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Datacenter Secure Control
Module Specification
Authors:
Priya Raghu, Senior Hardware Engineer, Microsoft
Mark A. Shaw, Principal Hardware Engineering Manager, Microsoft
Prakash Chauhan, Server Architect, Google
Siamak Tavallaei, Chief Systems Architect, Google
Mike Branch, Server Architect, Google
Mason Possing, Hardware Engineer, Microsoft

Open Compute Project • DC-SCM Specification
http://opencompute.org ii
Revision History
Version
Date
Notes
0.8
Nov 9
th
2020
Initial public review.
0.95
Dec 2
nd
2020
Feedback Implemented
1.0
March 11
th
2021
Removed ESPI_CS1_N and replaced with RSVD3, Table 22:SPARE[0:1] desc,
Fig 22: Updated to initiator/Responder, Table 27: I3C pull-up updated to
STBY/MAIN, Sec 6: Platform interop wording edit, Sec 2.2.3- Typo( FFF>
HFF), Fig 3,4,5,6 updated, Table 3 updated

Open Compute Project • DC-SCM Specification
http://opencompute.org iii
Contributions to this Specification are made under the terms and conditions set forth in Open Web
Foundation Contributor License Agreement (“OWF CLA 1.0”) (“Contribution License”) by:
Microsoft Corporation,
Google LLC
Usage of this Specification is governed by the terms and conditions set forth in the Open Web
Foundation Final Specification Agreement (“OWFa 1.0”).
Note: The following clarifications, which distinguish technology licensed in the Contribution License
and/or Specification License from those technologies merely referenced (but not licensed), were
accepted by the Incubation Committee of the OCP:
INTELLIGENT PLATFORM MANAGEMENT INTERFACE (IPMI)
I2C TRADEMARK OF PHILLIPS SEMICONDUCTOR
I3C TRADEMARK OF MIPI ALLIANCE, INC
USB TRADEMARK OF USB IMPLEMENTORS FORUM, INC
PCIE TRADEMARK OF PCI-SIG
ESPI TRADEMARK OF INTEL CORP
NOTWITHSTANDING THE FOREGOING LICENSES, THIS SPECIFICATION IS PROVIDED BY OCP "AS IS" AND
OCP EXPRESSLY DISCLAIMS ANY WARRANTIES (EXPRESS, IMPLIED, OR OTHERWISE), INCLUDING IMPLIED
WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR A PARTICULAR PURPOSE, OR
TITLE, RELATED TO THE SPECIFICATION. NOTICE IS HEREBY GIVEN, THAT OTHER RIGHTS NOT GRANTED
AS SET FORTH ABOVE, INCLUDING WITHOUT LIMITATION, RIGHTS OF THIRD PARTIES WHO DID NOT
EXECUTE THE ABOVE LICENSES, MAY BE IMPLICATED BY THE IMPLEMENTATION OF OR COMPLIANCE
WITH THIS SPECIFICATION. OCP IS NOT RESPONSIBLE FOR IDENTIFYING RIGHTS FOR WHICH A LICENSE
MAY BE REQUIRED IN ORDER TO IMPLEMENT THIS SPECIFICATION. THE ENTIRE RISK AS TO
IMPLEMENTING OR OTHERWISE USING THE SPECIFICATION IS ASSUMED BY YOU. IN NO EVENT WILL
OCP BE LIABLE TO YOU FOR ANY MONETARY DAMAGES WITH RESPECT TO ANY CLAIMS RELATED TO, OR
ARISING OUT OF YOUR USE OF THIS SPECIFICATION, INCLUDING BUT NOT LIMITED TO ANY LIABILITY
FOR LOST PROFITS OR ANY CONSEQUENTIAL, INCIDENTAL, INDIRECT, SPECIAL OR PUNITIVE DAMAGES
OF ANY CHARACTER FROM ANY CAUSES OF ACTION OF ANY KIND WITH RESPECT TO THIS
SPECIFICATION, WHETHER BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGENCE), OR
OTHERWISE, AND EVEN IF OCP HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.

iv March 11
th
, 2021
Acknowledgement
With the hope of making this specification useful for the entire OCP community, we acknowledge and
appreciate the contributions, review, and feedback of over 150 individuals from 28 different companies.
References
• Open Compute Project. DC-SCM Subgroup. https://www.opencompute.org/projects/dc-scm-
sub-project
• PCI-SIG®. PCI Express® Base Specification, Revision 5.0 May 28th, 2019
• PCI-SIG®. PCI Express® Card Electromechanical Specification, Revision 4.0, September 2nd, 2019
• SMBus Management Interface Forum. System Management Bus (SMBus) Specification. System
Management Interface Forum, Inc, Version 2.0, August 3rd, 2000
• USB Implementers Forum. Universal Serial Bus Specification, Revision 2.0, April 27th, 2000
• DMTF Standard. DSP0222, Network Controller Sideband Interface (NC-SI) Specification.
Distributed Management Task Force (DMTF), Rev 1.2.0b, August 4th, 2020.
• MIPI alliance Specification for I3C Basic
SM
Version 1.0 – July 19
th
2018
• OCP NIC 3.0 Design Specification Version 1.0.9
Trademarks
Names and brands may be claimed as trademarks by their respective companies. I2C® is a trademark of
NXP Semiconductor. PCIe® and PCI Express® are the registered trademarks of PCI-SIG. I3C is a trademark
of MIPI Alliance, Inc.

Open Compute Project • DC-SCM Specification
http://opencompute.org 1
Table of Contents
1 Overview ....................................................................................................................................................... 5
1.1 DC-SCM Architecture .................................................................................................................................... 6
2 Mechanical .................................................................................................................................................... 7
2.1 Form Factor Options ..................................................................................................................................... 7
2.2 Horizontal Form Factor ................................................................................................................................ 8
2.2.1 Horizontal Form Factor Dimensions ....................................................................................................... 8
2.2.2 Horizontal Form Factor Keep Out Zones.................................................................................................. 9
2.2.3 Horizontal Form Factor I/O Faceplate ................................................................................................... 10
2.3 Vertical Form Factor ................................................................................................................................... 11
2.3.1 Vertical Form Factor Dimension Outline ............................................................................................... 11
3 Interface Definition ..................................................................................................................................... 16
3.1 DC-SCI Card Edge Connector Definition ...................................................................................................... 16
3.1 Gold Finger Plating Requirements .............................................................................................................. 17
3.2 HPM Connector Definition .......................................................................................................................... 17
3.2.1 Straddle Mount Connector .................................................................................................................... 17
3.2.2 Right Angle Connector ........................................................................................................................... 19
3.2.3 Vertical Connector ................................................................................................................................. 20
3.3 DC-SCI Pin Definition .................................................................................................................................. 20
3.4 DC-SCI Signal Descriptions .......................................................................................................................... 23
3.4.1 NC-SI ...................................................................................................................................................... 23
3.4.2 eSPI/SSIF ................................................................................................................................................ 23
3.4.3 Serial GPIO ............................................................................................................................................. 24
3.4.4 I2C .......................................................................................................................................................... 26
3.4.5 I3C .......................................................................................................................................................... 27
3.4.6 SPI .......................................................................................................................................................... 28
3.4.7 USB ......................................................................................................................................................... 30
3.4.8 PCIe ........................................................................................................................................................ 31
3.4.9 PECI ........................................................................................................................................................ 32
3.4.10 UARTS ................................................................................................................................................ 32
3.4.11 JTAG ................................................................................................................................................... 33
3.4.12 Standby Power and Boot Sequence .................................................................................................. 34
3.4.13 Battery Voltage .................................................................................................................................. 37
3.4.14 Miscellaneous Signals ........................................................................................................................ 37
4 Electrical Specifications ............................................................................................................................... 38
4.1 Input Voltage, Power, and Current ............................................................................................................. 38
4.2 SCM Presence Detection and Power Protection ......................................................................................... 38
5 Routing Guidelines and Signal Integrity ....................................................................................................... 39
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