镁光AR0330

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镁光0330 CMOS规格书,可用于IPC 车载 ATM等方面的具体应用开发学习
ON Semiconductor Confidential and Proprietary ARO330CS: 1/3-Inch CMOS Digital Image Sensor Table of contents Solid color ,49 Vertical Color bars 49 Walking is 聊 ,,,,,,,,,,,50 Two-Wire Serial Register Interface ·看··D ,,,,50 Protocol ,,,,,,,,50 Start Condition ···· 0 Stop Condition.............. 0 Data transfer 50 Slave Address/Data Direction Byte 51 Message Byte 51 Acknowledge Bit∴.∴ No-Acknowledge Bit ,51 Typical sequence ·:········ 51 Single read from random location 52 Single rEAD From Current Location..,,,,,,,………,……,,52 Sequential READ, Start From Random Location 53 Sequential READ, Start From Current Location 53 Single write to Random Location 53 Sequential WritE, Start at Random Location .......54 Spectral characteristics........... ················· ·· 55 CSP Packages........ ,,,,,,,,,,,.57 Package Orientation in Camera design 59 Revision history. 60 ARo330CS DS Rev. E Pub. 1/15 EN @Semiconductor Components Industries, LLC, 2012 ON Semiconductor Confidential and Proprietary ARO330CS: 1/3-Inch CMOS Digital Image Sensor List of Figures List of Figures Figure l: Block Diagram Figure 2: Typical Configuration: Serial MIPI :···.···:·· Figure 3: Typical Configuration: Parallel Pixel Data Interface 689 Figure 4: PLCC Pinout........... ,,,,12 Figure 5 U ..∴,,,.,13 Figure 6: Power Down... Figure 7: Two-Wire Serial Interface Timing Parameters.............. ,,,,,,,,,,,,,,17 Figure 8: I/O Timing Diagram ...,,,18 Figure 9: Single-Ended and Differential Signals............. 20 Figure 10: DC Test circuit ,,,,,,,,,,,,,20 igure 11: Clock-to-Data Skew Timing Diagram Figure 12: Differential Skew 2 Figure 13: Transmitter Eye Mask. ............,......................................................22 Figure 14: Clock Duty Cycle Figure 15: Clock Jitter Figure 16: Relationship Between Readout Clock and Peak Pixel rate 25 Figure 17: Sensor Dual Readout Paths ..26 人 gure I8: PLL for the parallel Interface∴…………………… 26 igure 19 PLL for the serial interface 27 igure20: Integration Control in ERS Readout.…∴… ·;···..::· ∴......32 Figure 21: Example of 833ms Integration in 16 6ms frame 33 Figure 23: The Row Integration Time is Greater Than the Frame Readout Time,,,..,.........33 Figure 22: Row Read and Row reset Showing Fine Integration 34 Figure 24: Gain Stages in ARO330CS Sensor ·.·· 35 Figure 25: Effect of Horizontal Mirror on Readout Order 38 Figure 26: Effect of Vertical Flip on Readout Order 39 Figure 27: Horizontal Binning in the ARo330CS Sensor 40 Figure28: Vertical Row Binning in the AR033 CS Sensor.……… 40 Figure 29: Frame Period Measured in Clocks ,42 Figure 30: Slave Mode Active State and Vertical Blanking :.····· ,44 Figure 31: Slave Mode Example with Equal Integration and frame Readout Periods 45 Figure 32: Slave Mode Example Where the Integration Period is Half of the Frame Readout Period..... 46 Figure 33: Example of Changing the Sensor from Context A to Context B 48 Figure 34: Single READ From Random Location .52 Figure 35: Single READ From Current location 52 Figure 36: Sequential READ, Start From Random Location ,,,,,,,,,,,,53 Figure 37: Sequential READ, Start From Current Location. Figure38: Single Write to random location.∴∴………… 53 Figure 39: Sequential WRITE, Start at Random Location 4 Figure40: Bare Die Quantum Efficiency..…,,,,……,,.55 Figure 41: CSP Parallel/MIPI Package Figure 42: PLCC Package Drawing ,58 Figure 43: Image Orientation With Relation To Camera Lens ARo330CS DS Rev. E Pub. 1/15 EN @Semiconductor Components Industries, LLC, 2012 ON Semiconductor Confidential and Proprietary ARO330CS: 1/ 3-Inch CMOS Digital Image Sensor List of tables List of tables Table 1 Available part numbers Table 2: Key Parameters ·········:· Table 3 Available Aspect Ratios in the Aro330CS Sensor Table 4 Available Working modes in the aro330CS Sensor ·. Table 5 AR0330CS Pin Descriptions ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,10 Table 6 CSP(Parallel/MIPI) Package Pinout 着看鲁鲁··鲁,看 11 ble 7 ARO330CS PLCC Package Thermal Resistance ...12 able 8: Power-Up Sequence 14 Table 9 Power-Down Sequence ∴,,,,,,,,15 Table 10: DC Electrical Definitions and Characteristics(MIPI Mode) .16 Table 1l: Absolute Maximum Ratings ,,,,,,,,,16 Table 12: Two-Wire serial Interface Electrical characteristics17 Table 13: Two-Wire Serial Interface Timing Specifications............ 17 Table 14: 1/O Parameters .··: 18 able 15: I/O Timing...... ,,19 Table 16: Parallel i/o Table 17 PlL Parameters for the parallel interface 27 Table 18: Example PlL Configuration for the Parallel Interface.................... 27 Table 19 PLL Parameters for the Serial Interface ,28 Table 20: Example PLL Configurations for the Serial Interface 28 Table 21: Output Enable control......,....... ,29 Table 22: Configuration of the Pixel Data Interface ···· ∴..30 able 23: Recommended mipi Timing configuration 32 Table 24: Recommended Sensor Analog Gain'fables 5 Table 25: Pixel Column Table 26: Pixel Row Configuration 38 Table 27: Configuration for Horizontal Subsampling 41 Table 28: Configuration for Vertical Subsampling......... ∴.,,,41 Table 29: Minimum Vertical Blanking configuration 4 Table 30: Serial SYNC Codes included with each protocol included with the aro330cS sensor.....47 Table 31: List of Configurable registers for Context A and context B ,,,,,,,47 ible 32: A-Law Compression Table for 12-10 bits ,49 Table 33: Test Pattern modes ...........49 Table 34: Chief Ray Angle(CRA)12 56 ARo330CS DS Rev. E Pub. 1/15 EN @Semiconductor Components Industries, LLC, 2012 ON Semiconductor Confidential and Proprietary ARO330CS: 1/3-Inch CMOS Digital Image Sensor General Description General Description The aRo330CS can be operated in its default mode or programmed for frame size, expo sure, gain, and other parameters. The default mode output is a 2304 x 1296 image at 30 frames per second(fps). The sensor outputs 10-or 12-bit raw data, using either the parallel or serial (MIPI)output ports Functional overview The aro330CS is a progressive-scan sensor that generates a stream of pixel data at a constant frame rate. It uses an on-chip, phase-locked loop(Pll)that can generate all internal clocks from a single master input clock running between 6 and 27 MHz. The maximum output pixel rate is 98 Mp/s using a 2-lane MIPI serial interface and 98 Mp/s using the parallel interface. Figure 1 shows a block diagram of the sensor Figure 1: Block Diagram Test patte 12-bit Analog Core Digital Core Output Data-Path Row Noise correction Compression(optiona PLL Black Level Correction Lens Shading Correcti ng Control a Pixel Array I Amplifier Digital Gain Data pedestal AD 12-bit 12-bt Registers 8,10,or 12-bit 12-bt Two-Wire serial I/F MIPI 1/O PIXCLK, FV CLK P/N LV, DouT[11: 0] 1. Two lane data paths only 2.98Mp/S Max 98 Mp/ Mp/s over 2la User interaction with the sensor is through the two-wire serial bus which communi- cates with the array control, analog signal chain, and digital signal chain. The core of the sensor is a 3. 4Mp active-pixel sensor array. The timing and control circuitry sequences through the rows of the array, resetting and then reading each row in turn. In the time interval between resetting a row and reading that row, the pixels in the row integrate incident light. The exposure is controlled by varying the time interval between reset and readout. Once a row has been read the signal from the column is amplified in a column amplifier and then digitized in an analog-to-digital converter(ADC). The output from the adc is a 12-bit value for each pixel in the array. The AdC output passes through a digital processing signal chain(which provides further data path corrections and applies digital gain) ARo330CS DS Rev. E Pub. 1/15 EN @Semiconductor Components Industries, LLC, 2012 ON Semiconductor Confidential and Proprietary ARO330CS: 1/3-Inch CMOS Digital Image Sensor Working Modes Working Modes The aro330CS sensor working modes are specified from the following aspect ratios Table 3 Available Aspect Ratios in the aro330CS Sensor Aspect Ratio Sensor Array Usage 3:2 Still format #1 2256(HX15040) 4:3 Still format #2 2048(H)x1536() 16:10 Still format #3 2256(H)×1440() 16:9 HD Format 2304(H)X1296(V) The aRo330CS supports the following working modes To operate the sensor at full speed 98Mp/s the sensor must use 2-Lane MIPI or parallel interface. The sensor will operate at full-speed(9 8 Mp/s)when using the parallel interface Table 4s Available working modes in the aro330cS Sensor FPS Active Readout Sensor Output(2-Lane MIPI FPS(Parallel Mode Aspect Ratio Window Resolution Interface Interface Subsampling FOV 080p +ElS 16:9 2304×12962304×1296 30 30 100% 4:3 2048X15362048X1536 30 25 100% 3M Still 3:2 2256X1504 2256X1504 30 25 100% WVGA+EIS 16:9 2304X1296 1152X648 2X2 100% WVGA +ES 169 2304x1296 1152X648 120 N/A 2X2 100% Slow-motion ARo330CS DS Rev. E Pub. 1/15 EN 7 @Semiconductor Components Industries, LLC, 2012 ON Semiconductor Confidential and Proprietary ARO330CS: 1/3-Inch CMOS Digital Image Sensor Working Modes Figure 2: Typical Configuration: Serial MIPI Digital Digital 1/0 Core PLL Anal Anal 1 1 power VDD IO VDD C 9 VAA VAA PIX 8 DATAl N Master clock EXTCLK (6-27MHz) DATA2 N CLK P (MIPI-serial interface) TRIGGER CLK N SHUTTER From SCLK FLASH controller SDATA d RESEt bar TEST DGN Digit ground g roun VDD O VDD VDD PLL VAA VAA PIX 100110[01l10Fo1d10F010oFo1 Notes: 1. All power supplies must be adequately decoupled ON Semiconductor recommends having 10uF and OluF decoupling capacitors for every power supply. If space is a concern, then priority must be given in the following order: VAA, VAA PIX, VDD PLL, VDD_ MIPL, VDD IO, and VDD. Actual values and results may vary depending on layout and design considerations 2. To allow for space constraints, ON Semiconductor recommends having oluF decoupling capacitor inside the module as close to the pads as possible. In addition, place a 10uF capacitor for each sup ply off-module but close to each supply 3. ON Semiconductor recommends a resistor value of 1.5k e2, but a greater value may be used for slower two-wire speed 4. The pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times 5. ON Semiconductor recommends that analog power planes are placed in a manner such that cou- pling with the digital power planes is minimized 6. tESt pin must be tied to dgnd for the mipi configuration 7. ON Semiconductor recommends that gnd mipi be tied to dgnd 8. VDD MIPI is tied to VDD PLL in the CSP package. oN Semiconductor strongly recommends that VDD MIPl must be connected to a VDD PLL in a module design since VDD PLL and VDD MIPl are tied together in the die 9. The package pins or die pads used for the parallel interface must be left floating 10. If the SHUTTER or FLASH pins or pads are not used, then they must be left floating ARo330CS DS Rev. E Pub. 1/15 EN @Semiconductor Components Industries, LLC, 2012 ON Semiconductor Confidential and Proprietary ARO330CS: 1/3-Inch CMOS Digital Image Sensor Working Modes 11. If the TRIGGER or oE BAR pin or pad is not used, then it should be tied to DGND gure 3: Typical Configuration: Parallel Pixel Data Interface Digital Digital PLL Analog analo powerl power 1 powerd pcwer powe VDD IO VDD VAA VAA PIX Master clock EXTCLK DoUT[11:0] OE BAR LINE VALID SADDR contro ler FRAME VALID From SCLK Controller SDATA SHUTTER RESET BAR DGND AGND Digital alog g ground VDD VDC PLL VAA VAA PIX 10E0.u10E0.110曲0,lu10u0.1 10uF0.1进 Notes: 1. All power supplies must be adequately decoupled ON Semiconductor recommends having 10uF and o1uF decoupling capacitors for every power supply. If space is a concern, then priority must be given in the following order: VAA, VAA PIX, VDD_ PLL, VDD IO, and VDD. Actual values and results may vary depending on layout and design considerations 2. To allow for space constraints, ON Semiconductor recommends having o 1uF decoupling capacitor inside the module as close to the pads as possible. In addition, place a 10uF capacitor for each sup ly off- module but close to each supply 3. ON Semiconductor recommends a resistor value of 1.5ke2, but a greater value may be used for slower two-wire speed The pull-up t required if the n sclk at all time 5. ON Semiconductor recommends that analog power planes are placed in a manner such that cou pling with the digital power planes is minimized 6. TEST pin should be tied to the ground 7. The data and clock package pins or die pads used for the MlPl interface must be left floating 8. The VDD MIPI package pin and sensor die pad should be connected to a 2. 8V supply as it is tied to the VDD Pll supply both in the package routing and also within the sensor die itself. 9. If the SHUTTER or FLASH pins or pads are not used, then they must be left floating 10. If the tRiggeR or oE BAR pin or pad is not used, then it should be tied to dgND ARo330CS DS Rev. E Pub. 1/15 EN @Semiconductor Components Industries, LLC, 2012 ON Semiconductor Confidential and Proprietary ARO330CS: 1/ 3-Inch CMOS Digital Image Sensor Pin Descriptions Pin Descriptions Table 5: ARo330CS Pin Descriptions Name Type Description RESET BAR Input Asynchronous reset (active LOW). All settings are restored to factory default. EXTCLK Input Master input clock, range 6-27MHz TRIGGER Input Receives slave mode VD signal for frame rate synchronization and trigger to start a GRR frame SADDR Input Two-wire serial address select SCLK Input Two-wire serial clock input TESt Input Enable manufacturing test modes tie to dgnd for normal sensor operation OE BAR Input Parallel port output enable, active low SDATA 0Two-wire serial data l/o PIXCLK Output Pixel clock out. DouT is valid on rising edge of this clock DOUT(11: 0] Output Parallel pixel data output FLASH Output Flash output Synchronization pulse for external light source Can be left floating if not used. FRAME VALID Output Asserted when dout data is valid LINE_VALID Output LINE_VALID output asserted when DOUT data is valid SHUTTER Output Control for external mechanical shutter Can be left floating if not used DATA1 P Output MIPl serial data, lane 1, differential P DATA1 N Output MIPl serial data, lane l, differential N DATA2 P Output MIPl serial data, lane 2, differential P DATA2 N Output MIPl serial data, lane 2, differential CLK P Output Output MIPI serial clock, differential P CLK N Output Output MIPI serial clock, differential N VDD MIPI Power MIPI power supply VAAHV NPIX Power Power supply pin used to program the sensor OTPM(one-time programmable memory). This pin should be open if otPm is not used VDD Power Digital power VDD O Power 10 supply power. VDD PLL Power PLL power supply DGND Power Digital GND Power Analog power VAAPⅨX Power Pixel power AGND Power Analog gnd ARo330CS DS Rev. E Pub. 1/15 EN 10 @Semiconductor Components Industries, LLC, 2012

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