MAX232芯片数据表资源-CSDN文库

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这个文件是 Texas Instruments 的 MAX232 数据表。MAX232 是一款双驱动器/接收器，包含一个电容电压发生器，可以从单个 5V 电源提供 TIA/EIA-232-F 电压级别。每个接收器将 TIA/EIA-232-F 输入转换为 5V TTL/CMOS 级别。这些接收器的典型阈值为 1.3V，典型迟滞为 0.5V，并且可以接受 ±30V 的输入。每个驱动器将 TTL/CMOS 输入级别转换为 TIA/EIA-232-F 级别。这款设备主要应用于： TIA/EIA-232-F 电池供电系统终端调制解调器计算机在设计使用时，需要添加一些外部电容以确保其正常工作。 MAX232是一款由Texas Instruments制造的集成电路，主要用于实现TIA/EIA-232-F标准的电平转换。该芯片包含两个驱动器和两个接收器，能够在单个5V电源下工作，满足EIA-232-F通信标准的要求。MAX232的核心特性在于其内置的电容电压发生器，它可以生成符合TIA/EIA-232-F规范的电压级别，无需额外的电源。在功能方面，MAX232的每个接收器能够将TIA/EIA-232-F标准的高电压电平转换为5V TTL/CMOS兼容的低电压信号。这些接收器具有1.3V的典型阈值电压和0.5V的典型迟滞，能够处理±30V的输入电压，确保了在宽电压范围内的稳定工作。另一方面，驱动器则负责将TTL/CMOS级别的信号转换回TIA/EIA-232-F标准的高电压电平，以供远程通信或接口设备使用。在应用上，MAX232广泛用于电池供电的系统、终端、调制解调器以及计算机等设备。由于EIA-232标准常用于长距离通信，因此在需要将TTL/CMOS逻辑电平转换为适合长距离传输的TIA/EIA-232-F电平时，MAX232是理想的解决方案。在实际使用中，为了确保MAX232的正常运行，需要添加外部电容。数据表中提到，使用1.0-μF的电容可以支持单个5V电源操作。此外，还有一种升级版的MAX202，它提供了更佳的静电放电（ESD）保护，达到了15kV的人体模型（HBM）等级，并且只需要0.1-μF的电容。封装信息显示，MAX232有多种封装形式，包括SOIC（16引脚）、PDIP（16引脚）、SOP（16引脚），尺寸各异，以适应不同的电路板布局需求。 MAX232是一款高性能的电平转换芯片，能够方便地在TTL/CMOS逻辑和TIA/EIA-232-F通信标准之间进行转换，适用于各种需要长距离通信或接口电平转换的场景。在设计使用时，需注意选择适当的封装，并正确配置外部电容以确保其功能的完整实现。对于学习和理解MAX232的工作原理和应用，深入阅读数据表是至关重要的。

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TIN

ROUT

2 2

TOUT

RS232

RIN

RS232

POWER

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

MAX232, MAX232I

SLLS047M –FEBRUARY 1989–REVISED NOVEMBER 2014

MAX232x Dual EIA-232 Drivers/Receivers

1 Features

• Meets or Exceeds TIA/EIA-232-F and ITU

Recommendation V.28

• Operates From a Single 5-V Power Supply With

1.0-µF Charge-Pump Capacitors

• Operates up to 120 kbit/s

• Two Drivers and Two Receivers

• ±30-V Input Levels

• Low Supply Current: 8 mA Typical

• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

• Upgrade With Improved ESD (15-kV HBM) and

0.1-µF Charge-Pump Capacitors is Available With

the MAX202 Device

2 Applications

• TIA/EIA-232-F

• Battery-Powered Systems

• Terminals

• Modems

• Computers

3 Description

The MAX232 device is a dual driver/receiver that

includes a capacitive voltage generator to supply

TIA/EIA-232-F voltage levels from a single 5-V

supply. Each receiver converts TIA/EIA-232-F inputs

to 5-V TTL/CMOS levels. These receivers have a

typical threshold of 1.3 V, a typical hysteresis of 0.5

V, and can accept ±30-V inputs. Each driver converts

TTL/CMOS input levels into TIA/EIA-232-F levels.

Device Information

(1)

ORDER NUMBER PACKAGE (PIN) BODY SIZE

MAX232x

SOIC (16) 9.90 mm × 3.91 mm

SOIC (16) 10.30 mm × 7.50 mm

PDIP (16) 19.30 mm × 6.35 mm

SOP (16) 10.3 mm × 5.30 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

4 Simplified Schematic

MAX232, MAX232I

SLLS047M –FEBRUARY 1989–REVISED NOVEMBER 2014

www.ti.com

Product Folder Links: MAX232

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Simplified Schematic............................................. 1

5 Revision History..................................................... 2

6 Pin Configuration and Functions......................... 3

7 Specifications......................................................... 4

7.1 Absolute Maximum Ratings ..................................... 4

7.2 Handling Ratings....................................................... 4

7.3 Recommended Operating Conditions ...................... 4

7.4 Thermal Information.................................................. 4

7.5 Electrical Characteristics –– Device ......................... 4

7.6 Electrical Characteristics –– Driver........................... 5

7.7 Electrical Characteristics –– Receiver ..................... 5

7.8 Switching Characteristics ......................................... 5

7.9 Typical Characteristics.............................................. 6

8 Parameter Measurement Information .................. 7

9 Detailed Description.............................................. 9

9.1 Overview ................................................................... 9

9.2 Functional Block Diagram ......................................... 9

9.3 Feature Description................................................... 9

9.4 Device Functional Modes.......................................... 9

10 Application and Implementation........................ 10

10.1 Application Information.......................................... 10

10.2 Typical Application ................................................ 10

11 Power Supply Recommendations ..................... 11

12 Layout................................................................... 11

12.1 Layout Guidelines ................................................. 11

12.2 Layout Example .................................................... 11

13 Device and Documentation Support ................. 12

13.1 Related Links ........................................................ 12

13.2 Trademarks........................................................... 12

13.3 Electrostatic Discharge Caution............................ 12

13.4 Glossary................................................................ 12

14 Mechanical, Packaging, and Orderable

Information ........................................................... 12

5 Revision History

Changes from Revision L (March 2004) to Revision M Page

• Removed Ordering Information table. .................................................................................................................................... 1

• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1

• Moved T

stg

to Handling Ratings table. .................................................................................................................................... 4

MAX232, MAX232I

SLLS047M –FEBRUARY 1989–REVISED NOVEMBER 2014

www.ti.com

Product Folder Links: MAX232

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to network GND.

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

Input Supply voltage range

(2)

–0.3 6 V

S+

Positive output supply voltage range V

– 0.3 15 V

S–

Negative output supply voltage range –0.3 –15 V

Input voltage range

T1IN, T2IN –0.3 V

+ 0.3

R1IN, R2IN ±30

Output voltage range

T1OUT, T2OUT V

S–

– 0.3 V

S+

+ 0.3

R1OUT, R2OUT –0.3 V

+ 0.3

Short-circuit duration T1OUT, T2OUT Unlimited

Operating virtual junction temperature 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 Handling Ratings

MIN MAX UNIT

stg

Storage temperature range -65 150 °C

(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

pins

(1)

0 2000

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins

(2)

0 1000

7.3 Recommended Operating Conditions

MIN NOM MAX UNIT

Supply voltage 4.5 5 5.5 V

High-level input voltage (T1IN,T2IN) 2 V

Low-level input voltage (T1IN, T2IN) 0.8 V

R1IN,

R2IN

Receiver input voltage ±30 V

Operating free-air temperature

MAX232 0 70

°C

MAX232I –40 85

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

7.4 Thermal Information

THERMAL METRIC

(1)

MAX232xD MAX232xDW MAX232xN MAX232xNS

UNITSOIC SOIC wide PDIP SOP

16 PINS 16 PINS 16 PINS 16 PINS

θJA

Junction-to-ambient thermal resistance 73 57 67 64 °C/W

(1) Test conditions are C1–C4 = 1 μF at V

= 5 V ± 0.5 V

(2) All typical values are at V

= 5 V, and T

= 25°C.

7.5 Electrical Characteristics –– Device

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)

PARAMETER TEST CONDITIONS

(1)

MIN TYP

(2)

MAX UNIT

Supply current V

= 5.5V, all outputs open, T

= 25°C 8 10 mA

MAX232, MAX232I

www.ti.com

SLLS047M –FEBRUARY 1989–REVISED NOVEMBER 2014

Product Folder Links: MAX232

(1) Test conditions are C1–C4 = 1 μF at V

= 5 V ± 0.5 V

(2) All typical values are at V

= 5 V, T

= 25°C.

(3) The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic

voltage levels only.

(4) Not more than one output should be shorted at a time.

7.6 Electrical Characteristics –– Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER TEST CONDITIONS

(1)

MIN TYP

(2)

MAX UNIT

High-level output voltage T1OUT, T2OUT R

= 3 kΩ to GND 5 7 V

Low-level output voltage

(3)

T1OUT, T2OUT R

= 3 kΩ to GND –7 –5 V

Output resistance T1OUT, T2OUT V

S+

= V

S–

= 0, V

= ±2 V 300 Ω

(4)

Short-circuit output current T1OUT, T2OUT V

= 5.5 V, V

= 0 V ±10 mA

Short-circuit input current T1IN, T2IN V

= 0 200 µA

(1) Test conditions are C1–C4 = 1 μF at V

= 5 V ± 0.5 V.

(2) All typical values are at V

= 5 V, T

= 25°C.

(3) The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic

voltage levels only.

7.7 Electrical Characteristics –– Receiver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER TEST CONDITIONS

(1)

MIN TYP

(2)

MAX UNIT

High-level output voltage R1OUT, R2OUT I

= –1 mA 3.5 V

Low-level output voltage

(3)

R1OUT, R2OUT I

= 3.2 mA 0.4 V

IT+

Receiver positive-going input threshold

voltage

R1IN, R2IN V

= 5 V, T

= 25°C 1.7 2.4 V

IT–

Receiver negative-going input threshold

voltage

R1IN, R2IN V

= 5 V, T

= 25°C 0.8 1.2 V

hys

Input hysteresis voltage R1IN, R2IN V

= 5 V 0.2 0.5 1 V

Receiver input resistance R1IN, R2IN V

= 5 V, T

= 25°C 3 5 7 kΩ

(1) Test conditions are C1–C4 = 1 μF at V

= 5 V ± 0.5 V.

7.8 Switching Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER TEST CONDITIONS

(1)

MIN TYP

(1)

MAX UNIT

SR Driver slew rate RL = 3 kΩ to 7 kΩ, see Figure 4 30 V/μs

SR(t) Driver transition region slew rate see Figure 5 3 V/μs

Data rate One TOUT switching 120 kbit/s

PLH®)

Receiver propagation delay time,

low- to high-level output

TTL load, see Figure 3 500 ns

PHL®)

Receiver propagation delay time,

high- to low-level output

TTL load, see Figure 3 500 ns

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