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Memory package. several memory psychology books.

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2008-10-03 上传 大小:25.44MB
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DDR package

Introduction Point-to-point designers face many challenges when laying out a new printed circuit board (PCB). The designer may need to arrange groups of devices within a certain area of the PCB, to place components away from critical keep-out zones, include additional solder pads for future componen

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Development of TSV interposer for flipchip package

IEEE document : Development of Through Silicon Via (TSV) interposer for memory module flip chip package

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Debugging Malloc Lab: Detecting Memory-Related Errors

Introduction The usual implementation of malloc and free are unforgiving to errors in their callers' code, including cases where the programmer overflows an array, forgets to free memory, or frees a memory block twice. This often does not affect the program immediately, waiting until the corrupted m

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ADOL-C a package for the automatic differentiation of algorithms written in C C++

The C11 package ADOL-C described here facilitates the evaluation of first and higher derivatives of vector functions that are defined by computer programs written in C or C11. The resulting derivative evaluation routines may be called from C/C11, Fortran, or any other language that can be linked wit

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海力士H9DA4GH4JJBMCR

NAND Flash and Mobile LPDDR 137-Ball Package-on-Package (PoP) MCP Combination Memory

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镁光 MT29CxGxxMAxBAxx-5_WT,IT

NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP

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W25M02GVZEIG.pdf

The W25M02GV (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GV die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as Concurrent Operations in

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Samsung MCP K5L5628JT(B)M Data Sheet v1.0

K5L5628JT(B)M MCP MEMORY Preliminary Multi-Chip Package MEMORY 256M Bit (16M x16) Synchronous Burst , Multi Bank NOR Flash / 128M Bit(8M x16) Synchronous Burst UtRAM

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镁光 DRAM HMC 规则 带宽160GB/s

Hybrid Memory Cube (HMC) is a single package containing four DRAM die and one logic die, all stacked together using through-silicon via (TSV) technology. Within each cube, memory is organized vertically— portions of each memory die are combined with the corresponding portions of the other memory die

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Cyclone II handbook

Cyclone II, Cyclone II handbook, Cyclone II memory blocks, Cyclone II external memory interfaces, Cyclone II I/O standards, Cyclone II PCB layout, Cyclone II package information, Cyclone II PLLs, Cyclone II architecture, Cyclone II timing specifications, Cyclone II DC characteristics

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最新版CPUZ

CPU-Z is a freeware that gathers information on some of the main devices of your system : Processor name and number, codename, process, package, cache levels. Mainboard and chipset. Memory type, size, timings, and module specifications (SPD). Real time measurement of each core's internal frequency,

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JSFBAB3YHABBG

Multi-Chip Package MEMORY 2G bit (1.8V) 4bit-ECC NAND Flash and 1G bit (1.8V/1.2V) LPDDR 2

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MLX81106芯片资料

对于该MLX81106芯片的中文介绍,希望对你有帮助8 pin device in SOIC8 package, 24kB Flash memory Support for Autoconfig according bus shunt method

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CPU-Z_1.86中文官方正版下载

CPU-Z_1.86中文官方正版下载 CPU-Z is a freeware that gathers information on some of the main devices of your system : Processor name and number, codename, process, package, cache levels. Mainboard and chipset. Memory type, size, timings, and module specifications (SPD). Real time measurement of each core's

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JESD250B.pdf

JEDEC GDDR6 spec,上传备用 This document defines the Graphics Double Data Rate 6 (GDDR6) Synchronous Graphics Random Access Memory (SGRAM) specification, including features, functionality, package, and pin assignments.

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ds1972.pdf

The DS1972 is a 1024-bit, 1-Wire® EEPROM chip organized as four memory pages of 256 bits each in a rugged iButton® package. Data is written to an 8-byte scratchpad, verified, and then copied to the EEPROM memory. As a special feature, the four memory pages can individually be write protected or put

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serf-1.3.9.tar.bz2

The Serf package contains a C-based HTTP client library built upon the Apache Portable Runtime (APR) library. It multiplexes connections, running the read/write communication asynchronously. Memory copies and transformations are kept to a minimum to provide high performance operation.

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8086 CPU 模拟器

emu8086 is the emulator of 8086 (Intel and AMD compatible) microprocessor and integrated assembler with tutorials for beginners. The emulator runs programs like the real microprocessor in step-by-step mode. It shows registers, memory, stack, variables and flags. All memory values

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高通 MSM8953 spec

高通MSM8953的device specification。The MSM™device uses the advanced 14 nm FinFET process for lower active power dissipation and faster peak CPU performance. It includes a customized 64-bit ARM  Cortex A-53 octa core applications processor non-packageon- package (non-PoP) LPDDR3 SDRAM memory.

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html+css+js制作的一个动态的新年贺卡

该代码是http://blog.csdn.net/qq_29656961/article/details/78155792博客里面的代码,代码里面有要用到的图片资源和音乐资源。

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