TI CC2540/41 蓝牙鼠标

/************************************************************************************************** Filename: gapbondmgr.c Revised: $Date: 2011-02-24 15:46:53 -0800 (Thu, 24 Feb 2011) $ Revision: $Revision: 10 $ Description: GAP peripheral profile manages bonded connections Copyright 2011-2013 Texas Instruments Incorporated. All rights reserved. IMPORTANT: Your use of this Software is limited to those specific rights granted under the terms of a software license agreement between the user who downloaded the software, his/her employer (which must be your employer) and Texas Instruments Incorporated (the "License"). You may not use this Software unless you agree to abide by the terms of the License. The License limits your use, and you acknowledge, that the Software may not be modified, copied or distributed unless embedded on a Texas Instruments microcontroller or used solely and exclusively in conjunction with a Texas Instruments radio frequency transceiver, which is integrated into your product. Other than for the foregoing purpose, you may not use, reproduce, copy, prepare derivative works of, modify, distribute, perform, display or sell this Software and/or its documentation for any purpose. YOU FURTHER ACKNOWLEDGE AND AGREE THAT THE SOFTWARE AND DOCUMENTATION ARE PROVIDED �AS IS� WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION, ANY WARRANTY OF MERCHANTABILITY, TITLE, NON-INFRINGEMENT AND FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL TEXAS INSTRUMENTS OR ITS LICENSORS BE LIABLE OR OBLIGATED UNDER CONTRACT, NEGLIGENCE, STRICT LIABILITY, CONTRIBUTION, BREACH OF WARRANTY, OR OTHER LEGAL EQUITABLE THEORY ANY DIRECT OR INDIRECT DAMAGES OR EXPENSES INCLUDING BUT NOT LIMITED TO ANY INCIDENTAL, SPECIAL, INDIRECT, PUNITIVE OR CONSEQUENTIAL DAMAGES, LOST PROFITS OR LOST DATA, COST OF PROCUREMENT OF SUBSTITUTE GOODS, TECHNOLOGY, SERVICES, OR ANY CLAIMS BY THIRD PARTIES (INCLUDING BUT NOT LIMITED TO ANY DEFENSE THEREOF), OR OTHER SIMILAR COSTS. Should you have any questions regarding your right to use this Software, contact Texas Instruments Incorporated at www.TI.com. **************************************************************************************************/ #if ( HOST_CONFIG & ( CENTRAL_CFG | PERIPHERAL_CFG ) ) /********************************************************************* * INCLUDES */ #include "bcomdef.h" #include "OSAL.h" #include "osal_snv.h" #include "gap.h" #include "linkdb.h" #include "gatt.h" #include "gatt_uuid.h" #include "hci.h" #include "gattservapp.h" #include "gapgattserver.h" #include "gapbondmgr.h" /********************************************************************* * MACROS */ /********************************************************************* * CONSTANTS */ // Task event types #define GAP_BOND_SYNC_CC_EVT 0x0001 // Sync char config // Once NV usage reaches this percentage threshold, NV compaction gets triggered. #define NV_COMPACT_THRESHOLD 80 // Bonded State Flags #define GAP_BONDED_STATE_AUTHENTICATED 0x0001 #define GAP_BONDED_STATE_SERVICE_CHANGED 0x0002 /** * GAP Bond Manager NV layout * * The NV definitions: * BLE_NVID_GAP_BOND_START - starting NV ID * GAP_BONDINGS_MAX - Maximum number of bonding allowed (10 is max for number of NV IDs allocated in bcomdef.h). * * A single bonding entry consists of 6 components (NV items): * Bond Record - defined as gapBondRec_t and uses GAP_BOND_REC_ID_OFFSET for an NV ID * local LTK Info - defined as gapBondLTK_t and uses GAP_BOND_LOCAL_LTK_OFFSET for an NV ID * device LTK Info - defined as gapBondLTK_t and uses GAP_BOND_DEV_LTK_OFFSET for an NV ID * device IRK - defined as "uint8 devIRK[KEYLEN]" and uses GAP_BOND_DEV_IRK_OFFSET for an NV ID * device CSRK - defined as "uint8 devCSRK[KEYLEN]" and uses GAP_BOND_DEV_CSRK_OFFSET for an NV ID * device Sign Counter - defined as a uint32 and uses GAP_BOND_DEV_SIGN_COUNTER_OFFSET for an NV ID * * When the device is initialized for the first time, all (GAP_BONDINGS_MAX) NV items are created and * initialized to all 0xFF's. A bonding record of all 0xFF's indicates that the bonding record is empty * and free to use. * * The calculation for each bonding records NV IDs: * mainRecordNvID = ((bondIdx * GAP_BOND_REC_IDS) + BLE_NVID_GAP_BOND_START) * localLTKNvID = (((bondIdx * GAP_BOND_REC_IDS) + GAP_BOND_LOCAL_LTK_OFFSET) + BLE_NVID_GAP_BOND_START) * */ #define GAP_BOND_REC_ID_OFFSET 0 //!< NV ID for the main bonding record #define GAP_BOND_LOCAL_LTK_OFFSET 1 //!< NV ID for the bonding record's local LTK information #define GAP_BOND_DEV_LTK_OFFSET 2 //!< NV ID for the bonding records' device LTK information #define GAP_BOND_DEV_IRK_OFFSET 3 //!< NV ID for the bonding records' device IRK #define GAP_BOND_DEV_CSRK_OFFSET 4 //!< NV ID for the bonding records' device CSRK #define GAP_BOND_DEV_SIGN_COUNTER_OFFSET 5 //!< NV ID for the bonding records' device Sign Counter #define GAP_BOND_REC_IDS 6 // Macros to calculate the index/offset in to NV space #define calcNvID(Idx, offset) (((((Idx) * GAP_BOND_REC_IDS) + (offset))) + BLE_NVID_GAP_BOND_START) #define mainRecordNvID(bondIdx) (calcNvID((bondIdx), GAP_BOND_REC_ID_OFFSET)) #define localLTKNvID(bondIdx) (calcNvID((bondIdx), GAP_BOND_LOCAL_LTK_OFFSET)) #define devLTKNvID(bondIdx) (calcNvID((bondIdx), GAP_BOND_DEV_LTK_OFFSET)) #define devIRKNvID(bondIdx) (calcNvID((bondIdx), GAP_BOND_DEV_IRK_OFFSET)) #define devCSRKNvID(bondIdx) (calcNvID((bondIdx), GAP_BOND_DEV_CSRK_OFFSET)) #define devSignCounterNvID(bondIdx) (calcNvID((bondIdx), GAP_BOND_DEV_SIGN_COUNTER_OFFSET)) // Macros to calculate the GATT index/offset in to NV space #define gattCfgNvID(Idx) ((Idx) + BLE_NVID_GATT_CFG_START) // Key Size Limits #define MIN_ENC_KEYSIZE 7 //!< Minimum number of bytes for the encryption key #define MAX_ENC_KEYSIZE 16 //!< Maximum number of bytes for the encryption key /********************************************************************* * TYPEDEFS */ // Structure of NV data for the connected device's encryption information typedef struct { uint8 LTK[KEYLEN]; // Long Term Key (LTK) uint16 div; //lint -e754 // LTK eDiv uint8 rand[B_RANDOM_NUM_SIZE]; // LTK random number uint8 keySize; // LTK key size } gapBondLTK_t; // Structure of NV data for the connected device's address information typedef struct { uint8 publicAddr[B_ADDR_LEN]; // Master's address uint8 reconnectAddr[B_ADDR_LEN]; // Privacy Reconnection Address uint16 stateFlags; // State flags: SM_AUTH_STATE_AUTHENTICATED & SM_AUTH_STATE_BONDING } gapBondRec_t; // Structure of NV data for the connected device's characteristic configuration typedef struct { uint16 attrHandle; // attribute handle uint8 value; // attribute value for this device } gapBondCharCfg_t; /********************************************************************* * GLOBAL VARIABLES */ /********************************************************************* * EXTERNAL VARIABLES */ /********************************************************************* * EXTERNAL FUNCTIONS */ /********************************************************************* * LOCAL VARIABLES */ static uint8 gapBondMgr_TaskID; // Task ID for internal task/event processing // GAPBonding Parameters static uint8 gapBond_Pa