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BSOB的概念与应用
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2010-09-27
14:22:23
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ASM焊线培训,介绍BBOS/BSOB的概念与应用。
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ASM
Contents are subject to change without prior notification Company Confidential
Advanced Process Training – WB Development Group
BSOB/BBOS Control
BSOB/BBOS Control
Bond Stitch On Ball / Bond Ball On Stitch
ASM
Contents are subject to change without prior notification Company Confidential
Advanced Process Training – WB Development Group
Objectives
Objectives
• To provide sufficient knowledge on BSOB and
BBOS applications
• To share different techniques on low loop control
using BSOB
• To give a detailed explanation on how each
BSOB/BBOS parameter works on different
applications
ASM
Contents are subject to change without prior notification Company Confidential
Advanced Process Training – WB Development Group
Concept and Theory
Concept and Theory
• Application is very useful to die to die bonding
• Improved quality and reliability on die to die bonding
• Eliminates capillary mark while promoting good
intermetallic between ball and surface
BSOB BBOS
The bump ball formation process is almost like bonding a normal wire,
including 1
st
bond, looping and 2
nd
bond parameters.
ASM
Contents are subject to change without prior notification Company Confidential
Advanced Process Training – WB Development Group
Bond Stitch On Ball (BSOB)
Bond Stitch On Ball (BSOB)
• Applied on special devices that requires die to die
bonding such as the MCM (multi chip modules)
and stacked die applications.
Multi chip Modules with BSOB Multi chip Modules with BSOB
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