Ti 10G 光模块原理图

所需积分/C币:49 2014-07-26 17:14:29 51KB PDF
收藏 收藏

此德州仪器 (TI) 参考设计旨在演示 ONET1151L 激光驱动器、ONET8551T 高增益互阻抗放大器 (TIA) 和 ONET1151P 限幅放大器的光学性能。此参考设计提供与 10.3125Gbps SFP+ LR 光学模块兼容的小巧规格,采用 SFP+ 主机板和用户友好型 GUI,可帮助客户缩短评估时间。除各种 ONET 器件之外,该参考设计还包括一个 MSP430FR5728 微控制器(MCU,用于控制设置)和一个高效率 MicroSiP 降压转换器 TPS82693(用于为集成电路提供 2.85V 电源以降低模块功率损耗)。
IMPORTANT NOTICE FOR TI REFERENCE DESIGNS Texas Instruments Incorporated (Ti")reference designs are solely intended to assist designers("Buyers")who are developing systems that incorporate Ti semiconductor products (also referred to herein as components"). Buyer understands and agrees that Buyer remains responsible for using its independent analysis, evaluation and judgment in designing Buyer's systems and products TI reference designs have been created using standard laboratory conditions and engineering practices. TI has not conducted any testing other than that specifically described in the published documentation for a particular reference design ti may make corrections, enhancements, improvements and other changes to its reference designs Buyers are authorized to use Ti reference designs with the ti component(s)identified in each particular reference design and to modify the reference design in the development of their end products HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT. AND NO LICENSE TO ANY THIRD PARTY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT, IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from Ti under the patents or other intellectual property of TI REFERENCE DESIGNS ARE PROVIDEDAS IS" TI MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THE REFERENCE DESIGNS OR USE OF THE REFERENCE DESIGNS. EXPRESS IMPLIED OR STATUTORY INCLUDING ACCURACY OR COMPLETENESS, TI DISCLAIMS ANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY FITNESS FOR A PARTICULAR PURPOSE, QUIET ENJOYMENT. QUIET POSSESSION. AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS WITH REGARD TO TI REFERENCE DESIGNS OR USE THEREOF. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY BUYERS AGAINST ANY THIRD PARTY INERINGEMENT CLAIM THAT RELATES TO OR S BASED ON A COMBINATION OF COMPONENTS PROVIDED INA TI REFERENCE DESIGN. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL SPECIAL INCIDENTAL, CONSEQUENTIAL OR INDIRECT DAMAGES. HOWEVER CAUSED ON ANY THEORY OF LIABILITY AND WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. ARISING IN ANY WAY OUT OF TI REFERENCE DESIGNS OR BUYERS USE OF TI REFERENCE DESIGNS TI reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. Ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms and conditions of sale of semiconductor products. Testing and other quality control techniques for ti components are used to the extent TI deems necessary to support this warranty. EXcept where mandated by applicable law, testing of all parameters of each component is not necessarily performed TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards Reproduction of significant portions of Ti information in Ti data books, data sheets or reference designs is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for uch altered documentation Information of third parties may be subject to additional restrictions Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by tl Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards that anticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any Ti components in Buyers safety-critical applications In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms No TI components are authorized for use in FDa Class Ill ( or similar life-critical medical equipment unless authorized officers of the parties have executed an agreement specifically governing such use Only those TI components that TI has specifically designated as military grade or enhanced plastic"are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components that have not been so designated is solely at Buyer's risk, and Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use T has specifically designated certain components as meeting Iso/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, ti will not be responsible for any failure to meet ISo/TS16949 Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2014, Texas Instruments Incorporated

试读 3P Ti 10G 光模块原理图
立即下载 低至0.43元/次 身份认证VIP会员低至7折
taiziming 不错,很好的参考设计文件
chenxiaolin2017c 下载不成功,再试试
JiaoCL 挺好的文件,推荐一下
    Ti 10G 光模块原理图 49积分/C币 立即下载
    Ti 10G 光模块原理图第1页

    试读结束, 可继续阅读

    49积分/C币 立即下载 >