller packet generator to the LMX5251 modulator
(TX_DATA) at a 1.0 Mb/s rate. A pulse on this bus provided by the baseband controller prior
to the beginning of data transmission is used to synchronize the LMX5251 to the baseband
controller to an internal 1.0 MHz transmit clock timing.
BBP_CLOCK 34 O Buffered 12.000 MHz Clock. This 12 MHz clock is provided by the LMX5251 and is used by
the baseband controller as the fast system clock (main clock). The 12 MHz clock is also
used in the LMX5251 demodulator and baseband controller data receiver as the sampling
clock (12 times over-sampling) for the Bluetooth data. During Bluetooth low power modes,
the XTAL oscillator and BBP_CLOCK output of the LMX5251 can be disabled. Upon
RESET# being low, this pin is in TRI-STATE mode.
VDD_XTAL 37 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
XTAL_D 38 I Crystal Drain Oscillator or Positive Clock Input. Typically connected along with XTAL_G
to an external surface mount AT cut crystal. Can also be configured as a frequency input
when using an external crystal oscillator. When configured as a frequency input, it is typically
connected to Ground with a 100 pF capacitor.
XTAL_G 39 I Crystal Gate Oscillator or Negative Clock Input. Typically connected along with XTAL_D
to an external surface mount AT cut crystal. Can also be configured as a frequency input
when using an external crystal oscillator. When configured as a frequency input, is typically
connected to an external Temperature Compensated Crystal Oscillator (TCXO) through an
Alternating Current (AC) coupling capacitor.
VDD_CP 40 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
VDD_SYNTH_DIG 42 PWR Power Supply for Digital Circuitry. Must be connected to the VDD_DIG_OUT pin (pin 18)
or external supply. A bypass capacitor should be placed as close as possible to this pin and
be connected to Ground.
VDD_PRE 43 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
VDD_VCO 44 PWR Power Supply for Analog Circuitry. Must be connected to the VDD_ANA_OUT pin (pin 11)
or external supply. An RF bypass capacitor should be placed as close as possible to this pin
and be connected to Ground.
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links :LMX5251
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