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生产管理
生产管理 .............................................................................................................................1
来料检 ..........................................................................................................................5
1. 已烧录芯片检查固件版本信息...........................................................................5
2. 通用料检测...........................................................................................................5
2.1. 阻容类抽测1-2颗 ..........................................................................................5
3. 配件检测...............................................................................................................5
4. 来料检验记录.......................................................................................................5
5. 检验报告单...........................................................................................................5
6. 原材料异常处理单...............................................................................................5
入库 .............................................................................................................................5
1. 来料欠料表...........................................................................................................5
2. 进料日报表...........................................................................................................5
库房管理 .....................................................................................................................5
1. 物料收发卡...........................................................................................................5
出库 .............................................................................................................................6
1. 生产车间物料发放记录表...................................................................................6
上料 .............................................................................................................................6
1. 确认批次...............................................................................................................6
1.1. 1、时间因素 .................................................................................................6
1.2. 2、硬件变动视为不同批次 .........................................................................6
2. 换料.......................................................................................................................6
2.1. 不同批次 .......................................................................................................6
2.2. 同一批次 .......................................................................................................6
2.3. 换料记录 .......................................................................................................6
3. 核对完成后，签单确认.......................................................................................6
3.1. 站位表 ...........................................................................................................6
3.2. 上料记录 .......................................................................................................7
AOI ...............................................................................................................................7
1. 1、实时检测，发现问题就汇报.........................................................................7
2. 2、检测点明确.....................................................................................................7
2.1. 结合AOI .........................................................................................................7
2.2. 大件芯片目检 ...............................................................................................7
3. 3、签单确认.........................................................................................................7
3.1. 按生产批次 ...................................................................................................7
3.2. 保证同一批次，当天实时检测 ...................................................................7

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3.3. 工序专检记录表 ...........................................................................................7
烧录 .............................................................................................................................7
1. 固件版本确认.......................................................................................................7
2. 有问题及时反馈...................................................................................................7
3. 按批次签单...........................................................................................................7
4. 签单.......................................................................................................................7
4.1. 芯片烧录记录表 ...........................................................................................7
后段焊接 .....................................................................................................................8
1. 焊前检测...............................................................................................................8
1.1. 1、插件方向是否正确 .................................................................................8
1.2. 2、元器件正负极确认 .................................................................................8
2. 焊接检测...............................................................................................................8
2.1. 1、检测是否有漏焊 .....................................................................................8
2.2. 2、检测是否虚焊 .........................................................................................8
2.3. 3、检测是否有连锡 .....................................................................................8
3. 工序专检记录表...................................................................................................8
首件确认 .....................................................................................................................8
1. 新产品...................................................................................................................8
1.1. 1、全功能测试 .............................................................................................8
1.2. 2、装柜测试 .................................................................................................8
1.3. 3、高温老化 .................................................................................................9
1.4. 4、常温老化 .................................................................................................9
2. 量产产品...............................................................................................................9
2.1. 产品变动 .......................................................................................................9
2.2. 产品未变动 ...................................................................................................9
3. 首件登记...............................................................................................................9
4. 首件检验记录表...................................................................................................9
5. 首件类型...............................................................................................................9
5.1. SMT首件 ........................................................................................................9
5.2. 后段首件 .....................................................................................................10
5.3. 组装首件 .....................................................................................................10
组装 ........................................................................................................................10
1. 组装前测试 .....................................................................................................10
1.1. 1、测试基础功能....................................................................................10
1.2. 2、不良硬件记录....................................................................................10
2. 组装 .................................................................................................................10
2.1. 试产..........................................................................................................10