ISO 26262-11:2018(E)
Foreword ..........................................................................................................................................................................................................................................v
Introduction
................................................................................................................................................................................................................................ vi
1 Scope ................................................................................................................................................................................................................................. 1
2 Normative references ...................................................................................................................................................................................... 1
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4 A semiconductor component and its partitioning ............................................................................................................ 2
4.1 How to consider semiconductor components ............................................................................................................. 2
4.1.1 Semiconductor component development .................................................................................................. 2
4.2 Dividing a semiconductor component in parts ........................................................................................................... 2
..................................................................................................... 3
4.3.1 Fault models......................................................................................................................................................................... 3
4.3.2 Failure modes ..................................................................................................................................................................... 4
4.3.3 The distribution of base failure rate across failure modes .......................................................... 4
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4.5.1 About IP ................................................................................................................................................................................... 6
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4.5.4 Work products for IP ................................................................................................................................................. 11
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4.6 Base failure rate for semiconductors ................................................................................................................................15
..................................................................................... 15
4.6.2 Permanent base failure rate calculation methods ...........................................................................20
................................................................................................................. 41
4.7.1 Introduction to DFA .................................................................................................................................................... 41
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4.7.3 Dependent failure scenarios ............................................................................................................................... 42
4.7.4 Distinction between cascading failures and common cause failures .............................. 45
4.7.5 Dependent failure initiators and mitigation measures................................................................ 45
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.................................................................................................54
4.7.8 Dependent failures between software element and hardware element .......................55
4.8 Fault injection ....................................................................................................................................................................................... 55
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4.8.2 Characteristics or variables of fault injection ...................................................................................... 55
4.8.3 Fault injection results ............................................................................................................................................... 57
4.9 Production and Operation .......................................................................................................................................................... 57
4.9.1 About Production ......................................................................................................................................................... 57
4.9.2 Production Work Products ................................................................................................................................... 58
....................................... 58
4.10 Interfaces within distributed developments .............................................................................................................. 58
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5.1 Digital components and memories..................................................................................................................................... 60
5.1.1 About digital components ..................................................................................................................................... 60
........................................................................... 60
5.1.3 Detailed fault models of memories ............................................................................................................... 61
5.1.4 Failure modes of digital components ..........................................................................................................62
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