DWG Smart-Card Integrated Circuit(s) Card Interface Devices
Universal Serial Bus
Device Class: Smart Card
CCID
Specification for
Integrated Circuit(s) Cards Interface
Devices
Revision 1.1
April 22
rd
, 2005
CCID Rev 1.1 Page 1 of 123
DWG Smart-Card Integrated Circuit(s) Card Interface Devices
Intellectual Property Disclaimer
THIS SPECIFICATION IS PROVIDED “AS IS” WITH NO WARRANTIES
WHATSOEVER INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS
FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING
OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE.
A LICENSE IS HEREBY GRANTED TO REPRODUCE AND DISTRIBUTE THIS
SPECIFICATION FOR INTERNAL USE ONLY. NO OTHER LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY OTHER INTELLECTUAL
PROPERTY RIGHTS IS GRANTED OR INTENDED HEREBY.
AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING
LIABILITY FOR NFRINGEMENT OF PROPRIETARY RIGHTS, RELATING TO
IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. AUTHORS OF THIS
SPECIFICATION ALSO DO NOT WARRANT OR REPRESENT THAT SUCH
IMPLEMENTATION(S) WILL NOT INFRINGE SUCH RIGHTS.
Contributors
Bob Nathan NCR
Stephen Chasko NCR
Don Chang Alcor Micro Inc
Daryl Adams Alcor Micro Inc
Michel Brun Philips Semiconductors
Christophe Chausset Philips Semiconductors
Jean Luc Luong Philips Semiconductors
Gerhard Hahn Cherry GmbH
Harald Folkenborn Cherry GmbH
Eric Vila ActivCard
Jerome Becquart ActivCard
Thierry Karlisch GemPlus
Francis Donnat GemPlus
Sergey Ivanov GemPlus
Jean-Christophe Raynon SCM Microsystems
Xavier Mariaud STMicroelectronics
Doron Holan Microsoft Corporation
Tzvia Weisman NDS Technologies
Jim Meador STMicroelectronics
Jean-Christophe Lawson Temic Semiconductors
Page 2 of 123 CCID Rev 1.1
DWG Smart-Card Integrated Circuit(s) Card Interface Devices
Revision History
Revision Issue Date Comments
0.8a July 5, 2000
0.8b November 2, 2000 Incorporate RRs 1-12.
0.9a Dec 14, 2000 Promotion to 0.9 level
1.0rc1 Jan 29, 2001 Incorporation of RR 13-16
Proffered as 1.0rc1
1.00 (release) March 20, 2001 Device Class ‘0x0B’ Assigned
August 13
th
, 2003 RR001, 2003-08-07
May 17
th
, 2004 RR007, 2004-05-17
1.08k
October 20
th
, 2004 General review
1.1 (release) April 22
nd
, 2005 Release
Release 1.1 Contributors
Randy Aull Microsoft
Francis DONNAT Gemplus
Nicolas DRABCZUK Axalto
Steffen DREWS Philips
Serge FRUHAUF STMicroelectronics
Robert LEYDIER Axalto
Christian SCHNECKENBURGER Infineon
Dieter WEISS G&D
CCID Rev 1.1 Page 3 of 123
DWG Smart-Card Integrated Circuit(s) Card Interface Devices
Contents
1 Introduction ...................................................................................................................6
1.1 Related Documents..................................................................................................... 6
1.2 Terms and Abbreviations ............................................................................................ 6
1.3 Document Conventions ............................................................................................... 9
2 Overview ..................................................................................................................... 10
3 CCID Functional Characteristics ................................................................................. 11
3.1 Communication pipes................................................................................................ 11
3.1.1 Control pipe........................................................................................................ 11
3.1.2 Interrupt pipe...................................................................................................... 11
3.1.3 Bulk-in, Bulk-out pipes ....................................................................................... 12
3.2 Protocol and parameters selection............................................................................ 13
3.2.1 TPDU level of exchange .................................................................................... 13
3.2.2 APDU level of exchange .................................................................................... 14
3.2.3 Character level of exchange .............................................................................. 14
3.3 Suspend Behavior ..................................................................................................... 15
4 Standard USB Descriptors .......................................................................................... 16
4.1 Device ....................................................................................................................... 16
4.2 Configuration ............................................................................................................. 16
4.3 Interface .................................................................................................................... 16
5 Smart Card Device Class ............................................................................................ 17
5.1 Descriptor .................................................................................................................. 17
5.2 CCID Endpoints......................................................................................................... 20
5.2.1 Bulk-OUT Endpoint ............................................................................................ 21
5.2.2 Bulk-IN Endpoint ................................................................................................ 21
5.2.3 Interrupt-IN Endpoint.......................................................................................... 22
5.3 CCID Class-Specific Request ................................................................................... 23
5.3.1 ABORT............................................................................................................... 23
5.3.2 GET_CLOCK_FREQUENCIES ......................................................................... 24
5.3.3 GET_DATA_RATES ..........................................................................................24
6 CCID Messages .......................................................................................................... 25
6.1 Command Pipe, Bulk-OUT Messages ......................................................................26
6.1.1 PC_to_RDR_IccPowerOn.................................................................................. 26
6.1.2 PC_to_RDR_IccPowerOff.................................................................................. 28
6.1.3 PC_to_RDR_GetSlotStatus ...............................................................................29
6.1.4 PC_to_RDR_XfrBlock........................................................................................ 30
6.1.5 PC_to_RDR_GetParameters............................................................................. 31
6.1.6 PC_to_RDR_ResetParameters ......................................................................... 32
6.1.7 PC_to_RDR_SetParameters ............................................................................. 32
6.1.8 PC_to_RDR_Escape ......................................................................................... 35
6.1.9 PC_to_RDR_IccClock........................................................................................ 36
6.1.10 PC_to_RDR_T0APDU .......................................................................................36
6.1.11 PC_to_RDR_Secure.......................................................................................... 38
6.1.12 PC_to_RDR_Mechanical ................................................................................... 46
6.1.13 PC_to_RDR_Abort............................................................................................. 47
6.1.14 PC_to_RDR_SetDataRateAndClockFrequency ................................................ 47
6.2 Response Pipe, Bulk-IN Messages........................................................................... 48
6.2.1 RDR_to_PC_DataBlock..................................................................................... 49
6.2.2 RDR_to_PC_SlotStatus:.................................................................................... 50
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DWG Smart-Card Integrated Circuit(s) Card Interface Devices
6.2.3 RDR_to_PC_Parameters................................................................................... 51
6.2.4 RDR_to_PC_Escape ......................................................................................... 53
6.2.5 RDR_to_PC_DataRateAndClockFrequency...................................................... 53
6.2.6 Reporting Slot Error and Slot Status registers in Bulk-IN messages ................. 54
6.2.7 Failure of a command ........................................................................................ 55
6.3 Interrupt-IN Messages............................................................................................... 56
6.3.1 RDR_to_PC_NotifySlotChange ......................................................................... 56
6.3.2 RDR_to_PC_HardwareError.............................................................................. 57
7 Examples of message exchanges............................................................................... 58
7.1 Common Behavior..................................................................................................... 58
7.2 Character Level ......................................................................................................... 61
7.3 APDU Level............................................................................................................... 69
7.4 TPDU Level ............................................................................................................... 80
8 Examples of PIN Management.................................................................................... 87
8.1 PIN Verification.......................................................................................................... 87
8.1.1 PIN uses a binary format conversion ................................................................. 87
8.1.2 PIN uses a shift rotation format conversion. ...................................................... 89
8.1.3 PIN uses a BCD format conversion with PIN length insertion ........................... 91
8.1.4 PIN uses BCD, right justification and a control field........................................... 93
8.1.5 PIN uses an ASCII format conversion with padding. ......................................... 95
8.2 PIN Modification ........................................................................................................ 97
8.2.1 Change PIN ASCII format (8-byte long)............................................................ 97
8.2.2 PIN uses an ASCII format conversion with PIN length management. ............... 99
8.2.3 Character Level, Protocol T = 0, sequence for PIN verification ....................... 102
9 Sample diagrams based on dwFeatures................................................................... 103
9.1 Definition of dwFeatures fields ................................................................................ 103
9.2 ICC ATRs used in these diagrams .......................................................................... 104
9.3 Voltage management .............................................................................................. 105
9.3.1 Class AB, ATR1, Feature 1.............................................................................. 105
9.3.2 Class B, ATR1, Feature 1 ................................................................................ 106
9.3.3 Class AB, ATR1, Feature 2, 3, 4, 5 and Feature 5 .......................................... 107
9.3.4 Class AB, ATR2, Feature 2, 3, 4 and Feature 5 .............................................. 108
9.4 Management of Rate and protocol .......................................................................... 109
9.4.1 Fixed rate (= ATR), ATR 2, Feature1, 2 and Feature 3 ................................... 109
9.4.2 High speed, ATR 4, Feature 1 or Feature 2..................................................... 110
9.4.3 Fixed rate (= ATR), ATR 2, Feature 4 or Feature 5 ......................................... 111
9.4.4 Fixed rate (= ATR), ATR 2, Feature 6.............................................................. 112
9.4.5 Fixed rate (= ATR), ATR 3, Feature 1.............................................................. 113
9.4.6 High speed, ATR 3, Feature1 .......................................................................... 114
9.4.7 High speed, ATR 3, Feature 2 or Feature 3..................................................... 115
9.4.8 High speed, ATR 3, Feature 4 ......................................................................... 116
9.4.9 High speed, ATR 3, Feature 5 ......................................................................... 117
9.4.10 High speed, ATR 3, Feature 6 ......................................................................... 118
9.4.11 High speed, “EMV like”, Cold ATR: ATR1, Warm ATR: ATR4, Feature 1 ....... 120
9.5 Automatic IFSD management ................................................................................. 121
9.5.1 Large IFSD, ATR4, Feature 1 or Feature 2 .....................................................121
9.5.2 Large IFSD, ATR4, Feature 4 .......................................................................... 122
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