UESTC-Ning Ning
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Chapter 2
Chip Level Interconnection
宁 宁宁 宁
芯片互连技术
集成电路封装测试与可靠性
UESTC-Ning Ning
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Wafer In
Wafer Grinding
(WG研磨)
Wafer Saw
(WS 切割)
Die Attach
(DA 黏晶)
Epoxy Curing
(EC 银胶烘烤)
Wire Bond
(WB 引线键合)
Die Coating
(DC 晶粒封胶/涂覆)
Molding
(MD 塑封)
Post Mold Cure
(PMC 模塑后烘烤)
Dejunk/Trim
(DT 去胶去纬)
Solder Plating
(SP 锡铅电镀)
Top Mark
(TM 正面印码)
Forming/Singular
(FS 去框/成型)
Lead Scan
(LS 检测)
Packing
(PK 包装)
典型的IC封装工艺流程
集成电路封装测试与可靠性
UESTC-Ning Ning
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电子级硅所含的硅的纯度很高，可
达 99.9999 99999 %
中德电子材料公司制作的晶棒(长度
达一公尺，重量超过一百公斤)
集成电路封装测试与可靠性
UESTC-Ning Ning
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Wafer Back Grinding
Purpose
The wafer backgrind process reduces the thickness of the
wafer produced by silicon fabrication (FAB) plant. The wash
station integrated into the same machine is used to wash away
debris left over from the grinding process.
Process Methods:
1) Coarse grinding by
mechanical. (粗磨)
2) Fine polishing by
mechanical or plasma
etching. (细磨抛光)
集成电路封装测试与可靠性
UESTC-Ning Ning
5
旋转及振荡轴
在旋转平盘上
之晶圆
下压力
工作台仅在指示有晶圆期间才旋转
Method:
The wafer is first mounted on a backgrind tape and is
then loaded to the backgrind machine coarse wheel. As
the coarse grinding is completed, the wafer is transferred
to a fine wheel for polishing.
集成电路封装测试与可靠性
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