ViaWizard3.0
UserManual
Currentasof7/7/09
Contents
ViaWizard3.0.......................................................................................................................................1
UserManual............................................................................................................................... .......... 1
Currentasof6/8/09....................................................................................................................1
1.RevisionHistory.......................................................................................................................3
2.Introduction.............................................................................................................................4
2.aQuickstartInstructions......................................................................................................4
2.bBasicProgramOperation..................................................................................................4
3.GUIParameterDescription.....................................................................................................5
3.aStackup..............................................................................................................................5
2.bPadstacks...........................................................................................................................6
2.cVias.........................................................................................................................................7
2.dOptions..............................................................................................................................9
2.eButtons
CommontoAllTabs...........................................................................................10
3.DesignConventions...................................................................Error!Bookmarknotdefined.
4.ViaDesigns.............................................................................................................................12
5.AdvancedUsage........................................................................Error!Bookmarknotdefined.
5.aTechniques...........................................................................Error!Bookmarknotdefined.
5.bIncludedVariables...............................................................Error!Bookmarknotdefined.
5.cUninstalling..........................................................................Error!Bookmarknotdefined.
6.
KnownIssues.............................................................................Error!Bookmarknotdefined.
7.FutureImprovements................................................................Error!Bookmarknotdefined.
1. Revision History
Many edits have been made to the wizard functionality since version 2.0. The latest
wizard has been tested and optimized for HFSS v12. The manual has been updated to
reflect the new usage. Some of the major edits are listed below:
• Automatically disable/re-enable autosave
• Handle units other than mils
• Options for sweep setup
• Changed Input file format
• Additional port scenarios
• Removed some unnecessary parameters
• Fixed issue with GSSG stackup
• Allow 100% via fill
• Allow faceted structures
• Fixed issue with top/bot planes needing to be solid
• Updated solution settings for HFSS v12
• Add variable to control all antipads per via
• Added ability to change material properties
• Using frequency dependent Dielectric models
• Fixed overall project sizing issues
• Fixed coax sheath size issues
• Coax sheath is now grounded automatically
• Added GUI options for backdrilling
• Added options for automatically deembedding
• Added option for circular anitpads on differential vias
• Added options for mesh operations
• Added option to use a single block of dielectric
• Greyed out don’t care fields of via array inputs
• Added graphics for padstack cross-section
• Added graphics for via array footprint.
2. Introduction
The Via Wizard has been developed to simplify project creation in HFSS v12. Using a
straight-forward GUI, a user can enter all parameters necessary to create an arbitrary via
array. Most projects will be launched ready to solve in HFSS however the user may
easily modify or add to the geometry created by the wizard. Many variable parameters
have been added to the project so the user can easily perform parametric analysis. Please
refer to the ‘Examples’ folder in the Via Wizard installation directory for some saved
examples of common setups.
Although every effort has been made to ensure accurate projects, the user should verify
everything is setup as intended. The Via Wizard is available free of change and may be
distributed without a license. Updates will be made available as appropriate and may be
downloaded from 3DViaDesign.com or Ansoft.com/ots.
2.a Quickstart Instructions
1. Launch “Via Wizard GUI.exe.”
2. Fill in the desired information for each of the tabs: Stackup, Padstack, Via,
Options.
3. Click “Generate Project.”
4. Typical Via projects are now ready to solve.
2.b Basic Program Operation
The Via Wizard consists of two parts: The “Via Wizard GUI.exe” and
“HFSS_via_wizard.exe.” The GUI will accept user inputs that describe everything
necessary to create an arbitrary via array. After all of the information has been entered,
the GUI will generate a text file called “TempFile.txt” that is input into
HFSS_via_wizard.exe.” This program will then parse the data and generate a VBscript
called “HFSS.vbs” that can be read directly into HFSS. Please refer to the
“TempFile_format_3.0.xls” for information on the temp file format.
3. GUI Parameter Description
There are three tabs for the GUI used to describe all parameters necessary for the via
array. Each of the input parameters is described below:
3.a Stackup
The default project contains 4 Layers. Additional layers can be added to the bottom of the
stackup using the ADD button on the right. Bottom layers can be removed using the
Delete button on the right.
Type describes the layer type for the stackup. The stackup always alternates between
Metal and Dielectric. The top and bottom layers are always Metal
Material describes the material properties that will be used in HFSS. By default Copper
is used for Metal layers and FR4 is used for Dielectric layers. To change the material on a
particular layer, select it from the pull down menu. Different dielectrics can be added to
the pull down menu by using the substrate editor to the right
Thickness describes the layer thickness in mils. The default stackup uses 1-oz copper
with 5 mil dielectric.
Layer Type describes which layers are signals and which layers contain planes. To
change the type, select it from the pull down menu. A valid project must contain at least
one plane.
Substrate Editor is used to add and edit dielectric materials. User specifies Er, TanD
and measurement frequency. When The HFSS model is created a frequency dependent
Djordjevic-Sarkar dielectric model will be added to the project using the Er and TanD as
a name