IEC61000-4-6-2013.pdf

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IEC61000-4-6-2013,国际电磁兼容标准中的传导干扰,最不容易通过的标准
IEC Ec61000-4-6 Edition4.02013-10 INTERNATIONAL STANDARD NORME INTERNATIONALE colour inside BASIC EMC PUBLICATION PUBLICATION FONDAMENTALE EN CEM Electromagnetic compatibility(EMC) Part 4-6: Testing and measurement techniques -Immunity to conducted disturbances, induced by radio-frequency fields Compatibilite electromagnetiquece EM) Partie 4-6: Techniques d'essai et de mesure -Immunite aux perturbations conduits, induites par les champs radioelectriques INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE PRICE CODE CODE PRIX XC cs33.100.20 SBN9782-8322-1176-2 Warning Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agree. B Registered trademark of the International Electrotechnical Commission Marque depose de la Commission Electrotechnicue Internationale 2 610004-6⊙|EC2013 CONTENTS FOREWORD INTRODUCTION Scope 8 2 Normative references 3 Terms and definitions 8 4 General 10 5 Test levels 12 6 Test equipment and level adjustment procedures 13 6.1 Test generator 13 6.2 Coupling and decoupling devices 15 6.2.1 General 15 6.2.2 Coupling/ decoupling networks(CDNs).……18 6.2.3 Clamp injection devices 20 6.2.4 Direct injection devices 22 6.2.5 Decoupling networks 6.3 Verification of the common mode impedance at the eUt port of coupling and decoupling devices 23 6.3.1 General 23 6.3.2 Insertion loss of the 150 Q2 to 50 Q2 adapters .23 6.4 Setting of the test generator 25 6.4.1 General 25 6.4.2 Setting of the output level at the eUt port of the coupling device.… 6 7 Test setu d injection methods 28 7.1 Test setup 28 7.2 EUT comprising a single unit 28 EUT com prising several units 29 7.4 Rules for selecting injection methods and test points 30 7.4.1 Genera|∴ 30 7.4.2 Injection method 30 7.4.3 Ports to be tested 31 CDN injection application .32 7.6 Clamp injection application when the common mode impedance requirements can be me 33 7.7 Clamp injection application when the common mode impedance requirements cannot be met.…… 35 7.8 ect injection applica 35 8 Test procedure.… 36 9 Evaluation of the test results 37 10 Test report 37 Annex a( normative) EM and decoupling clamps..….….… .39 Annex B(informative) Selection criteria for the frequency range of application 49 Annex C(informative) Guide for selecting test levels Annex d(informative)Information on coupling and decoupling networks 55 Annex E(informative) Information for the test generator specification 57 Annex F(informative) Test setup for large EUTs 58 610004-6@|EC:2013 Annex G(informative) Measurement uncertainty of the voltage test level ..61 Annex H (informative) Measurement of AE impedance Annex I(informative) Port to port injection Annex J(informative)Amplifier compression and non-linearity 78 Bibliography 83 Figure 1 -Immunity test to RF conducted disturbances 12 Figure 2-Open circuit waveforms at the eUT port of a coupling device for test level...13 Figure 3-Test generator setup Figure4- Principle of coupling and decoupling…………, 58 Figure 5- Principle of coupling and decoupling according to the clamp injection method 20 Figure 6- Example of circuit for level setting setup in a 150 Q2 test jig Figure 7-Example circuit for evaluating the performance of the current clamp 22 Figure 8- Details of setups and components to verify the essential characteristics of coupling and decoupling devices and the 150 Q2 to 50 Q2 adapters 25 Figure 9- Setup for level setting 27 Figure 10- Example of test setup with a single unit EUT(top view ).... .29 Figure 1 -Example of a test setup with a multi-unit EUT(top view) 30 Figure 12- Rules for selecting the injection method 31 Figure 13-Immunity test to 2-port EUT (when only one CDN can be used) 33 Figure 14- General principle of a test setup using clamp injection devices .34 Figure 15- Example of the test unit locations on the ground plane when using injection clamps(top view 35 Figure A. 1-Example: Construction details of the EM clamp 40 Figure A. 2-Example: Concept of the EM clamp 41 Figure A 3-Dimension of a reference plane 42 Figure A 4- Test jig 42 Figure A5-Test jig with inserted clamp 42 Figure A.6-Impedance decoupling factor measurement setup 43 Figure A 7- Typical examples for clamp impedance, 3 typical clamps 44 Figure A8- Typical examples for decoupling factors, 3 typical clamps 45 Figure A 9- Normalization setup for coupling factor measurement 45 Figure A. 10-S21 coupling factor measurement setup 46 Figure A 11-Typical examples for coupling factor, 3 typical clamps 46 Figure A 12 -Decoupling clamp characterization measurement setup 47 Figure A 13-Typical examples for the decoupling clamp impedance 47 Figure A.14- Typical examples for decoupling factors.…..….…...…… 48 Figure B. 1- start frequency as function of cable length and equipment size ..50 Figure D. 1-Example of a simplified diagram for the circuit of CDN-s1 used with screened cables(see 6.2.2.5) 53 Figure D2- EXample of simplified diagram for the circuit of CDN-M1/M2/-M3 used with unscreened supply(mains)lines(see 6.2.2.2 53 Figure D3- Example of a simplified diagram for the circuit of cDN-AF2 used with unscreened unbalanced lines(see 6.2.2. 4) .54 4 610004-6⊙|EC2013 Figure D 4- Example of a simplified diagram for the circuit of a CDN-T2, used with an unscreened balanced pair(see 6.2.2.3) 54 Figure D5- Example of a simplified diagram of the circuit of a CDN-T4 used with unscreened balanced pairs(see 6.2.2.3) Figure D6- EXample of a simplified diagram of the circuit of a CDN AF8 used with unscreened unbalanced lines(see6.22.4)…… .55 Figure D.7-Example of a simplified diagram of the circuit of a CDN-T8 used with unscreened balanced pairs(see 6.2.2.3)...... 56 Figure F. 1-EXample of large EUT test setup with elevated horizontal reference ground plane 59 Figure F 2- Example of large EUT test setup with vertical reference ground plane 60 Figure G 1- Example of influences upon voltage test level using CDN 62 Figure G.2-Example of influences upon voltage test level using EM clamp 62 Figure G 3- Example of influences upon voltage test level using current clamp 63 Figure G 4- Example of influences upon voltage test level using direct injectio 63 Figure G 5-Circuit for level setting setup 64 Figure H. 1-Impedance measurement using a voltmeter .73 Figure H. 2-Impedance measurement using a current probe 74 Figure 1. 1-Example of setup, port-port injection 77 Figure J1- Amplifier linearity measurement setup 80 Figure J 2- Linearity characteristic Figure J.3-Measurement setup for modulation depth 81 Figure J 4- Spectrum of AM modulated signal .82 Table 1- test levels 13 Table 2- Characteristics of the test generator .14 Table 3-Main parameter of the combination of the coupling and decoupling device 15 Tabe4- Usage of CDNs.,…… 18 Table B. 1- Main parameter of the combination of the coupling and decoupling device when the frequency range of test is extended above 80 MHz 49 Table E.1-Required power amplifier output power to obtain a test level of 10 v .57 Table g.1- CDN level setting process.……… .65 Table G.2-Cdn test process 65 Table G. 3-EM clamp level setting process 67 Table G. 4-EM clamp test process .67 Table G.5-Current clamp level setting process........................68 Table G.6-Current clamp test process 69 Table G 7- Direct injection level setting process 70 Table G 8- Direct injection test process 70 Table H. 1-Impedance requirements for the ae... 72 Table H 2-Derived voltage division ratios for AE impedance measurements 73 Table H3-Derived voltage ratios for AE impedance measurements 74 610004-6@|EC:2013 INTERNATIONAL ELECTROTECHNICAL COMMISSION ELECTROMAGNETIC COMPATIBILITY (EMC) Part 4-6: Testing and measurement techniques Immunity to conducted disturbances, induced by radio-frequency fields FOREWORD 1)The International Electrotechnical Commission(IEC)is a worldwide organization for standardization comprising lI national electrotechnical committees(IEC National Committees ). The object of Iec is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, lEc publishes International standards. Technical Specifications Technical Reports, Publicly Available Specifications (PAS)and Guides (hereafter referred to as"IEC Publication()). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non governmental organizations liaising with the lEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (Iso) in accordance with conditions determined by agreement between the two organizations. 2)The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from al interested iec national committees 3IEC Publications have the form of recommendations for international use and are accepted by lEc Nati Com mittees in that sense while all reasonable efforts are made to ensure that the technical content of Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user 4)In order to promote international uniformity, IEC National Committees undertake to apply lEc Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in 5)IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEc marks of conformity. IEC is not responsible for any services carried out by independent certification bodies 6)All users should ensure that they have the latest edition of this publication 7 No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical com mittees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEc Publication or any other IEC Publications B) Attention is drawn to the normative references cited in this publication Use of the referenced publications is dispensable for the correct application of this publication 9 Attention is drawn to the possibility that some of the elements of this lEc Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights International Standard lEc 61000-4-6 has been prepared by subcommittee 77B: High frequency phenomena, of IEC technical committee 77: Electromagnetic compatibility It forms Part 4-6 of IEC 61000. It has the status of a basic EMC publication in accordance with IEC Guide 107 This fourth edition cancels and replaces the third edition published in 2008 and constitutes a technical revision This edition includes the following significant technical changes with respect to the previous edition a)use of the CDNs b)calibration of the clamps; c)reorganization of Clause 7 on test setup and injection methods; 6100046|EC:2013 d)Annex a which is now dedicated to EM and decoupling clamps e)Annex G which now addresses the measurement uncertainty of the voltage test level f)informative Annexes H, I and J which are new The text of this standard is based on the following documents FDIS Report on voting 77B/691FD|S 77B/704RvD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table This publication has been drafted in accordance with the iSo/EC Directives, Part 2. A list of all parts in the IEC 61000 series, published under the general title Electromagnetic compatibility(EMC), can be found on the IEC website The committee has decided that the contents of this publication will remain unchanged until thestabilitydateindicatedonthelecwebsiteunderhttp://webstore.iecchinthedata related to the specific publication. At this date, the publication will be · reconfirmed withdrawn replaced by a revised edition, or amended IMPORTANT- The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be usefu for the correct understanding of its contents. Users should therefore print this document using a colour printer 610004-6@|EC:2013 INTRODUCTION lEC 61000 is published in separate parts according to the following structure Part 1: eneral General considerations(introduction, fundamental principles) Definitions, terminology Part 2: Environment Description of the environment Classification of the environment Compatibility levels Part 3: Limits Emission limits Immunity limits (in so far as they do not fall under the responsibility of the product committees Part 4: Testing and measurement techniques Measurement techniques Testing techniques Part 5: Installation and mitigation guidelines Installation guidelines Mitigation methods and devices Part 6: Generic standards Part 9: Miscellaneous Each part is further subdivided into several parts, published either as international standards or as technical specifications or technical reports, some of which have already been published as sections. Others will be published with the part number followed by a dash and a second number identifying the subdivision(example: IEC 61000-6-1) related to conducted disturbances induced by radio-frequency fields. ents and test procedures This part is an international standard which gives immunity requirem

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