红外传感器MLX90632数据手册

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melexis红外传感器数据手册,其他型号还有MLX90614 MLX90615等两个型号
MLX90632 FIR sensor Datasheet Melexis ASP RED ENGGINE-RINI Contents Features and Benefits App| ication Examples…...,,…,,…1 Description……… 。面看。着自面非DB日D。自目。自日 自是。自。自。日着着自日量自自量自是。。日·着。 2 2. Ordering Information 3. Glossary of Terms 4. Absolute Maximum ratings 5. Pin definitions and descriptions 8 6. Electrical characteristics 7. Product Description.…,,,,,,,,,,,,,…,………10 7.1. Block diagram....... 7.2. Description 10 8. Memory map…………… 9. Control and configuration registers 13 9.1 REG CONTROL 13 92. REG STATUS 14 10. I-C commands ,15 10.1. Addressed read 16 10.2. Addressed write…… 16 10.3. Global reset 17 10.4 Addressed reset 17 10.5, EEPROM unlock for customer access 17 10.6, Direct read 18 p ng Modes.…,…,…,…,………,, 19 12. Temperature calculation 20 12.1. Pre-calculations 21 121.1 Ambient 着着着着 21 12.1.2. Object........... 12.2. Ambient temperature 12.3. Obiect temperature 22 12.4. Example Temperature Calculation 23 12.4.1. Ambient temperature calculation 24 REVISION 3- FEBRUARY 14 2018 Page 3 of 35 MLX90632 FIR sensor Datasheet Melexis ASP RED ENGGINE-RINI 12.4.2. Object temperature calculation 25 13. Performance characteristics……27 13.1. Accuracy….............,..,.,… 27 13.2. Field of View(Fov 28 14. Mechanical Drawing…........,..,.,.,,.,,,…,29 14.1. Package dimensions 29 14.2. PCB footprint 30 15. Application schematic 31 16. Standard information regarding manufacturability of Melexis products with different soldering processes.. 32 17. ESD Precautions 33 18.FAQ....,,,,,…… 33 19. Table of figures…, 34 20, Disclaimer 34 21. Contact Information 垂垂看鲁 4是D垂看8看曲鼻 垂4酯春着画 …,35 REVISION 3- FEBRUARY 14 2018 Page 4 of 35 MLX90632 FIR sensor Datasheet Melexis 2. Ordering Information MLX90632 BCB-000 RE/ Table 1: Ordering codes for MLX90632 d egend. Temperature Code s:from-20°cto85° sensor temperature Package Code D"for SFN 3X3 package Option Code XYZ-123 X: Accurac B: standard accuracy Y: Pixel type C: high stability versio Z: Field of v B: 50 degrees 1 : 2C level 0:3V3 00: Standard configuration Xx: Re P acking Form: “RE" for reel SP" for sampling quantities in tubes Ordering Example MLX90632SLD-BCB-000-RE For a non-contact thermometer in SFN 3 x3 package with standard accuracy and a Field Of View of 50 degrees, delivered in Reel ble 2: Coding legend REVISION 3- FEBRUARY 14 2018 Page 5 of 35 MLX90632 FIR sensor Datasheet Melexis ASP RED ENGGINE-RINI 3. Glossary of Terms POR Power on reset R InfraRed C Inter-Integrated Circuit SDA Serial DAta-12C compatible communication pins SCL Serial CLock-I'C compatible communication pins ACK/NACK Acknowledge/Not Acknowledge SOC Start of Conversion EOC End of conversion FOV Field of view Ambient Temperature measured from the chip-(the package temperature Object Temperature, 'seen from IR sensor SEN Single Flat pack No-lead TBD To Be defined LSB Least significant Bit MSB Most significant Bit EMC Electro-Magnetic Compatibility ESD Electro-Static Discharge HBM Human body model CDM Charged Device Model Table 3: List of abbreviations REVISION 3- FEBRUARY 14 2018 Page 6 of 35 MLX90632 FIR sensor Datasheet Melexis ASP RED ENGGINE-RINI 4. Absolute Maximum ratings Supply Voltage, over voltage Supply Voltage, operating) 3.6 Reverse voltage -1.5 Vvvv Address-pin Voltage VD+0.6 Operating Temperature Range +85 Storage Temperature Range +105 ESD Sensitivity (AEC Q100 002) HBM kV CDM 750 Air discharge Contact discharge +2 DC current into scl 10 DC sink current, SDA pin mA Dc clamp current, SDA pin 25 DC clamp current, SCL pin Table 4: Absolute maximum ratings Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum rated conditions for extended periods may affect device reliability REVISION 3- FEBRUARY 14 2018 Page 7 of 35 MLX90632 FIR sensor Datasheet Melexis ASP RED ENGGINE-RINI 5. Pin definitions and descriptions 12345 Figure 2: MLX90632 pinout, TOP view SDA In/Out IC Data line 12345 VDD POWER Supply GND GND Ground SCL IC Clock line ADDR LSB of ic address Table 5: Pin definition REVISION 3- FEBRUARY 14 2018 Page 8 of 35 MLX90632 FIR sensor Datasheet Melexis ASP RED ENGGINE-RINI 6. Electrical characteristics All parameters are valid for Ta= 25C, VoD =3.3V (unless otherwise specified) Parameter Symbol Test Conditions Ain Typica Max Units External supply 3.3 3.6 Supply current No load 0.5 1.4 mA Sleep current No load, erase/ write EEPROM 1.5 2.5 operations Power on reset POR level Power-up(full temp range 1.3 2.4 POR level por doN Power-down (full temp range 1.1 2.1 POR hysteresis Full temperature range 500 Vop rise time(10%to 90% of Ensure Por signal 20 specified supply voltage POR Output valid Valid After POR (result in RAM) I"C compatible 2-wire interface C Voltage Input high voltage Over temperature and supply 0.7V1 V12c+0.5 Input low voltage Over temperature and supply -0.5 0.3V2c Output low voltage Over temperature and supply 0 0.4 Address pin voltage("1") Voo+0.5¥V Address pin voltage(0") ADDR LO 0.5 ADDR leakage DDR leak SCL leakage ak Vc=3.6V Ta=+85C SDA leakage 冂A|eak VsnA=3.6V,Ta=+85°C 1110 SCL capacitance SDA capacitance Slave ad dress actory default, ADDR-pin grounded 3A hex Table 6: Electrical characteristics REVISION 3- FEBRUARY 14 2018 Page 9 of 35 MLX90632 FIR sensor Datasheet Melexis ASP RED ENGGINE-RINI 7. Product Description 7.1.Block diagram R sensors MUX PGA ADC Digital RA Ambient filtering temperature sensor SCL SDA Regulator POR Oscillator State machine k EEPROM VDD GND Figure 3: Block diagram 7.2. Description The MLX90632 is a far infrared, non-contact temperature sensor which is factory calibrated to a high accuracy. Internally electrical and thermal precautions are taken to compensate for thermally harsh external conditions. The thermopile sensing element voltage signal is amplified and digitized. After digital filtering the raw measurement result is stored in the ram memory. furthermore the mlx90632 contains a sensor element to measure the temperature of the sensor itself. The raw information of this sensor is also stored in RAM after processing. All above functions are controlled by a state machine. the result of each measurement conversion is accessible via - c The communication to the chip is done by i c in fast mode plus (FM+). the requirement of the standard is to run at frequencies up to 1MHz. Through ic the external unit can have access to the following blocks Control registers of internal state machines RAM ( 96bit x 16bit)for pixel and auxiliary measurement data, in this document mainly referred to as storage memory EEPROM(256bit x 16bit)used to store the trimming values, calibration constants and various device/measurement settings From the measurement data and the calibration data the external unit can calculate both the sensor temperature and the object temperature. The calculation allows the customer to adjust the calibration for his own application in case an optical window or obstructions are present REVISION 3- FEBRUARY 14 2018 Page 10 of 35

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