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芯片iNAND规格书
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e.MMC 4.41 I/F
Released Data Sheet
80-36-03433
V1.2
August 2010
SanDisk Corporation
Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035
Phone (408) 801-1000 • Fax (408) 801-8657
www.sandisk.com
80-36-03433
SanDisk iNAND e.MMC 4.41 I/F - Data Sheet
© 2010 SanDisk Corporation - 2 - 80-36-03433
REVISION HISTORY
Doc. No
Revision
Date
Description
Reference
80-36-03433
1.0
25-Feb-10
Preliminary
80-36-03433
1.1
17-May-10
Released version.
New device marking spec was added
80-36-03433
1.2
12-Aug-10
Added X3 SKUs
SanDisk® Corporation general policy does not recommend the use of its products in life support applications where in a failure
or malfunction of the product may directly threaten life or injury. Per SanDisk Terms and Conditions of Sale, the user of SanDisk
products in life support applications assumes all risk of such use and indemnifies SanDisk against all damages. See “Disclaimer
of Liability.”
This document is for information use only and is subject to change without prior notice. SanDisk Corporation assumes no
responsibility for any errors that may appear in this document, nor for incidental or consequential damages resulting from the
furnishing, performance or use of this material. No part of this document may be reproduced, transmitted, transcribed, stored in
a retrievable manner or translated into any language or computer language, in any form or by any means, electronic,
mechanical, magnetic, optical, chemical, manual or otherwise, without the prior written consent of an officer of SanDisk
Corporation.
All parts of the SanDisk documentation are protected by copyright law and all rights are reserved.
SanDisk and the SanDisk logo are registered trademarks of SanDisk Corporation. Product names mentioned herein are for
identification purposes only and may be trademarks and/or registered trademarks of their respective companies.
© 2010 SanDisk Corporation. All rights reserved.
SanDisk products are covered or licensed under one or more of the following U.S. Patent Nos. 5,070,032; 5,095,344; 5,168,465;
5,172,338; 5,198,380; 5,200,959; 5,268,318; 5,268,870; 5,272,669; 5,418,752; 5,602,987. Other U.S. and foreign patents
awarded and pending.
80-36-03433. August 2010 Printed in U.S.A
80-36-03433
Table of Contents
SanDisk iNAND e.MMC 4.41 I/F - Data Sheet
© 2010 SanDisk Corporation 80-36-03433
3
TABLE OF CONTENTS
1. Introduction ......................................................................................................................... 5
1.1. General Description ...................................................................................................... 5
1.2. Plug-and-Play Integration ............................................................................................. 5
1.3. Feature Overview ......................................................................................................... 6
1.4. Functional Description .................................................................................................. 7
1.5. Technology Independence ........................................................................................... 7
1.6. Defect and Error Management ...................................................................................... 7
1.7. MMC bus and Power Lines ........................................................................................... 8
1.7.1. Bus operating conditions ................................................................................................. 8
2. e.MMC4.41 Features Overview ......................................................................................... 10
2.1. Boot ............................................................................................................................ 10
2.2. Automatic Sleep Mode ................................................................................................ 10
2.3. Sleep (CMD5) ............................................................................................................. 10
2.4. Enhanced Reliable Write ............................................................................................ 10
2.5. Secure Erase .............................................................................................................. 10
2.6. Secure Trim ................................................................................................................ 11
2.7. Trim ............................................................................................................................ 11
2.8. Partition management................................................................................................. 11
2.9. Enhanced Write Protection ......................................................................................... 12
2.10. High Priority Interrupt (HPI)......................................................................................... 12
2.11. H/W Reset .................................................................................................................. 12
2.12. DDR I/F ...................................................................................................................... 12
3. Product Specifications ..................................................................................................... 13
3.1. Typical Power Requirements ...................................................................................... 13
3.2. Operating Conditions .................................................................................................. 13
3.2.1. Operating and Storage Temperature Specifications ..................................................... 13
3.2.2. Moisture Sensitivity ........................................................................................................ 13
3.3. System Performance .................................................................................................. 13
3.4. Physical Specifications ............................................................................................... 15
4. Interface Description ......................................................................................................... 18
4.1. MMC I/F Ball Array ..................................................................................................... 18
4.2. Pins and Signal Description ........................................................................................ 21
4.2.1. Table 9 contains the SanDisk iNAND, with MMC interface (153 balls), functional pin
assignment. ................................................................................................................................ 21
80-36-03433
Table of Contents
SanDisk iNAND e.MMC 4.41 I/F - Data Sheet
© 2010 SanDisk Corporation 80-36-03433
4
4.2.2. Table 10 contains the SanDisk iNAND, with MMC interface (169 balls), functional pin
assignment. ................................................................................................................................ 22
4.3. iNAND Registers ........................................................................................................ 23
4.3.1. OCR Register................................................................................................................. 23
4.3.2. CID Register .................................................................................................................. 23
4.3.3. DSR Register ................................................................................................................. 23
4.3.4. CSD Register ................................................................................................................. 24
4.3.5. EXT_CSD Register ........................................................................................................ 25
5. Power Delivery and Capacitor Specifications ................................................................. 28
5.1. SanDisk iNAND Power Domains ................................................................................ 28
5.2. Capacitor Connection Guidelines ............................................................................... 28
5.2.1. VDDi Connections ......................................................................................................... 28
5.2.2. VCC and VCCQ Connections ........................................................................................ 28
6. Marking .............................................................................................................................. 30
7. Ordering Information ........................................................................................................ 31
How to Contact Us .................................................................................................................. 32
80-36-03433
Introduction
SanDisk iNAND e.MMC 4.41 I/F - data Sheet
© 2010 SanDisk Corporation - 5 - 80-36-03433
1. INTRODUCTION
1.1. General Description
iNAND is an Embedded Flash Drive (EFD) designed for mobile handsets and consumer electronic
devices. iNAND is a hybrid device combining an embedded thin flash controller and standard MLC
NAND flash memory, with an industry standard e.MMC 4.41
1
interface.
Empowered with a new e.MMC4.41 feature set such as Boot and RPMB partitions, HPI
(implemented on MLC products only), and HW Reset the iNAND e.MMC is the optimal device for
reliable code and data storage.
Designed specifically for mobile multimedia applications, iNAND is the most mature on board
SD/MMC device since 2005, providing mass storage of up to 32GB in JEDEC compatible form
factors, with low power consumption and high performance - an ideal solution for multimedia
handsets of 2.5G, 3G, 3.5G and 4G.
In addition to the high reliability and high system performance offered by the current iNAND
family of products, iNAND offers plug-and-play integration and support for multiple NAND
technology transitions, as well as features such as advanced power management scheme.
iNAND uses advanced Multi-Level Cell (MLC) NAND flash technology, enhanced by SanDisk‟s
embedded flash management software running as firmware on the flash controller.
iNAND architecture and embedded firmware fully emulates a hard disk to the host processor,
enabling read/write operations that are identical to a standard, sector-based hard drive. In addition,
SanDisk firmware employs patented methods, such as virtual mapping, dynamic and static wear-
leveling, and automatic block management to ensure high data reliability and maximize flash life
expectancy.
SanDisk iNAND provides up to 32GB of memory for use in mass storage applications. In addition
to the mass-storage-specific flash memory chip, iNAND includes an intelligent controller, which
manages interface protocols, data storage and retrieval, error correction code (ECC) algorithms,
defect handling and diagnostics, power management and clock control.
iNAND enables multimedia driven applications such as music, photo, video, TV, GPS, games,
email, office and other applications.
The breakthrough in performance and design makes iNAND the ideal solution for mobile handset
vendors, portable navigation and Automotive Infotainment vendors who require easy integration,
fast time to market and high-capacity.
1.2. Plug-and-Play Integration
iNAND optimized architecture eliminates the need for complicated software integration and testing
processes and enables a practically plug-and-play integration in the system. The replacement of one
iNAND device with another of a newer generation requires virtually no changes to the host. This
makes iNAND the perfect solution for platforms and reference designs, as it allows for the
1
Compatible to JESD84-A441
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