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TI-TPA6166A2.pdf
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SDA
SCL
IRQ
INR
INL
Class-G
Stereo Headphone
Amplifier
CPVDD CPVSS C1P C1N
RING1
TIP
JACK_SENSE
RING2
SLEEVE
ESD
Prot.
MICVDDVDD
PGND
Mic
Bias
MOUTN
MOUTP
GND1
Switch
Matrix
and
Detection
Circuit
Digital
Interface
and
Control
GND2
SAR
ADC
Product
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TPA6166A2
SLAS997B –MARCH 2014–REVISED JANUARY 2015
TPA6166A2 3.5-mm Jack Detect and Headset Interface IC
1 Features 3 Description
The TPA6166A2 single-chip headset interface IC
1
• Ultra Low-Power, High-Performance DirectPath™
simplifies the challenges of detecting what kind of
Class-G Headphone Amplifier
device an end user has plugged into the headphone
– Ground-Centered Output Eliminates DC-
jack while delivering excellent audio quality. The
Blocking Capacitors
device enables smaller end products by integrating a
high-performance, low-power DirectPath variable-
– 30 mW/Ch into 32 Ω / Ch at 1% THD+N
attenuation class-G stereo headphone amplifier,
– –42 dB to +6 dB Volume Control
variable-gain microphone preamplifier with bias with
– 2.0 µV Output Noise at –42 dB Gain
advanced accessory detection circuitry, all in a tiny
– 91-dB PSRR 5-mm × 5-mm terminal, 0.4-mm pitch WCSP
package.
– Ground Loop Rejection for Reducing Crosstalk
The class-G headphone amplifier maximizes battery
• Fully Differential Mic Preamplifier With Variable
life by adjusting the supply voltage of the headphone
Gain and 3.4-µV Low Noise
amplifier based on audio signal level. With 8-µV
– Integrated AC-Coupling Capacitor
output noise at 0-dB gain and PSRR of 91 dB, the
– Ground Loop Rejection for Reducing
headphone amplifier provides excellent audio
Headphone to Mic Crosstalk
performance. DirectPath eliminates the need for DC-
blocking capacitors. The microphone preamplifier has
• Choice of Two Mic Bias Voltages: 2.0 V and 2.6 V
two programmable gains of 12 dB and 24 dB, and
– 92-dB PSRR
3.4 µV input referred noise.
– Integrated Programmable Mic Bias Resistor
The microphone bias voltage has two programmable
• Advanced Accessory Insertion, Removal, and
settings of 2 V and 2.6 V. The bias output drives up
Type Detection
to 1.2 mA of current, has a low output noise of 2 µV,
• Passive Multi-button Support Using 10-Bit SAR
and 92-dB PSRR, providing excellent rejection of
ADC power supply noise in wireless handsets.
– Implements Proprietary Scheme to Reduce
The advanced accessory detection algorithm
Error Caused by Audio Playback Signal in
automatically detects six supported accessories and
Presence of Finite Resistance on Headset
enables or disables internal components.
Ground Return Path
Device Information
(1)
• Integrated Level-4 IEC ESD Protection on Jack
PART NUMBER PACKAGE BODY SIZE (NOM)
Connected Pins (on EVM)
TPA6166A2 WSCP (25) 2.50 mm × 2.50 mm
• Ultra Low-Power Chip Shutdown Mode
(1) For all available packages, see the orderable addendum at
• I
2
C Interface
the end of the data sheet.
• Short-Circuit Protection
• 0.4-mm Pitch 25-Ball WCSP
Simplified Schematic
2 Applications
• Smart Phones and Wireless Handsets
• Portable Tablets
• Notebook PCs and Docking Stations
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPA6166A2
SLAS997B –MARCH 2014–REVISED JANUARY 2015
www.ti.com
Table of Contents
7.3 Feature Description................................................. 13
1 Features.................................................................. 1
7.4 Device Functional Modes........................................ 19
2 Applications ........................................................... 1
7.5 Register Maps......................................................... 23
3 Description ............................................................. 1
8 Application and Implementation ........................ 38
4 Revision History..................................................... 2
8.1 Application Information............................................ 38
5 Pin Configuration and Functions......................... 3
8.2 Typical Application .................................................. 38
6 Specifications......................................................... 4
9 Power Supply Recommendations...................... 40
6.1 Absolute Maximum Ratings ...................................... 4
9.1 Decoupling Capacitors............................................ 40
6.2 ESD Ratings.............................................................. 4
10 Layout................................................................... 41
6.3 Recommended Operating Conditions....................... 4
10.1 Layout Guidelines ................................................. 41
6.4 Thermal Information.................................................. 4
10.2 Layout Example .................................................... 42
6.5 Electrical Characteristics........................................... 5
11 Device and Documentation Support ................. 43
6.6 Electrical Characteristics, Audio Amplifiers............... 6
11.1 Development Support ........................................... 43
6.7 Electrical Characteristics, Mic Preamplifier and Bias 7
11.2 Trademarks........................................................... 43
6.8 Timing Requirements................................................ 8
11.3 Electrostatic Discharge Caution............................ 43
6.9 Typical Characteristics.............................................. 9
11.4 Glossary................................................................ 43
7 Detailed Description............................................ 13
12 Mechanical, Packaging, and Orderable
7.1 Overview ................................................................. 13
Information ........................................................... 43
7.2 Functional Block Diagram....................................... 13
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (June 2014) to Revision B Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Original (January 2014) to Revision A Page
• Changed to new data sheet format ........................................................................................................................................ 1
• Added specifications and application information ................................................................................................................. 1
• Changed status to Production Data ...................................................................................................................................... 1
2 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: TPA6166A2
A1 A2 A3 A4 A5
B1 B2 B3 B4 B5
C1 C2 C3 C4 C5
D1 D2 D3 D4 D5
E1 E2 E3 E4 E5
PGNDSDAC1N
GND1 INLINR
RING1
MICVDD
JACK_SENSE
PGND
CPVDD
CPVSS
NC*
MOUTP
GND2
MOUTN
GNDSCL
IRQ
NC*
C1P VDD RING2 SLEEVE
TIP
TPA6166A2
www.ti.com
SLAS997B –MARCH 2014 –REVISED JANUARY 2015
5 Pin Configuration and Functions
YFF Package
Top View
All NC pins should be left floating. Do not connect them to GND.
Pin Functions
PIN
I/O / TYPE DESCRIPTION
NAME NO.
GND1 A1 P Analog / digital ground 1
INR A2 I Headphone right channel input
INL A3 I Headphone left channel input
CPVDD A4 I Headphone charge-pump positive supply (internally generated). Connect a 1-µF capacitor
to ground.
JACK_SENSE A5 I/O Connect to headset jack terminal 5 (for mechanical switch). If mechanical switch is not
available, then this terminal can be kept floating.
NC (Floating) B1 O Leave floating (no connection)
GND2 B2 I Ground 2 - Connect to ground 1 on board.
IRQ B3 O Active low interrupt output
MOUTN B4 O Microphone preamplifier negative output
TIP B5 O Left headphone / line output. Connect to headset jack TIP (terminal 1).
CPVSS C1 I Headphone charge-pump negative supply (internally generated). Connect a 1-µF capacitor
to ground.
SCL C2 I I
2
C clock line
GND C3 I Connect to ground
MOUTP C4 O Microphone preamplifier positive output
RING1 C5 O Right headphone / line output. Connect to headset jack RING1 (terminal 2).
C1N D1 P Charge pump flying capacitor positive terminal
SDA D2 I/O I
2
C data line
PGND D3, E2 P Power ground
NC (Floating) D4 O Leave floating (no connection)
MICVDD D5 P Analog supply
C1P E1 P Charge pump flying capacitor negative terminal
VDD E3 P Analog / digital supply
RING2 E4 I/O Connect to headset jack RING2 (terminal 3)
SLEEVE E5 I/O Connect to headset jack SLEEVE (terminal 4)
Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: TPA6166A2
TPA6166A2
SLAS997B –MARCH 2014–REVISED JANUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating temperature range, T
A
= 25°C (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage, VDD –0.3 2 V
Microphone supply voltage, MICVDD –0.3 3.9 V
Output continuous total power dissipation See Thermal Information
Storage temperature, T
stg
–65 85 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22- ±500
C101
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN MAX UNIT
VDD Supply voltage 1.7 1.9 V
MICVDD Microphone supply voltage 2.4 3.6 V
T
A
Operating temperature –25 85 °C
Line Driver Application, R
L
= 10 kΩ, A
V
≥ 0 dB, specified by design 470 pF
Maximum load Line Driver Application, R
L
= 10 kΩ, A
V
≤ 0 dB, LO_EXT_STAB = 1, 470
C
L,Max
capacitance specified by design
Headphone Application, R
L
= 32 Ω, specified by design 200
T
J
Operating junction temperature –25 150 °C
6.4 Thermal Information
TPA6166A2
THERMAL METRIC
(1)
YFF (WSCP) UNIT
25 PINS
R
θJA
Junction-to-ambient thermal resistance 67
R
θJC(top)
Junction-to-case (top) thermal resistance 18
R
θJB
Junction-to-board thermal resistance 38 °C/W
ψ
JT
Junction-to-top characterization parameter 0.1
ψ
JB
Junction-to-board characterization parameter 36
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: TPA6166A2
TPA6166A2
www.ti.com
SLAS997B –MARCH 2014 –REVISED JANUARY 2015
6.5 Electrical Characteristics
VDD =00 1.8 V, MICVDD = 3.0 V, A
V
= 0 dB, C
IN
= 0.47 µF, C
FLY
= 1.0 μF, C
CPVDD
= C
CPVSS
= 1.0 μF, R
HP
= 32 Ω, outputs in
phase, T
A
= 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
IH
Input logic high SDA, SCL 1.4
V
IL
Input logic low SDA, SCL 0.4 V
V
OL
Output logic low IRQ I
OL
= 3 mA pullup current 0.2×VDD
Logic high input
|I
IH
| SDA, SCL 1
leakage current
Logic low input
|I
IL
| SDA, SCL 1 µA
leakage current
Logic high output
|I
OH
| IRQ V
IRQ
= 3.3 V 1
leakage current
I
VDD
2.38 mA
Audio playback (both
I
MICVDD
0.21 mA
channels), no signal into 32 Ω
P
CONS
(1)
4.91 mW
I
VDD
3.74 mA
Audio playback (both
channels), 100-µW output into I
MICVDD
0.21 mA
32 Ω
P
CONS
(1)
7.35 mW
I
VDD
2.36 mA
2-way call, no signal into 32 Ω I
MICVDD
0.96 mA
P
CONS
(1)
6.35 mW
I
VDD
3.68 mA
2-way call, 100-µW output into
Power consumption I
MICVDD
0.96 mA
32 Ω
P
CONS
(1)
8.74 mW
I
VDD
10.84 µA
Accessory not inserted I
MICVDD
1.05 µA
P
CONS
(1)
22.7 µW
I
VDD
150.9 µA
Accessory not inserted,
mechanical switch is open I
MICVDD
1.05 µA
(JACK_SENSE=1)
P
CONS
(1)
278.3 µW
I
VDD
108.1 µA
Accessory inserted and in sleep
I
MICVDD
1.06 µA
mode
P
CONS
(1)
197.8 µW
(1) Total power consumption from VDD and MICVDD.
Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: TPA6166A2
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