论文研究-A Constructal H Shaped Power Distribution Network for EBG Structure Power Plane.pdf

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基于构形H-形电源分配网络的EBG结构电源板,刘诗韵,邓良勇,本文设计了基于构形H-形电源分配网络的EBG结构电源板,该结构具有优越的直流性能。一方面EBG结构可以抑制同步开关噪声,另一方面H-��
国武技论文在线 http:/www.paper.edu.cn Ho/Lo and setting it to zero, the minimized resistance ro and corresponding ho/lo can be obtained (凡)n-05(70,9) (,1L)=2[(7,%订 And the minimized voltage drop is JHO JHOLo H △Vn MT20,D802第 That means when the shape of this plane is determined according to Ey. (5), the vollage drop of this plane is minimal Assemble numbers (ni of elemental cells"on both sides of a new high conductivity path DI 80 such that thc elemental DC is conducted by the ncw path( shown in Fig. 1(b). Thc outcr boundary of this area is electric insulation except the source point Mo(0, 0). By the same method as used in constructing elemental cell, the optimal resistance and peak voltage drop are obtained Da2V,/dx2+,J,=0 ,!a 0,Vn()=V1(,0) The minimized voltage drop and resistance are △…=0.5JH (Rm=(52)(,4) (8) The corresponding geometric parameters are (D/D)=1/2(n,/,) (H1/L) )-2L/ The constructal 1 ordcr assembly is shown in Fig. 2(a)according to rcsults( 8) and(9) Fig. I(c)shows a 2nd order assembly, which is composed of a large number(n2) of lst order 00 assemblies aligned on both sides of a path of width d,. Following the steps from Ey (7)to(9),we can easily obtain that N2=2. This value is small. For reducing area of metal paths, the D2 path needn't extent all the way across the large square The optimal structure of the 2 order assembly is shown in Fig. 2(b). The constructing mcthod must be diffcrent D D H 95 (a) (b) Fig. 2 The constructal power distribution network assemblies. (a) The optimal 1 assembly. (b)The assen when N2 opt =2.(c)The optimal 3 ordcr asscmblics(d)Thc optimal 4th ordcr asscmblics 3 山国科技论文在线 http:/www.paper.edu.cn The voltage drop in Fig. 2(b)is the sum of A Vp2 and AVI.min. A Vp2 is the voltage drop between point M2 and M21 along the path. The voltage drop and resistance of second assembly in Fig 2(b)arc A=△m+△F2=i(2n)+1(2mD -△(从A)=5x(,)-(423- When dr-2/3m2, the minimized voltage drop and resistance will be obtained A五2m=0.75/2/ 2/8(,) H2/L2=√ 105 D2/D=2V2 Other structures ("i order assembly",i>2)can be calculated in the same method as the above The optimal geometric dimensions of each order are √on/o9 H (-1)/2 /0o Ah 之 L H =91+22 (12) l10 Obviously, D;+1/D=2 and H /L=v2 when i>2. In accordance with Eq (6), (8)and(11), AVi has a factor JHo /oo, we define that △1=V2JH3/lo (13) The minimized voltage drop and resistance can be obtained by a recursion formula A=m=D1+05m1E/() mn=232 (q,A) (14) 115 The optimized"3rd order assembly" and"4th order assembly are shown in Fig. 2(c, d). The minimized voltage drops, resistances, and the corresponding optimal geometric parameters for o to the 4th constructs arc shown in Tab. 1.Thc optimal resistance Ri and voltage drop as function of the i for the e ah order assemblies? are in Fig. 3 Tab. 1 120 Voltage Drops, Resistances, and the Corresponding Optimal Configuration Parameters for The i Assemblies H1/L; D/D R 0.250JH 0.5000 0 2C4 0.50JH 0.707/(79) ojHa 22 0.530/(09) H/a, 0390(04) 4 山国科技论文在线 http:/www.paper.edu.cn 1.6041JH63/o 0.284/(0,) 420 0.5 i, opt 0.8 3 0 0 0. 642 00 05101520 Fig3 The minimized resistance of" order assmebly 12 Important conclusions arc made the ith assembly is asscmbled by two(i-1)th assemblies for optimal resistance: the optimal aspect ratios(HI L)pi=v2. the resistance decreases when i increases. Also from the figures, we know that op o is a key factor. When il, the larger op o, the smaller resistance and voltage drop The objective in this section is to form an EBG power plane based on the 2nd order assembly network. Let op /0090 Fig 4(a)is the 2nd order H shaped network. do=0.065. According to eq (11), size of the 2nd order assembly in Fig 4(a) is 44.1mmx606mm, Do=0.87mm, D1=2. 1mm and D2=5.9mm Fig 4(c)is the designed eBG power plane by assembling the eBg units to the 135 network. The plane is applied on a two layer Fr-4 PCB structure with thickness 0. 8 mm. Fig. 5(a) is the ebg power plane without network and Fig. 5(b)is a referent solid plane. They are used for performances comparison 0.87mm Sou 44.lmm Fig 4 Developed power plane construction. (a)The 2 order II shaped network. (b)The EBGi unit (c) The 2 order plane 国武技论文在线 http:/www.paper.edu.cn (52.5mm, 17.5mm)Port Port2 (3.5mm,175mm (a) 145 Fig 5 Another two power planes for comparison.(a) EBG power plane without network. (b) The referent solid plan Fig 6(a),(b)and(c) shows the voltage distribution for the dcsigned planc in Fig. 4, solid 150 referent plane and eBG power plane with excitations(total sink current I A and voltage I v) simulated by Ansoft Maxwell 3D. The current distribution(shown in Fig. 6(d),(e)and ( D)and the resistances for these planes with excitations(total sink current l A and voltage I V)are simulated by Ansoft Q3D. The current sinks from the centre of each EBG unit. The simulated voltage and resistance results are in Tab 2. The voltage drops by the designed plane are lower than 155 those of EBG power plane. That means the H shaped network can provide ebg power plane with low voltage drop per formance. In Fig. 6(d) and(e). current is distributed only around the source In Fig. 6(f), the 2 order h shaped network transmits current to each EBG unit in the power plane That is, current equidistribution property is obtained from the constructed H shaped plane Tab 2 160 the Voltage Distribution and Resistance of the Referent Plane EBG Power Plane and Designed Plane with the 2 0 Order l Shaped Network Voltage (V) lto0.9994 lto0.9824 lto0.9975 Resistance(ohm) 1.8653×104 3.1788×10 1.5150×103 voltage[Y] Voltage['l 60808 +ED 9.997e01 3.991e-1 9.999Ee 9.9988e1 9.9g8s-B 3,9515-1 9.9s83e- Source Source 9,9s7- y3/e-1 I\ 9.9g1e-9 国武技论文在线 http:/www.paper.edu.cn Vn1tagelvl 1[Afm^21 1= 9.9946-B1 .588+B庭4 89-区41 三,62e+ Source :.75866+90+ Source 三,La5e+00 1.8:0 1- 170 (d) IDC YoTA/M 2 L caos+225 Le↓l Le↓dL 6 5.25四已↓区区4 5.∠5Be↓2L 5,匕十gH p可司 TE0Se+EL S ource 3. 1250e+ac Source ⊥,8 6.25e十 心了 Fig. 6 The voltage distributions of (a) the referent plane. (b) The EBG power plane. (c) The 2 order plane Current distributions of(d)referent plane(e) The EBG power plane. (D The 2 order plane 175 Fig. 7(a)is the prototype of thc cxpcrimcnt for thc eBG powcr planc and Fig. 7(b)is thc onc for the 2 order plane Ansoft high frequency structure simulator(HFSS) is used to simulat transmission coeflicient S21. Agilent network analyser N5230A is used to measure the 180 transmission coefficient. Locations for the exciting and receiving ports are shown in Fig. 4 and Fig 5. Thc simulated and mcasurcd S21 for thc referent planc, EBG powcr planc and thc 2 ordcr planc with solid ground plancs arc in Fig. 8. The mental paths of thc h shaped nctwork do not apparently affect the noise suppression of the plane. The band gap defined as the domain where the S2i is lower than -20dB begins from about 2GHz. However, though this plane would most 185 likely degrade the high-speed signals passing over the ebg the lower band-gap frequency due to thcir physical siz.c An EBGi-pattcrncd board with decoupling capacitors can bc as a mcans of both suppressing noise propagation from extremely low frequencies and minimizing effects of the discontinuous plane 国武技论文在线 http:/www.paper.edu.cn (b) Fig. 7 The power plane of (a)the EBG power plane; (b) the 2 order plane SimulatEs solId plane Measured Sat 八 32三 simulated Se D246810121415120 468114i角820 195 Frequency(GHz) Frequency (GHEI simulated and measured S2 of the 2n order plane and simulated S2i of solid referent pl ane(b)The Fig. Noise suppression performances. (a) The simulated and measured S2i of the EBG power plar 200 n this paper, an H shaped network is designed based on constructal theory. The optimal configuration ratio, the optimal assembly number and the network dimensions are obtained for optimal voltage drop and resistance a plane is designed based on the designed h shaped networks and a tradition eBg power plane without h shaped network is used for reference. The current density for the designed plane is more uniform than that for referent plane. The voltage drop and 205 resistance for the designed plane are lower. In the meantime, the designed plane has proved its wideband noise isolation performance. That is, the designed power plane has multi-functions of equidistribution, low voltage drop, current compactness and noise isolation while maintaining a relatively simple design of geometry 210 This project is supported by the National Natural Science Foundation of China(No 6107105 6) and Research fund for the doctoral Program of Higher Education of China(No 200901721200 0 [I]T. Eudcs, B. Ravclo, and A Louis. Transicnt Rcsponsc Charactcrization of thc High-Spccd Intcrconncction 215 Rlcg-Model for the Signal Integrity Analysis. Progress In Electromagnetics Research, PIER 112, 183-197, 2011 2]L Raimondo, F De Paulis, A Orlandi, A Simple and Efficient Design Procedure for Planar Electromagnetic Band-gap Structures on Printed Circuit Boards, IEEE Transactions on Electromagnetic Compatibility, Vol. 52,nr 3, November 2010 []Y.He, L Li, C H Liang, Q.H. Liu, L Li and H B. Wen, Leafy EBG structures for ultra-wideband SSN 220 suppression in power/ground plane pairs. ELECTRONICS LETTERS, voL 46, no 11, pp 768-769 27th May 2010 [4]T L Wu, J. Fan, F de Paulis. C D Wang, A Ciccomancini Scogna, A Orlandi, Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology, Journal of Institute of Electronics, Information and Communication Engineers(IECE), Vol. E93-B, No 07, July 2010 225 [5]S.-H. Kim, T. T Nguyen, and J.-H. Jang, Reflection Characteristics of 1-D EBG Ground Plane and its 8 国武技论文在线 http:/www.paper.edu.cn Application to a Planar Dipole Antenna. Progress In Electromagnetics Research, PIER 120, 51-66, 2011 [6Tzong-Lin Wu, Yen-Hui Lin, Ting-Kuang Wang, Chien-Chung Wang, and Sin-Ting Chen, Electromagnetic Bandgap Power/Ground Planes for Wideband Suppression of ground Bounce Noise and radiated Emission in High-Speed Circuits, IEEE TRANS. MTT, vol 53, no 9, pp. 2935-2942, SEPTEMBER 2005 230 [7] Tzong-Lin Wu, Hao-Hsiang Chuang, and Ting-Kuang Wang, Ovcrvicw of Powcr Integrity Solutions on Package and PCB: Decoupling and EBG Isolation. IEEE TRANS. Electromagnetic Compatibility, vol. 52, no. 2 pp.346-356,MAY2010 [8] Adriano Sciacovelli, Vittorio Verda, Entropy generation analysis in a monolithic-type solid oxide fuel cell (SOFC), Energy, vol 34, no. 7, pp. 850-865, July 2009 235 [9]S Mohamad Dawood Farzan, Amarnath Sankar, A New Miniaturized Planar Electromagnetic Bandgap(EBG) Structure with Dual Slits Signal Propagation on Interconnects, SPI2008, 12th, pp. 1-4, 2008 Alcxandrc K. da Silva, Adrian Bcjan, Constructal multi-scalc structurc for maximal hcat transfcr dcnsity in natural convection, International Journal of Heat and Fluid Flow, Vol. 26, no 1,, pp. 34-44, February 2005 [11]S.M. Senn, D. Poulikakos, Laminar mixing, heat transfer and pressure drop in tree-like microchannel nets 240 and their application for thermal management in polymer electrolyte fuel cells, Journal of Power Sources, Vol.130 no1-2,3,pp.178-191,May2004 245 基于构形形电源分配网络的结 构电源板 刘诗韵,邓良勇,黄惠芬 华南理工大学电子与信息学院,广州510641) 摘要:本文改计了基于构形H-形电源分配网络的EBG结构电源板,该结构具有优越的直流 性能。一方面EBG结构可以抑刽同步开关噪声,另一方面H-形电源分配网络负责电源的均 匀分配。H-形网络结构由多级分层覆铜路径构成,物理参数根捃构形理论优得到,并从低 255阶到高阶依次优化得到最佳的H-形电源分配网络。此外,本文加工了基于二阶H-形电源分 配网终的EBG结构PCB电源板,测试结果表明该电源板不仅有较好的噪声隔离效果、较低 的压降,而且具有均匀的电流分布 关键词:电源完整性;电源分配网路:枃形H-形结构;电磁带隙(EBG)结构电源板 中图分类号:TN41 260 9

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