altera公司 各类型芯片管脚图及封装
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2008-11-28
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Altera Corporation 1
May 2008 version 15.1 Data Sheet
DS-PKG-15.1
Document
Revision
History
Table 1 shows the revision history for this document.
Table 1. Document Revision History (1) (Part 1 of 2)
Date and
Document
Version
Changes Made Summary of Changes
May 2008 ● Added 1932-Pin FBGA Data Sheet
● Added Device and Package Cross Reference table
for Stratix IV
Updated for version 15.1.
April 2008
● Revised Maximum Lead Coplanarity values for
1517-Pin FBGA and 1760-Pin FBGA Data Sheets
● Added three entries to Table 3
● Corrected minor typos in Table 4 and Table 10
● Corrected HC210W package in Table 12
● Many tables updated for formatting consistency
Updated for version 15.0.
February 2008
● Added 164-Pin MBGA information in Table 8
● Added HardCopy II device information in Table 12
● Updated Stratix III thermal resistance values in Table
22
● Added 164-Pin MBGA Data Sheet
● Corrected 8-Pin SOIC Data Sheet (changed “B” to
“b” in Package Outline Dimension Table)
● Corrected 68-Pin MBGA Data Sheet (changed
“Inches” to “Millimeters” in Package Outline
Dimension Table)
Updated for version 14.9.
October 2007
● Removed note from 100-Pin PQFP Option 1 Data
Sheet
● Removed 100-Pin PQFP Option 2 Data Sheet
● Updated 88-Pin UBGA, 144-Pin EQFP, 256-Pin
FBGA Option 1, 256-Pin FBGA Option 2, 256-Pin
UBGA, 1517-Pin FBGA, and 1760-Pin FBGA Data
Sheets
● Added 780-Pin HBGA and 1152-Pin HBGA Data
Sheets
Updated for version 14.8.
Altera Device
Package Information
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资源评论
Gavin20992015-04-30有用，找了好久，总算找到了
sure_1262012-11-21比较齐全的资料
milan912017-02-21比较好的资料，谢谢楼主！
