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TI-TUSB320.pdf
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本文介绍了Texas Instruments公司的TUSB320产品,该产品是一种USB Type-C控制器,可用于检测和配置USB Type-C模式。该控制器具有CC1、CC2、GPIO和VBUS检测功能,并支持I2C通信协议。此外,该产品还提供了VDD和GND控制功能,以及VBUS检测和配置功能。本文还提供了产品的技术文档、工具和软件支持,以及社区支持。重要提示:本文末尾有重要通知。
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLLSEN9
TUSB320
,
TUSB320I
ZHCSDU0E –MAY 2015–REVISED MAY 2017
TUSB320 USB Type-C™配配置置通通道道逻逻辑辑和和端端口口控控制制
1
1 特特性性
1
• USB Type-C™规范 1.1
• 向后兼容 USB Type-C 规范 1.0
• 支持高达 3A 的电流通告和检测
• 模式配置
– 仅主机 - 下行端口 (DFP)(供电设备)
– 仅设备 – 上行端口 (UFP)(受电设备)
– 双角色端口 – DRP
• 通道配置 (CC)
– USB 端口连接检测
– 电缆方向检测
– 角色检测
– Type-C 电流模式(默认、中等和高)
• V
BUS
检测
• I
2
C 或 GPIO 控制
• 通过 I
2
C 实现角色配置控制
• 电源电压:2.7V 至 5V
• 低电流消耗
• 工业温度范围:–40°C 至 85°C
2 应应用用
• 主机、设备、双角色端口 应用
• 移动电话
• 平板电脑和笔记本电脑
• USB 外设
3 说说明明
TUSB320 器件可在 USB Type-C 端口上实现 Type-C
生态系统所需的配置通道 (CC) 逻辑。TUSB320 器件
使用 CC 引脚来确定端口的连接状态和电缆方向,以
及进行角色检测和 Type-C 电流模式控制。TUSB320
器件可配置为下行端口 (DFP)、上行端口 (UFP) 或双
角色端口 (DRP),因此成为任何应用的理想选择。
根据 Type-C 规范,TUSB320 器件会交替配置为 DFP
或 UFP。CC 逻辑块通过监视 CC1 和 CC2 引脚上的
上拉或下拉电阻,以确定何时连接了 USB 端口、电缆
的方向以及检测到的角色。CC 逻辑根据检测到的角色
来确定 Type-C 电流模式为默认、中等还是高。该逻辑
通过实施 V
BUS
检测来确定端口在 UFP 和 DRP 模式
下是否连接成功。
该器件能够在宽电源范围内工作,并且具有较低功耗。
TUSB320 器件适用于工业级和商业级温度范围。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
TUSB320 X2QFN (12) 1.60mm x 1.60mm
TUSB320I X2QFN (12) 1.60mm x 1.60mm
(1) 要了解所有可用封装,请参见数据表末尾的可订购产品附录。
空白
简简化化原原理理图图
示示例例 应应用用

2
TUSB320
,
TUSB320I
ZHCSDU0E –MAY 2015–REVISED MAY 2017
www.ti.com.cn
版权 © 2015–2017, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Timing Requirements................................................ 7
6.7 Switching Characteristics.......................................... 7
7 Detailed Description.............................................. 9
7.1 Overview ................................................................... 9
7.2 Feature Description................................................. 10
7.3 Device Functional Modes........................................ 13
7.4 Programming........................................................... 15
7.5 Register Maps......................................................... 16
8 Application and Implementation ........................ 19
8.1 Application Information............................................ 19
8.2 Typical Application .................................................. 21
8.3 Initialization Set Up ................................................ 27
9 Power Supply Recommendations...................... 27
10 Layout................................................................... 27
10.1 Layout Guidelines ................................................. 27
10.2 Layout Example .................................................... 27
11 器器件件和和文文档档支支持持 ..................................................... 28
11.1 相关链接................................................................ 28
11.2 接收文档更新通知 ................................................. 28
11.3 社区资源................................................................ 28
11.4 商标 ....................................................................... 28
11.5 静电放电警告......................................................... 28
11.6 Glossary................................................................ 28
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 28
4 修修订订历历史史记记录录
Changes from Revision D (October 2016) to Revision E Page
• Changed R
VBUS
values From: MIN = 891, TYP = 900, MAX = 909 KΩ To: MIN = 855, TYP = 887, MAX = 920 KΩ ........... 7
Changes from Revision C (September 2016) to Revision D Page
• Changed text for Pin 7 in the Pin Functions table From: "default current mode detected (H); medium or high current
mode detected (L)." To: "Refer to Table 3 for more details." ................................................................................................. 4
• Changed text for Pin 8 in the Pin Functions table From: "default or medium current mode detected (H); high current
mode detected (L)." To: "Refer to Table 3 for more details." ................................................................................................. 4
Changes from Revision B (March 2016) to Revision C Page
• Changed pins CC1 and CC2 values From: MIN = –0.3 MAX = V
DD
+ 0.3 To: MIN –0.3 MAX = 6 in the Absolute
Maximum Ratings................................................................................................................................................................... 5
Changes from Revision A (June 2015) to Revision B Page
• Added Note 1 and 2 to the Pin Functions table...................................................................................................................... 4
• Changed the DESCRIPTION of pin EN_N pin in the Pin Functions table ............................................................................. 4
• Changed the DESCRIPTION of pin V
DD
in the Pin Functions table ....................................................................................... 4
• Changed the MIN, TYP, and MAX values for V
TH_UFP_CC_USB
, V
TH_UFP_CC_MED
, and V
TH_UFP_CC_HIGH
in the Electrical
Characteristics table. .............................................................................................................................................................. 6
• Added Note 2 to the Electrical Characteristics table ............................................................................................................. 6
• Added Test Condition "See Figure 1" to V
BUS_THR
in the Electrical Characteristics .............................................................. 7
• Updated Timing Requirements table with new values. .......................................................................................................... 7
• Added Data hold time, Data valid time, Data valid acknowledge time, and C
bus_400kHz
values to Timing Requirements
table........................................................................................................................................................................................ 7
• Changed the Switching Characteristics table ........................................................................................................................ 7
• Added Note: "SW must make sure..." to the Description of INTERRUPT_STATUS in Table 7 ......................................... 17

3
TUSB320
,
TUSB320I
www.ti.com.cn
ZHCSDU0E –MAY 2015–REVISED MAY 2017
Copyright © 2015–2017, Texas Instruments Incorporated
• Added text to list item 2 in the Initialization Set Up section.................................................................................................. 27
Changes from Original (May 2015) to Revision A Page
• 已更改 TUSB320 的器件状态,从
产品预览
更改为
量产数据
................................................................................................... 1

CC2
CC1
GND
SCL/OUT2
SDA/OUT1
87
2 1
VBUS_DET 4 11 EN_N
PORT VDD3 12
ADDR 5 10
ID6 9INT_N/OUT3
4
TUSB320
,
TUSB320I
ZHCSDU0E –MAY 2015–REVISED MAY 2017
www.ti.com.cn
Copyright © 2015–2017, Texas Instruments Incorporated
(1) When V
DD
is off, the TUSB320 non-failsafe pins (VBUS_DET, ADDR, PORT, ID, OUT[3:1] pins) could back-drive the TUSB320 device if
not handled properly. When necessary to pull these pins up, it is recommended to pullup PORT, ADDR, INT_N/OUT3, and ID to the
device V
DD
supply. The VBUS_DET must be pulled up to VBUS through a 900-kΩ resistor.
(2) When using the 3.3 V supply for I
2
C, the end user must ensure that the V
DD
is 3 V and above. Otherwise the I
2
C may back power the
device.
5 Pin Configuration and Functions
RWB Package
12-Pin X2QFN
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
CC1 1 I/O Type-C configuration channel signal 1
CC2 2 I/O Type-C configuration channel signal 2
PORT
(1)
3 I
Tri-level input pin to indicate port mode. The state of this pin is sampled when EN_N is asserted low and VDD
is active. This pin is also sampled following a I2C_SOFT_RESET.
H - DFP (Pull-up to V
DD
if DFP mode is desired)
NC - DRP (Leave unconnected if DRP mode is desired)
L - UFP (Pull-down or tie to GND if UFP mode is desired)
VBUS_DET
(1)
4 I
5- to 28-V V
BUS
input voltage. V
BUS
detection determines UFP attachment. One 900-kΩ external resistor
required between system V
BUS
and VBUS_DET pin.
ADDR
(1)
5 I
Tri-level input pin to indicate I
2
C address or GPIO mode:
H - I
2
C is enabled and I
2
C 7-bit address is 0x61.
NC - GPIO mode (I
2
C is disabled)
L - I
2
C is enabled and I
2
C 7-bit address is 0x60.
ADDR pin should be pulled up to V
DD
if high configuration is desired
INT_N/OUT3
(1)
6 O
The INT_N/OUT3 is a dual-function pin. When used as the INT_N, the pin is an open drain output in I
2
C control
mode and is an active low interrupt signal for indicating changes in I
2
C registers. When used as OUT3, the pin
is in audio accessory detect in GPIO mode: no detection (H), audio accessory connection detected (L).
SDA/OUT1
(1)(2)
7 I/O
The SDA/OUT1 is a dual-function pin. When I
2
C is enabled (ADDR pin is high or low), this pin is the I
2
C
communication data signal. When in GPIO mode (ADDR pin is NC), this pin is an open drain output for
communicating Type-C current mode detect when the TUSB320 device is in UFP mode: Refer to Table 3 for
more details.
SCL/OUT2
(1)(2)
8 I/O
The SCL/OUT2 is a dual function pin. When I
2
C is enabled (ADDR pin is high or low), this pin is the I
2
C
communication clock signal. When in GPIO mode (ADDR pin is NC), this pin is an open drain output for
communicating Type-C current mode detect when the TUSB320 device is in UFP mode: Refer to Table 3 for
more details.
ID
(1)
9 O
Open drain output; asserted low when the CC pins detect device attachment when port is a source (DFP), or
dual-role (DRP) acting as source (DFP).
GND 10 G Ground
EN_N 11 I
Enable signal; active low. Pulled up to V
DD
internally to disable the TUSB320 device. If controlled externally,
must be held high at least for 50 ms after V
DD
has reached its valid voltage level.
V
DD
12 P Positive supply voltage. V
DD
must ramp within 25 ms or less

5
TUSB320
,
TUSB320I
www.ti.com.cn
ZHCSDU0E –MAY 2015–REVISED MAY 2017
Copyright © 2015–2017, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage V
DD
–0.3 6 V
Control pins
PORT, ADDR, ID, EN_N, INT_N/OUT3 –0.3 V
DD
+ 0.3
V
CC1, CC2 –0.3 6
SDA/OUT1, SCL/OUT2 –0.3 V
DD
+ 0.3
VBUS_DET –0.3 4
Storage temperature, T
stg
–65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±7000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(2)
±1500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
DD
Supply voltage range 2.7 5 V
V
BUS
System V
BUS
voltage 4 5 28 V
VBUS_DET VBUS_DET threshold voltage on the pin 4 V
T
A
TUSB320I Operating free air temperature range –40 25 85 °C
TUSB320 Operating free air temperature range 0 25 70 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC
(1)
TUSB320
UNITRWB (X2QFN)
12 PINS
R
θJA
Junction-to-ambient thermal resistance 169.3 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 68.1 °C/W
R
θJB
Junction-to-board thermal resistance 83.4 °C/W
ψ
JT
Junction-to-top characterization parameter 2.2 °C/W
ψ
JB
Junction-to-board characterization parameter 83.4 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A
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