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S5PV210

硬件设计向导

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S5PV210_HARDWARE DESING GUIDE REV 1.0

Hardware Design

Guide

S5PV210

RISC Microprocessor

FEB 8, 2010

REV 1.0

S5PV210_HARDWARE DESING GUIDE REV 1.0

Important Notice

The information in this publication has been carefully

checked and is believed to be entirely accurate at the

time of publication. Samsung assumes no

responsibility, however, for possible errors or

omissions, or for any consequences resulting from the

use of the information contained herein.

Samsung reserves the right to make changes in its

products or product specifications with the intent to

improve function or design at any time and without

notice and is not required to update this

documentation to reflect such changes.

This publication does not convey to a purchaser of

semiconductor devices described herein any license

under the patent rights of Samsung or others.

Samsung makes no warranty, representation, or

guarantee regarding the suitability of its products for

any particular purpose, nor does Samsung assume

any liability arising out of the application or use of any

product or circuit and specifically disclaims any and all

liability, including without limitation any consequential

or incidental damages.

"Typical" parameters can and do vary in different

applications. All operating parameters, including

"Typicals" must be validated for each customer

application by the customer's technical experts.

Samsung products are not designed, intended, or

authorized for use as components in systems

intended for surgical implant into the body, for other

applications intended to support or sustain life, or for

any other application in which the failure of the

Samsung product could create a situation where

personal injury or death may occur.

Should the Buyer purchase or use a Samsung product

for any such unintended or unauthorized application,

the Buyer shall indemnify and hold Samsung and its

officers, employees, subsidiaries, affiliates, and

distributors harmless against all claims, costs,

damages, expenses, and reasonable attorney fees

arising out of, either directly or indirectly, any claim of

personal injury or death that may be associated with

such unintended or unauthorized use, even if such

claim alleges that Samsung was negligent regarding

the design or manufacture of said product

S5PV210_HARDWARE DESING GUIDE REV 1.0

Table of Contents

1. OVERVIEW...............................................................................................................................................8

1.1. S5PV210 Pin Information...........................................................................................................................8

2. BALL NUMBER ASSIGNMENT .............................................................................................................63

3. POWER...................................................................................................................................................71

3.1. Pin Power Domain....................................................................................................................................71

3.2. Recommend Operating Conditions........................................................................................................73

3.3. Circuit design without level shifter ........................................................................................................75

3.4. Power On/Off Sequence..........................................................................................................................76

3.5. Pin configuration guide in Sleep mode .................................................................................................78

4. SYSCON .................................................................................................................................................79

4.1. Signal Description....................................................................................................................................79

4.2. Booting Option .........................................................................................................................................81

4.3. Feature of the IROM Boot mode.............................................................................................................82

4.4. Clock..........................................................................................................................................................83

5. MEMORY SUBSYSTEM.........................................................................................................................85

5.1. Signal Description....................................................................................................................................85

5.2. TQ : Temperature Indicator.....................................................................................................................85

5.3. PCB LAYOUT GUIDELINES FOR MEMORY...........................................................................................85

6. SROM CONTROLLER............................................................................................................................88

6.1. Signal Description....................................................................................................................................88

6.2. SRAM/ROM Interface Examples .............................................................................................................89

7. ONENAND CONTROLLER.....................................................................................................................90

7.1. Signal Description....................................................................................................................................90

7.2. Circuit Diagram Example.........................................................................................................................91

8. NAND FLASH CONTROLLER ...............................................................................................................92

8.1. Signal Description....................................................................................................................................92

9. CF CONTROLLER..................................................................................................................................94

9.1. CFCON feature .........................................................................................................................................94

9.2. Signal Description....................................................................................................................................94

9.3. CF 1-slot operation guide........................................................................................................................95

9.4. CF 2-slot operation guide........................................................................................................................96

10. PWM TIMER........................................................................................................................................97

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