ASIC牛人之经典总结笔记版_数字IC设计入门资源-CSDN文库

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Typical ASIC design flow .................................................................................................................2

时钟抖动 (Clock Jitter) ....................................................................................................................5

信号同步的窍门...............................................................................................................................8

数字后端流程...................................................................................................................................9

DC 概论之一 setup time 与 hold time .......................................................................................11

DC 概论二之 fanout 与 skew.........................................................................................................14

DC 概论三之 setup time 与 hold time 之二................................................................................21

DC 概论四之 setup time 与 hold time 之三.................................................................................26

DC 概论五之 high fanout...............................................................................................................42

DC 概论六之 multicycle_path ......................................................................................................58

DC 概论七之 gated clock...............................................................................................................75

DC 概论之 IO 约束........................................................................................................................84

DC 优化约束 ..................................................................................................................................90

Synopsys Synthesis Constraints Template ......................................................................................92

功耗和门控时钟的的基本概念.....................................................................................................95

对 FALSE PATH 的理解 ................................................................................................................97

TimeQuest 时钟分析....................................................................................................................101

静态时序分析...............................................................................................................................105

寄生参数提取和静态时序分析...................................................................................................124

IC 设计中的时钟类型约束..........................................................................................................130

IC 设计流程及工具......................................................................................................................132

Typical ASIC design flow

Step 1: Prepare an Requirement Specification

Step 2: Create an Micro-Architecture Document.

Step 3: RTL Design & Development of IP's

Step 4: Functional verification all the IP's/Check whether the RTL is free from

Linting Errors/Analyze whether the RTL is Synthesis friendly.

Step 4a: Perform Cycle-based verification(Functional) to verify the protocol

behaviour of the RTL

Step 4b: Perform Property Checking , to verify the RTL implementation and the

specification understanding is matching.

Step 5: Prepare the Design Constraints file (clock

definitions(frequency/uncertainity/jitter),I/O delay definitions, Output pad load

definition, Design False/Multicycle-paths) to perform Synthesis, usually called as an

SDC synopsys_constraints, specific to synopsys synthesis Tool (design-compiler)

Step 6: To Perform Synthesis for the IP, the inputs to the tool are (library file(for

which synthesis needs to be targeted for, which has the functional/timing information

available for the standard-cell library and the wire-load models for the wires based on

the fanout length of the connectivity), RTL files and the Design Constraint files, So

that the Synthesis tool can perform the synthesis of the RTL files and map and

optimize to meet the design-constraints requirements. After performing synthesis, as a

part of the synthesis flow, need to build scan-chain connectivity based on the

DFT(Design for Test) requirement, the synthesis tool (Test-compiler), builds the

scan-chain.

7: Check whether the Design is meeting the requirements

(Functional/Timing/Area/Power/DFT) after synthesis.

Step 7a: Perform the Netlist-level Power Analysis, to know whether the design is

meeting the power targets.

Step 7b: Perform Gate-level Simulation with the Synthesized Netlist to check whether

the design is meeting the functional requirements.

Step 7c: Perform Formal-verification between RTL vs Synthesized Netlist to confirm

that the synthesis Tool has not altered the functionality.

Step 7d: Perform STA(Static Timing Analysis) with the SDF(Standard Delay Format)

验证

准备设计

约束文件

DC对IP综合

综合之后

检查设计

是否满足

各种要求

（功能、

时序、面

积、功耗

等）

功能验证

形式验证

静态时序分析

file and synthesized netlist file, to check whether the Design is meeting the

timing-requirements.

Step 7e: Perform Scan-Tracing , in the DFT tool, to check whether the scan-chain is

built based on the DFT requirement.

Step 8: Once the synthesis is performed the synthesized netlist file(VHDL/Verilog

format) and the SDC (constraints file) is passed as input files to the Placement and

Routing Tool to perform the back-end Actitivities.

Step 9: The next step is the Floor-planning, which means placing the IP's based on the

connectivity,placing the memories, Create the Pad-ring, placing the

Pads(Signal/power/transfer-cells(to switch voltage domains/Corner pads(proper

accessibility for Package routing), meeting the SSN requirements(Simultaneous

Switching Noise) that when the high-speed bus is switching that it doesn't create any

noise related acitivities, creating an optimised floorplan, where the design meets the

utilization targets of the chip.

Step 9a : Release the floor-planned information to the package team, to perform the

package feasibility analysis for the pad-ring .

Step 9b: To the placement tool, rows are cut, blockages are created where the tool is

prevented from placing the cells, then the physical placement of the cells is performed

based on the timing/area requirements.The power-grid is built to meet the

power-target's of the Chip .

Step 10: The next step is to perform the Routing., at first the Global routing and

Detailed routing, meeting the DRC(Design Rule Check) requirement as per the

fabrication requirement.

Step 11: After performing Routing then the routed Verilog netlist, standard-cells

LEF/DEF file is taken to the Extraction tool (to extract the parasitics(RLC) values of

the chip in the SPEF format(Standard parasitics Exchange Format), and the SPEF file

is generated.

Step 12: Check whether the Design is meeting the requirements

(Functional/Timing/Area/Power/DFT/DRC/LVS/ERC/ESD/SI/IR-Drop) after

Placement and Routing step.

Step 12a: Perform the Routed Netlist-level Power Analysis, to know whether the

design has met the power targets.

Step 12b: Perform Gate-level Simulation with the routed Netlist to check whether the

design is meeting the functional requirement .

布局布线之后

检查设计是否

满足各种要求

功能验证

Step 12c: Perform Formal-verification between RTL vs routed Netlist to confirm that

the place & route Tool has not altered the functionality.

Step 12d: Perform STA(Static Timing Analysis) with the SPEF file and routed netlist

file, to check whether the Design is meeting the timing-requirements.

Step 12e: Perform Scan-Tracing , in the DFT tool, to check whether the scan-chain is

built based on the DFT requirement, Peform the Fault-coverage with the DFT tool and

Generate the ATPG test-vectors.

Step 12f: Convert the ATPG test-vector to a tester understandable format(WGL)

Step 12g: Perform DRC(Design Rule Check) verfication called as

Physical-verification, to confirm that the design is meeting the Fabrication

requirements.

Step 12h: Perform LVS(layout vs Spice) check, a part of the verification which takes

a routed netlist converts to spice (call it SPICE-R) and convert the Synthesized

netlist(call it SPICE-S) and compare that the two are matching.

Step 12i : Perform the ERC(Electrical Rule Checking) check, to know that the design

is meeting the ERC requirement.

Step 12j: Perform the ESD Check, so that the proper back-to-back diodes are placed

and proper guarding is there in case if we have both analog and digital portions in our

Chip. We have seperate Power and Grounds for both Digital and Analog Portions, to

reduce the Substrate-noise.

Step 12k: Perform seperate STA(Static Timing Analysis) , to verify that the

Signal-integrity of our Chip. To perform this to the STA tool, the routed netlist and

SPEF file(parasitics including coupling capacitances values), are fed to the tool. This

check is important as the signal-integrity effect can cause cross-talk delay and

cross-talk noise effects, and hinder in the functionality/timing aspects of the design.

Step 12l: Perform IR Drop analysis, that the Power-grid is so robust enough to

with-stand the static and dynamic power-drops with in the design and the IR-drop is

with-in the target limits.

Step 13: Once the routed design is verified for the design constraints, then now the

next step is chip-finishing activities (like metal-slotting, placing de-coupling caps).

Step 14: Now the Chip Design is ready to go to the Fabrication unit, release files

which the fab can understand, GDS file.

等价性验证

静态时序分析

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