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DS162 (v1.9) August 23, 2010 www.xilinx.com
Advance Product Specification 1
© 2009–2010 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other
countries. All other trademarks are the property of their respective owners.
Spartan-6 FPGA Electrical Characteristics
Spartan®-6 LX FPGAs are available in -3, -2, and -1L speed grades, with -3 having the highest performance. Spartan-6 LXT
FPGAs are available in -4, -3, and -2 speed grades, with -4 having the highest performance. Spartan-6 FPGA DC and AC
characteristics are specified for both commercial and industrial grades. Except the operating temperature range or unless
otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing
characteristics of a -2 speed grade industrial device are the same as for a -2 speed grade commercial device). However, only
selected speed grades and/or devices might be available in the industrial range. The -3N speed grade, designated for
Spartan-6 devices that do not support memory controller block (MCB) functionality, has identical timing characteristics to the
-3 speed grade.
All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters
included are common to popular designs and typical applications.
This Spartan-6 FPGA data sheet, part of an overall set of documentation on the Spartan-6 family of FPGAs, is available on
the Xilinx website.
All specifications are subject to change without notice.
Spartan-6 FPGA DC Characteristics
73
Spartan-6 FPGA Data Sheet:
DC and Switching Characteristics
DS162 (v1.9) August 23, 2010 Advance Product Specification
Table 1: Absolute Maximum Ratings
(1)
Symbol Description Units
V
CCINT
Internal supply voltage relative to GND –0.5 to 1.32 V
V
CCAUX
Auxiliary supply voltage relative to GND –0.5 to 3.75 V
V
CCO
Output drivers supply voltage relative to GND –0.5 to 3.75 V
V
BATT
Key memory battery backup supply (XC6SLX75, XC6SLX75T, XC6SLX100, XC6SLX100T,
XC6SLX150, and XC6SLX150T only)
–0.5 to 4.05 V
V
FS
External voltage supply for eFUSE programming (XC6SLX75, XC6SLX75T, XC6SLX100,
XC6SLX100T, XC6SLX150, and XC6SLX150T only)
(2)
–0.5 to 3.75 V
V
REF
Input reference voltage –0.5 to 3.75 V
V
IN
and V
TS
(3)
I/O input voltage or voltage
applied to 3-state output,
relative to GND
(4)
All user and dedicated
I/Os
Commercial
DC –0.60 to 4.10 V
20% overshoot duration –0.75 to 4.25 V
8% overshoot duration
(5)
–0.75 to 4.40 V
Industrial
DC –0.60 to 3.95 V
20% overshoot duration –0.75 to 4.15 V
4% overshoot duration
(5)
–0.75 to 4.40 V
Restricted to
maximum of 100 user
I/Os
Commercial
20% overshoot duration –0.75 to 4.35 V
15% overshoot duration
(5)
–0.75 to 4.40 V
10% overshoot duration –0.75 to 4.45 V
Industrial
20% overshoot duration –0.75 to 4.25 V
10% overshoot duration –0.75 to 4.35 V
8% overshoot duration
(5)
–0.75 to 4.40 V
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v1.9) August 23, 2010 www.xilinx.com
Advance Product Specification 2
T
STG
Storage temperature (ambient) –65 to 150 °C
T
SOL
Maximum soldering temperature
(6)
(TQG144, CPG196, CSG225, CSG324, CSG484, and FTG256)
+260 °C
Maximum soldering temperature
(6)
(Pb-free packages: FGG484, FGG676, and FGG900) +250 °C
Maximum soldering temperature
(6)
(Pb packages: FT256, FG484, FG676, and FG900) +220 °C
T
j
Maximum junction temperature
(6)
+125 °C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to
Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. When programming eFUSE, V
FS
≤ V
CCAUX
. Requires up to 40 mA current. For read mode, V
FS
can be between GND and 3.45 V.
3. I/O absolute maximum limit applied to DC and AC signals. Overshoot duration is the percentage of a data period that the I/O is stressed beyond
3.45V.
4. For I/O operation, refer to the Spartan-6 FPGA SelectIO Resources User Guide.
5. Maximum percent overshoot duration to meet 4.40V maximum.
6. For soldering guidelines and thermal considerations, see Spartan-6 FPGA Packaging and Pinout Specification.
Table 2: Recommended Operating Conditions
(1)
Symbol Description
Temperature
Range
Speed
Grade
Memory
Controller
Block
(2)
Performance
Min Typ Max Units
V
CCINT
Internal supply voltage relative to GND,
T
j
=0°C to +85°C
Commercial -4, -3, -2 standard 1.14 1.2 1.26 V
extended 1.2 1.23 1.26 V
-1L standard 0.95 1.0 1.05 V
Internal supply voltage relative to GND,
T
j
= –40°C to +100°C
Industrial -3, -2 standard 1.14 1.2 1.26 V
extended 1.2 1.23 1.26 V
-1L standard 0.95 1.0 1.05 V
V
CCAUX
(3)
Auxiliary supply voltage relative to GND
when V
CCAUX
= 2.5V, T
j
=0°C to +85°C
Commercial -4, -3, -2,
-1L
N/A
2.375 2.5 2.625 V
Auxiliary supply voltage relative to GND
when V
CCAUX
= 2.5V, T
j
=–40°C to
+100°C
Industrial -3, -2, -1L N/A
Auxiliary supply voltage relative to GND
when V
CCAUX
= 3.3V, T
j
=0°C to +85°C
Commercial -4, -3, -2,
-1L
N/A
3.15 3.3 3.45 V
Auxiliary supply voltage relative to GND
when V
CCAUX
= 3.3V, T
j
=–40°C to
+100°C
Industrial -3, -2, -1L N/A
V
CCO
(4)(5)(6)
Output supply voltage relative to GND,
T
j
=0°C to +85°C
Commercial -4, -3, -2,
-1L
N/A
1.1 – 3.45 V
Output supply voltage relative to GND,
T
j
= –40°C to +100°C
Industrial -3, -2, -1L N/A
V
IN
Input voltage relative to GND, T
j
=0°C to
+85°C
Commercial -4, -3, -2,
-1L
N/A
–0.5 – 4.0 V
Input voltage relative to GND, T
j
=–40°C
to +100°C
Industrial -3, -2, -1L N/A
–0.5 –
3.95
V
Input voltage relative to GND, PCI I/O
standard, T
j
=0°C to +85°C
Commercial -4, -3, -2,
-1L
(7)
N/A
–0.5 –
V
CCO
+
0.5
V
Input voltage relative to GND, PCI I/O
standard, T
j
= –40°C to +100°C
Industrial -3, -2,
-1L
(7)
N/A
–0.5 –
V
CCO
+
0.5
V
Table 1: Absolute Maximum Ratings
(1)
(Cont’d)
Symbol Description Units
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v1.9) August 23, 2010 www.xilinx.com
Advance Product Specification 3
I
IN
(8)
Maximum current through pin using PCI
I/O standard when forward biasing the
clamp diode.
Commercial -4, -3, -2,
-1L
(7)
N/A
––10mA
Industrial -3, -2,
-1L
(7)
N/A
––10mA
V
BATT
(9)
Battery voltage relative to GND, T
j
=0°C
to +85°C
(XC6SLX75, XC6SLX75T, XC6SLX100,
XC6SLX100T, XC6SLX150, and
XC6SLX150T only)
Commercial -4, -3, -2,
-1L
N/A
1.0 – 3.6 V
Battery voltage relative to GND,
T
j
= –40°C to +100°C (XC6SLX75,
XC6SLX75T, XC6SLX100,
XC6SLX100T, XC6SLX150, and
XC6SLX150T only)
Industrial -3, -2, -1L N/A
Notes:
1. All voltages are relative to ground.
2. See Interface Performances for Memory Interfaces in Tabl e 25. The standard V
CCINT
voltage range applies to designs not using an MCB, or to devices
that do not support MCB functionality including the LX4 device, the TQG144 and CPG196 packages, and the -3N speed grade.
3. Recommended maximum voltage droop for V
CCAUX
is 10 mV/ms.
4. Configuration data is retained even if V
CCO
drops to 0V.
5. Includes V
CCO
of 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V.
6. For PCI systems, the transmitter and receiver should have common supplies for V
CCO
.
7. Devices with a -1L speed grade do not support Xilinx PCI IP.
8. Do not exceed a total of 100 mA per bank.
9. V
BATT
is required to maintain the battery backed RAM (BBR) AES key when V
CCAUX
is not applied. Once V
CCAUX
is applied, V
BATT
can be
unconnected. When BBR is not used, Xilinx recommends connecting to V
CCAUX
or GND. However, V
BATT
can be unconnected.
Table 3: eFUSE Programming Conditions
(1)
Symbol Description Min Typ Max Units
V
FS
(2)
External voltage supply 3.2 3.3 3.4 V
I
FS
V
FS
supply current ––40mA
V
CCAUX
Auxiliary supply voltage relative to GND 3.2 3.3 3.45 V
R
FUSE
(3)
External resistor from R
FUSE
pin to GND 1129 1140 1151 Ω
V
CCINT
Internal supply voltage relative to GND 1.14 1.2 1.26 V
t
j
Temperature range 15 – 85 °C
Notes:
1. These specifications apply during programming of the eFUSE AES key. Programming is only supported through JTAG.The AES key is only supported
in the following devices: XC6SLX75, XC6SLX75T, XC6SLX100, XC6SLX100T, XC6SLX150, and XC6SLX150T.
2. When programming eFUSE, V
FS
must be less than or equal to V
CCAUX
. When not programming or when eFUSE is not used, Xilinx recommends
connecting V
FS
to GND. However, V
FS
can be between GND and 3.45 V.
3. An R
FUSE
resistor is required when programming the eFUSE AES key. When not programming or when eFUSE is not used, Xilinx recommends
connecting the R
FUSE
pin to V
CCAUX
or GND. However, R
FUSE
can be unconnected.
Table 2: Recommended Operating Conditions
(1)
(Cont’d)
Symbol Description
Temperature
Range
Speed
Grade
Memory
Controller
Block
(2)
Performance
Min Typ Max Units
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v1.9) August 23, 2010 www.xilinx.com
Advance Product Specification 4
Table 4: DC Characteristics Over Recommended Operating Conditions
Symbol Description Min Typ Max Units
V
DRINT
Data retention V
CCINT
voltage (below which configuration data might be lost) 0.8 – – V
V
DRAUX
Data retention V
CCAUX
voltage (below which configuration data might be lost) 2.0 – – V
I
REF
V
REF
leakage current per pin –10 – 10 µA
I
L
Input or output leakage current per pin (sample-tested) –10 – 10 µA
I
HS
Leakage current on pins during hot
socketing with FPGA unpowered
All pins except PROGRAM_B, DONE, and
JTAG pins when HSWAPEN = 1
–20 – 20 µA
PROGRAM_B, DONE, and JTAG pins, or other
pins when HSWAPEN = 0
I
HS
+ I
RPU
µA
C
IN
Die input capacitance at the pad – – 10 pF
I
RPU
Pad pull-up (when selected) @ V
IN
=0V, V
CCO
= 3.3V or V
CCAUX
= 3.3V 200 – 500 µA
Pad pull-up (when selected) @ V
IN
=0V, V
CCO
= 2.5V or V
CCAUX
= 2.5V 120 – 350 µA
Pad pull-up (when selected) @ V
IN
=0V, V
CCO
= 1.8V 60 – 200 µA
Pad pull-up (when selected) @ V
IN
=0V, V
CCO
= 1.5V 40 – 150 µA
Pad pull-up (when selected) @ V
IN
=0V, V
CCO
= 1.2V 12 – 100 µA
I
RPD
Pad pull-down (when selected) @ V
IN
=V
CCO
, V
CCAUX
= 3.3V 200 – 550 µA
Pad pull-down (when selected) @ V
IN
=V
CCO
, V
CCAUX
= 2.5V 140 – 400 µA
I
BATT
(1)
Battery supply current – – 150 nA
R
DT
(2)
Resistance of optional input differential termination circuit, V
CCAUX
= 3.3V – 100 – Ω
R
IN_TERM
(4)
Thevenin equivalent resistance of programmable input termination
(UNTUNED_SPLIT_25)
23 25 55 Ω
Thevenin equivalent resistance of programmable input termination
(UNTUNED_SPLIT_50)
39 50 72 Ω
Thevenin equivalent resistance of programmable input termination
(UNTUNED_SPLIT_75)
56 75 109 Ω
Notes:
1. Maximum value specified for worst case process at 25°C. XC6SLX75, XC6SLX75T, XC6SLX100, XC6SLX100T, XC6SLX150, and XC6SLX150T
only.
2. Refer to IBIS models for R
DT
variation and for values at V
CCAUX
=2.5V.
3. V
CCO2
is not required for data retention. The minimum V
CCO2
for power-on reset and configuration is 1.65V.
4. Termination resistance to a V
CCO
/2 level.
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v1.9) August 23, 2010 www.xilinx.com
Advance Product Specification 5
Quiescent Current
Typical values for quiescent supply current are specified at nominal voltage, 25°C junction temperatures (T
j
). Quiescent
supply current is specified by speed grade for Spartan-6 devices. Xilinx recommends analyzing static power consumption
using the XPOWER™ Estimator (XPE) tool (download at http://www.xilinx.com/power
) for conditions other than those
specified in Ta bl e 5 .
Table 5: Typical Quiescent Supply Current
Symbol Description Device
Speed Grade
Units
-4 -3 -2 -1L
I
CCINTQ
Quiescent V
CCINT
supply current XC6SLX4 N/A 4.0 4.0 2.4 mA
XC6SLX9 N/A 4.0 4.0 2.4 mA
XC6SLX16 N/A 6.0 6.0 4.0 mA
XC6SLX25 N/A 11.0 11.0 6.6 mA
XC6SLX25T 11.0 11.0 11.0 N/A mA
XC6SLX45 N/A 15.0 15.0 9.0 mA
XC6SLX45T 15.0 15.0 15.0 N/A mA
XC6SLX75 N/A 29.0 29.0 17.4 mA
XC6SLX75T 29.0 29.0 29.0 N/A mA
XC6SLX100 N/A 36.0 36.0 21.6 mA
XC6SLX100T 36.0 36.0 36.0 N/A mA
XC6SLX150 N/A 51.0 51.0 31.0 mA
XC6SLX150T 51.0 51.0 51.0 N/A mA
I
CCOQ
Quiescent V
CCO
supply current XC6SLX4 N/A 1.0 1.0 1.0 mA
XC6SLX9 N/A 1.0 1.0 1.0 mA
XC6SLX16 N/A 2.0 2.0 2.0 mA
XC6SLX25 N/A 2.0 2.0 2.0 mA
XC6SLX25T 2.0 2.0 2.0 N/A mA
XC6SLX45 N/A 3.0 3.0 3.0 mA
XC6SLX45T 3.0 3.0 3.0 N/A mA
XC6SLX75 N/A 4.0 4.0 4.0 mA
XC6SLX75T 4.0 4.0 4.0 N/A mA
XC6SLX100 N/A 5.0 5.0 5.0 mA
XC6SLX100T 5.0 5.0 5.0 N/A mA
XC6SLX150 N/A 7.0 7.0 7.0 mA
XC6SLX150T 7.0 7.0 7.0 N/A mA
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