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MUX

Serial

Control

Port

MUX

ZCEN

SCLK

SDI

SDO

MUTE

OUT

AGNDL

AGNDR

−

+ DGND

12 13 4

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PGA2310

SBOS207C –OCTOBER 2001–REVISED DECEMBER 2015

PGA2310 Stereo Audio Volume Control

1 Features 3 Description

The PGA2310 is a high-performance, stereo audio

• Digitally-Controlled Analog Volume Control:

volume control designed for professional and high-

– Two Independent Audio Channels

end consumer audio systems. The ability to operate

– Serial Control Interface

from ±15-V analog power supplies enables the

PGA2310 to process input signals with large voltage

– Zero Crossing Detection

swings, thereby preserving the dynamic range

– Mute Function

available in the overall signal path. Using high

• Wide Gain and Attenuation Range: 31.5 dB to

performance operational amplifier stages internal to

−95.5 dB With 0.5-dB Steps

the PGA2310 yields low noise and distortion, while

providing the capability to drive 600-Ω loads directly

• Low Noise and Distortion:

without buffering. The three-wire serial control

– 120-dB Dynamic Range

interface allows for connection to a wide variety of

– 0.0004% THD+N at 1 kHz

host controllers, in addition to support for daisy-

chaining multiple PGA2310 devices.

• Low Interchannel Crosstalk: −126 dBFS

• Noise-Free Level Transitions

Device Information

(1)

• Power Supplies: 15-V Analog, 5-V Digital

PART NUMBER PACKAGE BODY SIZE (NOM)

• Available in DIP−16 and SOL−16 Packages

SOIC (16) 7.50 mm × 10.30 mm

PGA2310

• Pin and Software Compatible With the PGA2311

PDIP (16) 6.35 mm × 19.30 mm

and Cirrus Logic CS3310™

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

2 Applications

• Audio Amplifiers

• Mixing Consoles

• Multi-Track Recorders

• Broadcast Studio Equipment

• Musical Instruments

• Effects Processors

• A/V Receivers

• Car Audio Systems

Stereo Audio Volume Control

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

PGA2310

SBOS207C –OCTOBER 2001–REVISED DECEMBER 2015

www.ti.com

Table of Contents

7.4 Device Functional Modes........................................ 12

1 Features.................................................................. 1

8 Application and Implementation ........................ 13

2 Applications ........................................................... 1

8.1 Application Information............................................ 13

3 Description ............................................................. 1

8.2 Typical Application ................................................. 13

4 Revision History..................................................... 2

9 Power Supply Recommendations...................... 15

5 Pin Configuration and Functions......................... 3

10 Layout................................................................... 15

6 Specifications......................................................... 4

10.1 Layout Guidelines ................................................. 15

6.1 Absolute Maximum Ratings ...................................... 4

10.2 Layout Example .................................................... 15

6.2 ESD Ratings ............................................................ 4

11 Device and Documentation Support ................. 16

6.3 Recommended Operating Conditions....................... 4

11.1 Device Support .................................................... 16

6.4 Thermal Information.................................................. 4

11.2 Documentation Support ....................................... 16

6.5 Electrical Characteristics........................................... 5

11.3 Community Resources.......................................... 16

6.6 Typical Characteristics.............................................. 6

11.4 Trademarks........................................................... 16

7 Detailed Description.............................................. 8

11.5 Electrostatic Discharge Caution............................ 16

7.1 Overview ................................................................... 8

11.6 Glossary................................................................ 16

7.2 Functional Block Diagram ......................................... 8

12 Mechanical, Packaging, and Orderable

7.3 Feature Description................................................... 8

Information ........................................................... 16

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (June 2004) to Revision C Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1

Product Folder Links: PGA2310

PGA2310

SBOS207C –OCTOBER 2001–REVISED DECEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

+ 16

Supply Voltage V

– –16 V

+ 6.5

Analog input voltage 0 V

+,V

– V

Digital input voltage –0.3 V

+ V

Operating temperature –55 125 °C

Junction temperature 150 °C

Lead temperature (soldering, 10 s) 300 °C

Package temperature (IR, reflow, 10 s) 235 °C

stg

Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±4000 V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

+ Positive analog power supply 4.5 15 15.5 V

– Negative analog power supply –4.5 –15 –15.5 V

+ Digital power supply 4.5 5 5.5 V

Operating temperature –55 25 125 °C

6.4 Thermal Information

PGA2310

THERMAL METRIC

(1)

D (SOIC) P (PDIP) UNIT

16 PINS 16 PINS

θJA

Junction-to-ambient thermal resistance 83 39.9 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 44 26.2 °C/W

θJB

Junction-to-board thermal resistance 40.5 20.1 °C/W

Junction-to-top characterization parameter 11.5 10.7 °C/W

Junction-to-board characterization parameter 40.2 19.9 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance N/A N/A °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

Product Folder Links: PGA2310

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