Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 2
3 说明................................................................................... 2
3.1 功能模块图.................................................................. 3
4 Revision History.............................................................. 4
5 Device Comparison......................................................... 7
5.1 Related Products........................................................ 9
6 Terminal Configuration and Functions........................10
6.1 Pin Diagram.............................................................. 10
6.2 Pin Attributes.............................................................11
6.3 Signal Descriptions................................................... 79
6.4 Pin Multiplexing.......................................................135
6.5 Connections for Unused Pins................................. 150
7 Specifications.............................................................. 153
7.1 Absolute Maximum Ratings.................................... 153
7.2 ESD Ratings........................................................... 156
7.3 Power-On-Hour (POH) Limits................................. 156
7.4 Recommended Operating Conditions.....................156
7.5 Operating Performance Points................................159
7.6 Power Consumption Summary............................... 159
7.7 Electrical Characteristics.........................................160
7.8 VPP Specifications for One-Time Programmable
(OTP) eFuses............................................................167
7.9 Thermal Resistance Characteristics....................... 169
7.10 Timing and Switching Characteristics................... 170
8 Detailed Description....................................................288
8.1 Overview................................................................. 288
8.2 Processor Subsystems........................................... 289
8.3 Accelerators and Coprocessors..............................290
8.4 Other Subsystems.................................................. 291
9 Applications and Implementation.............................. 300
9.1 Power Supply Mapping........................................... 300
9.2 Device Connection and Layout Fundamentals....... 303
9.3 Peripheral- and Interface-Specific Design
Information................................................................ 305
10 Device and Documentation Support........................310
10.1 Device Nomenclature............................................310
10.2 Tools and Software............................................... 312
10.3 Documentation Support........................................ 313
10.4 支持资源................................................................313
10.5 Trademarks........................................................... 313
10.6 Electrostatic Discharge Caution............................313
10.7 术语表................................................................... 313
11 Mechanical, Packaging, and Orderable
Information.................................................................. 314
11.1 Packaging Information.......................................... 314
4 Revision History
Changes from July 22, 2021 to August 27, 2021 (from Revision I (July 2021) to Revision J
(August 2021)) Page
• 通篇：删除了引用的“DMIPS”.........................................................................................................................1
• (Device Comparison): Deleted "MCU Island with Lockstep Arm Cortex-R5Fs" row, as info in Lockstep and
Safety Targeted rows. ........................................................................................................................................7
• (Pin Attributes): Updated Buffer Type for MCU_PORz and PORz to FS Reset................................................11
• Updated USB0/1_RCALIB footnote to specify the pin must be connected to VSS through an external resistor,
even when the pin is unused.......................................................................................................................... 103
• Updated REXT pin note to show it should always be connected through an external resistor to VSS, even
when unused.................................................................................................................................................. 103
• Added clarification notes to MMC1_SDCD and MMC2_SDCD signals about pulled down requirement....... 109
• Updated CSI0/1_RXRCALIB footnote to specify the pin must be connected to VSS through an external
resistor, even when the pin is unused.............................................................................................................125
• Updated DSI_TXRCALIB footnote to specify the pin must be connected to VSS through an external resistor,
even when the pin is unused.......................................................................................................................... 126
• Showed SERDES[4:0]_REXT balls should be connected to VSS if unused in Connections for Unused Pins.....
150
• Showed VMON balls should be connected to PWR if unused in Connections for Unused Pins. Also added
note specifying MMC1_SDCD and MMC2_SDCD should be pulled down to function properly ....................150
• Showed CSI[1:0]_RXRCALIB, DSI_TXRCALIB, USB[1:0]_RCALIB pins should be connected to VSS is
unused in Connections for Unused Pins ........................................................................................................150
• Added FS Reset Electrical Characteristics table............................................................................................ 160
• (SERDES Electrical Characteristics): Added SERDES REFCLK electrical characteristics table. The limits are
only applicable when internal termination is enabled..................................................................................... 166
• (GPMC and NOR Flash — Sync Burst Read — 4x16–bit): Updated figure for GPMC_WAIT[j] signal (F21,
F22)................................................................................................................................................................ 227
DRA829J, DRA829V
ZHCSN40J – FEBRUARY 2019 – REVISED AUGUST 2021
www.ti.com.cn
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