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CC1

CC2

PORT

VBUS_DET

OUT2

OUT1

VDD

DIR

GND

VBUS

Detection

VCONN

Power Rail

Controller

CURRENT_MODE

VCONN_FAULT

CC Logic

for Mode

Configuration

and Detection

Product

Folder

Order

Now

Technical

Documents

Tools &

Software

Support &

Community

本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确

性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLLSEO6

TUSB321

ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018

具具有有 VCONN 的的 TUSB321 USB Type-C™ 配配置置通通道道逻逻辑辑和和端端口口控控件件

1 特特性性

• USB Type-C™规范 1.1

• 向后兼容 USB Type-C 规范 1.0

• 通过专用电流模式引脚支持高达 3A 的电流通告

• 模式配置

– 仅主机 - 下行端口 (DFP)（供电设备）

– 仅设备 – 上行端口 (UFP)（受电设备）

– 双角色端口 – DRP

• 通道配置 (CC)

– USB 端口连接检测

– 电缆方向检测

– 角色检测

– Type-C 电流模式通告和检测（默认、中等和

高）

• V

BUS

检测

• 针对有源电缆提供 VCONN 支持

• 外部开关电缆检测与

方向控制

• 电源电压：4.5V 至 5.5V

• 低电流消耗

2 应应用用

• 主机、设备、双角色端口应用

• 移动电话

• 平板电脑和笔记本电脑

• USB 外设

3 说说明明

TUSB321 器件可在 USB Type-C 端口上实现 Type-C

生态系统所需的配置通道 (CC) 逻辑。TUSB321 器件

使用 CC 引脚来确定端口连接和分离、电缆方向、角

色检测以及对 Type-C 电流模式的端口控制。

TUSB321 器件可配置为下行端口 (DFP)、上行端口

(UFP) 或双角色端口 (DRP)，是各种应用的理想之

选。

根据 Type-C 规范，TUSB321 器件在配置为 DRP

时，会交替配置为 DFP 或 UFP。CC 逻辑块通过监视

CC1 和 CC2 引脚上的上拉或下拉电阻，以确定何时连

接了 USB 端口、电缆的方向以及检测到的角色。CC

逻辑根据检测到的角色来确定 Type-C 电流模式为默

认、中等还是高。该逻辑通过实施 V

BUS

检测来确定端

口在 UFP 和 DRP 模式下是否连接成功。

该器件能够在宽电源范围内工作，并且具有较低功耗。

器器件件信信息息

(1)

器器件件型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

TUSB321 X2QFN (12) 1.60mm x 1.60mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

空白

简简化化原原理理图图

示示例例应应用用

TUSB321

ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1

2 应应用用.......................................................................... 1

3 说说明明.......................................................................... 1

4 修修订订历历史史记记录录 ........................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics........................................... 5

6.6 Switching Characteristics.......................................... 6

7 Detailed Description.............................................. 8

7.1 Overview ................................................................... 8

7.2 Functional Block Diagram ......................................... 9

7.3 Feature Description................................................... 9

7.4 Device Functional Modes........................................ 11

8 Application and Implementation ........................ 13

8.1 Application Information............................................ 13

8.2 Typical Application .................................................. 13

8.3 Initialization Set Up ................................................ 17

9 Power Supply Recommendations...................... 17

10 Layout................................................................... 17

10.1 Layout Guidelines ................................................. 17

10.2 Layout Example .................................................... 17

11 器器件件和和文文档档支支持持 ..................................................... 18

11.1 接收文档更新通知 ................................................. 18

11.2 社区资源................................................................ 18

11.3 商标 ....................................................................... 18

11.4 静电放电警告......................................................... 18

11.5 术语表 ................................................................... 18

12 机机械械、、封封装装和和可可订订购购信信息息....................................... 18

4 修修订订历历史史记记录录

Changes from Revision B (September 2016) to Revision C Page

• 删除了

特性

“-40°C 至 85°C 的工业温度范围” .......................................................................................................................... 1

• 删除了

说明

中的“TUSB321 器件适用于工业和商业级温度范围。”文本.................................................................................. 1

• Changed pin VBUS_DET description From: 900-kΩ To: R

VBUS

in Pin Functions table. ........................................................ 3

• Changed R

VBUS

values From: MIN = 891, TYP = 900, MAX = 909 KΩ To: MIN = 855, TYP = 887, MAX = 920 KΩ ........... 6

• Changed resister value From: 900 kΩ To: To: R

VBUS

in Figure 3........................................................................................... 8

• Changed resister value From: 900 kΩ To: To: R

VBUS

in Functional Block Diagram............................................................... 9

• Changed From: The system V

BUS

voltage must be routed through a 900-kΩ resistor to the VBUS_DET pin .. To: The

system V

BUS

voltage must be routed through a R

VBUS

resistor to the VBUS_DET pin .. in the V

BUS

Detection................... 11

• Added resister R

VBUS

in Figure 4 .......................................................................................................................................... 14

• Added row for R

VBUS

to Table 4 ........................................................................................................................................... 15

• Changed From: must be connected through a 900-kΩ resistor to V

BUS

on the Type-C... To: must be connected

through a R

VBUS

resistor to V

BUS

on the Type-C .. in the Detailed Design Procedure.......................................................... 15

Changes from Revision A (June 2015) to Revision B Page

• Changed pins CC1 and CC2 values From: MIN = –0.3 MAX = V

+ 0.3 To: MIN –0.3 MAX = 6 in the Absolute

Maximum Ratings................................................................................................................................................................... 4

Changes from Original (June 2015) to Revision A Page

• 已更改器件状态从

产品预览

更改为

量产数据

....................................................................................................................... 1

CC1

7 8

CC2

CURRENT_MODE

PORT

VBUS_DET

OUT2OUT1

VCONN_FAULT

VDD

DIR

GND

TUSB321

www.ti.com.cn

ZHCSDT2C –JUNE 2015 –REVISED AUGUST 2018

5 Pin Configuration and Functions

RWB Package

12-Pin X2QFN

Top View

Pin Functions

TYPE DESCRIPTION

NAME NO.

CC1 1 I/O Type-C configuration channel signal 1

CC2 2 I/O Type-C configuration channel signal 2

CURRENT_MODE 3 I

Advertise VBUS current. This 3-level input is used to control current advertisement in DFP

mode or DRP mode connected as source. (See Table 2.)

L - Default Current. Pull-down to GND or leave unconnected.

M - Medium (1.5A) current. Pull-up to V

with 500-kΩ resistor.

H - High (3.0A) current. Pull-up to V

with 10-kΩ resistor.

PORT 4 I

Tri-level input pin to indicate port mode. The state of this pin is sampled when VDD is active.

H - DFP (Pull-up to V

if DFP mode is desired)

NC - DRP (Leave unconnected if DRP mode is desired)

L - UFP (Pull-down or tie to GND if UFP mode is desired)

VBUS_DET 5 I

5- to 28-V V

BUS

input voltage. V

BUS

detection determines UFP attachment. One R

VBUS

external resistor required between system V

BUS

and VBUS_DET pin.

VCONN_FAULT 6 O

Open-drain output and is asserted low for t

FAULT

when VCONN over-current fault is detected.

(See Figure 2.)

OUT1 7 I/O

This pin is an open drain output for communicating Type-C current mode detect when the

device is in UFP mode. Default current mode detected (H); medium or high current mode

detected (L). (See Table 2.)

OUT2 8 I/O

This pin is an open drain output for communicating Type-C current mode detect when the

device is in UFP mode: default or medium current mode detected (H); high current mode

detected (L). (See Table 2.)

ID 9 O

Open drain output; asserted low when the CC pins detect device attachment when port is a

source (DFP), or dual-role (DRP) acting as source (DFP).

GND 10 G Ground

DIR 11 O

DIR of plug. This open drain output indicates the detected plug orientation: Type-C plug

position 2 (H); Type-C plug position 1 (L).

VDD 12 P Positive supply voltage

TUSB321

ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018

www.ti.com.cn

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Supply voltage V

–0.3 6 V

Control pins

PORT, CURRENT_MODE, ID, DIR, VCONN_FAULT –0.3 V

+ 0.3

VCC1, CC2 –0.3 6

OUT1, OUT2 –0.3 V

+ 0.3

VBUS_DET –0.3 4

Storage temperature, T

stg

–65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±7000

Charged-device model (CDM), per JEDEC specification JESD22-

C101

(2)

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

Supply voltage range 4.5 5.5 V

BUS

System V

BUS

voltage 4 5 28 V

VBUS_DET VBUS_DET threshold voltage on the pin 4 V

VCONN Supply for active cable (With V

at 5 V) 4.75 5.5 V

Operating free air temperature range 0 25 70 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC

(1)

UNIT

RWB (X2QFN)

12 PINS

θJA

Junction-to-ambient thermal resistance 169.3 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 68.1 °C/W

θJB

Junction-to-board thermal resistance 83.4 °C/W

Junction-to-top characterization parameter 2.2 °C/W

Junction-to-board characterization parameter 83.4 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance N/A —

TUSB321

www.ti.com.cn

ZHCSDT2C –JUNE 2015 –REVISED AUGUST 2018

(1) V

must be 3.5 V or greater to advertise 3 A current.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST

CONDITIONS

MIN TYP MAX UNIT

Power Consumption

UNATTACHED_UFP

Current consumption in unattached mode when port is

unconnected and waiting for connection. (V

= 5 V, PORT

= L)

100 µA

ACTIVE_UFP

Current consumption in active mode. (V

= 5 V, PORT =

100 µA

CC1 and CC2 Pins

CC_D

Pulldown resistor when in UFP or DRP mode. 4.6 5.1 5.6 kΩ

TH_UFP_CC_USB

Voltage threshold for detecting a DFP attach when

configured as a UFP and DFP is advertising default current

source capability.

0.15 0.2 0.25 V

TH_UFP_CC_MED

Voltage threshold for detecting a DFP attach when

configured as a UFP and DFP is advertising medium (1.5

A) current source capability.

0.61 0.66 0.7 V

TH_UFP_CC_HIGH

Voltage threshold for detecting a DFP attach when

configured as a UFP and DFP is advertising high (3 A)

current source capability.

1.169 1.23 1.29 V

TH_DFP_CC_USB

Voltage threshold for detecting a UFP attach when

configured as a DFP and advertising default current source

capability.

1.51 1.6 1.64 V

TH_DFP_CC_MED

Voltage threshold for detecting a UFP attach when

configured as a DFP and advertising medium current (1.5

A) source capability.

1.51 1.6 1.64 V

TH_DFP_CC_HIGH

Voltage threshold for detecting a UFP attach when

configured as a DFP and advertising high current (3.0 A)

source capability.

2.46 2.6 2.74 V

TH_AC_CC_USB

Voltage threshold for detecting a active cable attach when

configured as a DFP and advertising default current

source.

0.15 0.20 0.25 V

TH_AC_CC_MED

Voltage threshold for detecting a active cable attach when

configured as a DFP and advertising medium current (1.5

A) source.

0.35 0.40 0.45 V

TH_AC_CC_HIGH

Voltage threshold for detecting a active cable attach when

configured as a DFP and advertising high current (3.0 A)

source.

0.76 0.80 0.84 V

CC_DEFAULT_P

Default mode pullup current source when operating in DFP

or DRP mode.

64 80 96 µA

CC_MED_P

Medium (1.5 A) mode pullup current source when

operating in DFP or DRP mode.

166 180 194 µA

CC_HIGH_P

High (3 A) mode pullup current source when operating in

DFP or DRP mode.

(1)

304 330 356 µA

Control Pins: PORT, CURRENT_MODE, VCONN_FAULT, DIR, ID, OUT1, OUT2

Low-level control signal input voltage, (PORT,

CURRENT_MODE)

0.4 V

Mid-level control signal input voltage (PORT,

CURRENT_MODE)

0.28 × V

0.56 × V

High-level control signal input voltage (PORT,

CURRENT_MODE)

- 0.3 V

High-level input current –20 20 µA

Low-level input current –10 10 µA

Internal pullup resistance (PORT) 588 kΩ

Internal pulldown resistance (PORT) 1.1 MΩ

PD_CUR

Internal pulldown resistance for CURRENT_MODE pin 275 kΩ

Low-level signal output voltage (open-drain)

(VCONN_FAULT, ID, OUT1, OUT2)

= –1.6 mA 0.4 V

p_ODext

External pullup resistor on open drain IOs

(VCONN_FAULT, ID, OUT1, OUT2)

200 kΩ

p_TLext

Tri-level input external pull-up resistor (PORT) 4.7 kΩ

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