安森美半导体ESD保护器件ESD7951S-D 数据手册.pdf

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安森美半导体ESD保护器件ESD7951S-D 数据手册pdf,安森美半导体ESD保护器件ESD7951S-D 数据手册
ESD7951ST5G lEC 61000-4-2 Spec IEC61000-4-2 Waveform Test First Peak Voltage Current Current at Current at 100% Level (kv) (A)60ns(A) 7.5 4 4 I@ 30 ns 3 225 12 8 30 16 l@60 10% 0.7 ns to 1 ns Figure 3. IEC61000-4-2 Spec ESD Gun TVS Oscilloscope 吕吕吕吕○ 50g □口口口■ Cable 50g Figure 4. Diagram of ESD Test Setup The following is taken from Application Note systems such as cell phones or laptop computers it is not AND8308/D-Interpretation of Datasheet Parameters learly defined in the spec how to specify a clamping voltage for esd devices at the device level. ON Semiconductor has developed a way ESD Voltage Clamping to examine the entire voltage waveform across the ESd For sensitive circuit elements it is important to limit the protection diode over the time domain of an ESd pulse in the voltage that an IC will be exposed to during an ESd event form of an oscilloscope screenshot, which can be found on to as low a voltage as possible. The esd clamping voltage the datasheets for all esd protection diodes. For more is the voltage drop across the Esd protection diode during information on how on semiconductor creates these an esd event per the iec61000-4-2 waveform. Since the screenshots and how to interpret them please refer to IEC61000-4-2 was written as a pass/fail spec for larger AND8307/D 100 PEAK VALUE IRSM@8 us 山80 PULSE WIDTH (tp)IS DEFINED AS THAT POINT WHERE THE Ou0 70 PEAK CURRENT DECAY =8 us HALF VALUE IRSM/2 20 us 50 nSuLo8 40 30 10 0 80 t,TIME(us) Figure 5.8x 20 us Pulse Waveform http://onsemi.com 3 ESD7951ST5G PACKAGE DIMENSIONS SOD-923 CASE 514AB-01 ISSUE B NOTES 1. DIMENSIONING AND TOLERANCING PER ANSI 2, CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS, MINIMUM LEAD b THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL 台0.08(0.0032)XY LLIMETERS CHES DIM MIN NOM MAX MIN NOM MAX 34 7040001300150.016 0.070.120.170.0030.0050.00 0750.30085003000310033 FHE0.95100105003700390041 0100.15000200040006 SOLDERING FOOTPRINT 0.90 0.40 0.30 DIMENS ONS: MILLIMETERS For additional information on our Pb-Free strategy and soldering details, please download the on Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D ON Semiconductor and (n aro registered trademarks of Semiconductor Compononts Industries, LLC (SCILLC). SCILLC reserves the right to make changos without further notico to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product ar circuit, and specifically disclaims any and all liabi ity, including without imitation special, consequential or incidental damages Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Al operating parameters, including "Typicals" must be validated for each customer applicatian by customer's technical experts. SCILLC does not convey any license under its patent ngts nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant in o the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLc oroduct could create a situation where personal injury or death may occur. Should Buyer purchase or use SCiLLC products for any such unintended or unauthorized application, Buyer shall indemnify anc hold Scillc and its officers, employees, subsidiaries, affiliates and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT N.AmericanTechnicalSupport800-282-9855TollFreeOnSemiconductorWebsitewww.onseml.com Literature Distribution Center for oN Semiconductor USA/Canada PO. Box 5163. Denver Colorado 80217 USA Europe, Middle East and Africa Technical Support: OrderLiterature:http://www.onsemi.com/orderlit Phone: 303-675-2175 or 800-344-3860 Toll Free USA Canada Phone: 421 33790 2910 Fax: 303-675-2176 or B00-344-3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email:orderlit@onsemi.com Phone:81-3-5773-3850 Sales Representative ESD7951S/D

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