摘 要：随着电子封装向高性能、高密度、微型化的发展，焊膏材料和技术显得极为重要。本文讨论了表面安装技术（SMT）焊膏的焊粉质量、焊剂载体要求以及焊膏的基本性能测试。 关键词：焊膏、焊粉、焊剂载体The Quality and Testing of Solder Paste for SMTAbstract: Because of the development of high density, high performance and miniaturization in electronic packaging, solder paste material and technology bec
