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53-Optoelectronics.pdf
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This Optoelectronics (OE) Chapter covers data transmission utilizing optical technology over Telecommunication distances of 100’s of kilometers down to on-chip distances of a few millimeters. This Chapter no longer covers LEDs, Displays, Photovoltaic power generation or sensors, many of which have been moved to other chapters
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COMPONENT/SUBSYSTEM TECHNOLOGIES
OPTOELETCRONICS
Contents
Optoelectronics ........................................................................................................................... 1
Executive Summary................................................................................................................ 1
Introduction............................................................................................................................. 4
Situation (Infrastructure) Analysis.......................................................................................... 6
Plastic Optical Fiber (POF)............................................................................................... 13
Active Optical Cables ....................................................................................................... 16
Backplane Applications .................................................................................................... 17
On-to Chip and Off-of Chip Data Transmission .............................................................. 18
On-chip Optical interconnect............................................................................................ 21
BER (Bit Error Rates)....................................................................................................... 22
Financial and Business Status........................................................................................... 23
Status Summary ................................................................................................................ 24
Manufacturing Issues............................................................................................................ 25
Manufacturing Equipment Availability ............................................................................ 25
Data Communication Manufacturing Process Issues ....................................................... 25
Designing for Manufacturing............................................................................................ 27
Quality Requirements ....................................................................................................... 28
Environmental Issues........................................................................................................ 28
Supply Chain Issues.......................................................................................................... 29
Roadmap of Quantified Key Attribute Needs....................................................................... 29
Critical (Infrastructure) Issues .............................................................................................. 39
Technology Needs ................................................................................................................ 41
Prioritized Research & Development Needs ........................................................................ 42
Implementation ................................................................................................................. 42
Gaps and Show Stoppers ...................................................................................................... 43
Recommendations on Potential Alternative Technologies................................................... 44
Contributors/Acknowledgments ........................................................................................... 45
Appendix............................................................................................................................... 45
Definition of OE terms...................................................................................................... 45
Glossary ............................................................................................................................ 46
Related Internet Links....................................................................................................... 47
Tables
Table 1: Market and Application Mapping: Product status matrix
(Chapter focused on BOLD elements)...................................................................... 5
Table 2: Optical Data Transmission Technology Improvements Over Time
and Potential Future Improvements ........................................................................ 10
Table 3: Manufactiring Processes for Optical Products ........................................................ 26
Table 4: Key Attribute Needs – Long Haul to Metro Links.................................................. 30
Table 5: Key Attribute Needs – Campus LANs < 10Km ...................................................... 31
iNEMI Technology Roadmaps i January 2009
COMPONENT/SUBSYSTEM TECHNOLOGIES OPTOELECTRONICS
Table 6: Key Attribute Needs – FTTX “Final Link” - <1Km ............................................... 32
Table 7: Key Attribute Needs - Glass - <300m ..................................................................... 33
Table 8: Key Attribute Needs – Plastic Optical Fiber - <200m............................................. 34
Table 9: Key Attribute Needs – Backplane Interconnect <1m.............................................. 35
Table 10: Key Attribute Needs – On-to Chip and Off-of Chip ............................................. 36
Table 11: Key Attribute Needs – On Chip............................................................................. 37
Table 12: Technology Needs ................................................................................................. 41
Table 13: Research and Development Needs ........................................................................ 42
Figures
Figure 1: Current Generic Data Transmission Environment ................................................... 6
Figure 2: Possible Copper to Optics Migration Timeframe..................................................... 7
Figure 3: Cost Comparison of Copper vs. Optical by Distance and Bandwidth ..................... 7
Figure 4: Conceptual View of the Current Status of the Transition from Copper to Optical.. 8
Figure 5: Evolution of Telecommunications (>10Km) OE Structure ..................................... 9
Figure 6 - MSA Standards Overview...................................................................................... 12
Figure 7: Low cost Connectorless Package of a POF Source................................................ 15
Figure 8: Examples of short range, commercial POF based systems.................................... 15
Figure 9: Active Optical Cable Suppliers .............................................................................. 16
Figure 10: Typical Active Optical cable................................................................................ 16
Figure 11: Illustration of an Optical Backplane..................................................................... 17
Figure 12: “FlexPlane” Optical Backplane by Molex ........................................................... 18
Figure 13: On/Off Chip Data Connectors - Photograph courtesy Reflex Photonics Inc....... 18
Figure 14: LightABLE Optical Sub Assembly from Reflex Photonics................................. 19
Figure 15: Optical Chip to Chip Interconnections................................................................. 20
Figure 16: Two Approaches for Waveguide Coupling.......................................................... 20
Figure 17: Proposed Methods of Coupling Light Into and Out of Optical Substrates .......... 21
Figure 18: one current view of the place for optical vs copper on-chip interconnect ........... 22
Figure 19: Manufacturing Process for One Product .............................................................. 27
Figure 20: Illustration of Historic and Projected Improvements in Ferrule-based
Optical Connector Attenuation. ......................................................................... 38
iNEMI Technology Roadmaps ii January 2009
COMPONENT/SUBSYSTEM TECHNOLOGIES
iNEMI Technology Roadmaps 1 January 2009
Dick Otte, Promex, Chair Bill Ring, WGR Associates, Co-Chair
Rick Clayton, Clayton & Associates (MIT CTR-II Liason)
OPTOELECTRONICS
EXECUTIVE SUMMARY
This Optoelectronics (OE) Chapter covers data transmission utilizing optical technology over
Telecommunication distances of 100’s of kilometers down to on-chip distances of a few
millimeters. This Chapter no longer covers LEDs, Displays, Photovoltaic power generation or
sensors, many of which have been moved to other chapters.
Optical technology generally continues to displace copper for data transmission over shorter
distances. The higher the data rate required - the shorter the distance over which optical methods
become superior.
This chapter contains a series of 7 Excel Tables that show the applicable characteristics of
optical data transmission at various distances over time. These tables were developed early and
are the foundation of this chapter
Telecommunications, from long haul down to the metro links, are a few kilometers in length and
are dominated by single mode optical technologies. The challenge in these applications is
minimizing the cost of building out (provisioning) plant to transmit the continually increasing
volume of data. Data is transmitted using dense (meaning up to 124+ wavelengths per fiber with
wavelengths between 1525 nm to1610nm) Wavelength Division Multiplexing (DWDM) with
each wavelength commonly operating at 10 Gb/s. Moves to 40 Gb/s data rates are underway.
Modulation methods that allow multiple bits per symbol (or cycle of bandwidth) are also being
implemented.
In 2007, 12.7 million Telecom transceivers were shipped with 0.8 million of these 2.5Gb/s or
faster.
The long haul telecommunication sector discussed above is distinct from the shorter distance
data communication sector discussed below. Telecommunications is not only over long
distances but has transmission protocols (ATM, SONET, etc.), suppliers (Alcatel-Lucent, Nortel,
Neophotonics, etc.) customers (AT&T, Comcast, etc.) and requirements (up to 40 year life,
Telcordia, etc.) that are unique to that sector. Data communications covers shorter distances
starting with campus area networks, and moving to LANS, data centers, etc. Data
communications has its unique protocols (10 BASE T Ethernet, FDDI, etc.), a broader customer
base (data centers, large system operators, etc.) separate suppliers (Finisar, Reflex Photonics,
etc.) and requirements. These two sectors share much basic technology, however, so a great deal
of crossover occurs between the two.
Local Area Networks (LANs) that transmit data 100 meters (to a few kilometers) utilize much of
the technology developed by the telecommunication industry. They generally require data rates
of 1Gb/s and rarely use more than a few wavelengths in each fiber. In many cases, the cost to
add more fibers is less than the cost of implementing multiplexing or changing to higher data rate
transceivers.
COMPONENT/SUBSYSTEM TECHNOLOGIES OPTOELECTRONICS
iNEMI Technology Roadmaps 2 January 2009
Another important and growing application that has emerged in recent years is data transmission
in data centers to interconnect processors, memory and switches. Optical methods require up to
80% less power and are typically 80% smaller than copper cable with the same data capacity.
The power and size savings resulting from the switch to optical technology are very
advantageous in these installations. In addition, the total cost is generally lower, largely due to
the lower power required but also due to a reduction in the amount of electronics needed to
transmit at these high (2.5 Gb/s to 10Gb/s) data rates.
In 2007, 16.3 million Datacom transceivers were shipped with 0.5 million of these 10Gb/s or
faster.
One class of optical product introduced in the last few years to fill the above need in Data centers
is “Active Optical Cable”. These “cables” have electrical connectors at both ends but convert the
electrical signals to optical and transmit the data through low loss fiber. The optical signal is
converted back to an electrical signal at the receiving ends. Each optical fiber typically operates
at data rates of 10Gb/s or less with multiple fibers used in parallel for higher data rates.
Another emerging optical technology used for distances up to 100 to 300 meters is plastic optical
fiber (POF). This technology utilizes multimode transmission, usually at 650 nm, 850 nm and
sometimes 1310 nm. Several types of fiber are used, each with its unique advantages and limits.
In general, however, POF is lower in cost than glass, especially during installation where
splicing and connectors require only simple hand tools and minimal training compared to the
more sophisticated techniques required with glass fiber. POF has found major applications in
transportation, especially automobiles, and is beginning to replace copper in trains, aircraft, etc.
Many vendors offer product utilizing a variety of technologies and standards are just emerging.
The lack of an optical amplifier comparable to the Erbium amplifiers used at 1525 nm to 1610
nm in telecommunications, places important limits on the application of multimode, shorter
wavelength optical methods.
Backplanes, where the transmission distances are typically 1 meter or less, are a class of product
where optical methods have been extensively evaluated. The technology is available but the
economics versus copper are not yet compelling. Thus, optical backplanes are highly custom
and used only in specialized applications.
Another emerging application is off-chip data transmission. Multi-core processor chips require
very high data rates with 160 Terabit/s forecast by the ITRS. Methods to convert the electrical
signal to optical on the chip, or at least in the chip package, are being explored. Some products
that implement these technologies are available but use is still limited.
On-chip interconnect is attractive due to the possibility to reduce power loss in chip global
interconnect. At the emerging 22nm node forecast by the ITRS, over 50% of the chip power
dissipation is projected to occur in the copper interconnect. Optical methods, however, do not
offer as much density as copper (1 micron waveguides versus <0.05 micron copper traces) so
multiplexing of multiple wavelengths, probably single mode, is a potential solution that multiple
labs and organizations are exploring. Multi-core semiconductor processors have the greatest
need and are thus a focal point for this work. Other methods of addressing the challenges with
COMPONENT/SUBSYSTEM TECHNOLOGIES OPTOELECTRONICS
iNEMI Technology Roadmaps 3 January 2009
global interconnects include three-dimensional chip integration using through-silicon-vias (TSV)
and the use of carbon based interconnects such as carbon nanotubes (CNT). Optical methods, of
course, are only one of the options being explored by the semiconductor industry.
A major need for backplane, off-chip and on-chip optical data transmission is a source of
photons that can be modulated at the Gb/s rates required. CMOS and silicon generally do not
make good optical sources. Thus, another photon source is required. To date, a suitable,
economically viable solution has not been found.
Optical product manufacturing requires a variety of unique processes which are often done
manually. While automated equipment is technically viable, the volume to-date is insufficient to
justify the equipment development cost. As optical applications expand, product lifetimes
lengthen and standards emerge, manual methods will gradually give way to automated methods.
The one exception is POF manufacturing where the volume and technology are such that much
automation is viable and in use.
Optical products, like many other electronic products, are impacted by the “Green” revolution
and restrictive legislation, particularly. To date, the major impact has been on the elimination of
lead solder and resulting move to higher temperature materials. Some environmental legislation
that is under consideration, however, could have greater impact if certain materials, such as
Arsenic (a component of GaAs devices) are banned.
The table below summarizes the Critical issues, Gaps and Show Stoppers, and Technical Needs
addressed, alluded to, or neglected above.
Distance/Application Critical Issues Gaps & Show Stoppers Technical Needs
Telecommunications
Growing capacity
demand
Legislation banning key
materials such as GaAs
Methods to transmit more
data through provisioned
fiber
FTTX
Cost RF and electronic solutions Low cost, high volume
manufacturing methods as
market develops
LANs
None None Low cost multiplexing
methods
<300 meter glass
Demand to reduce
power and save
space in data centers
Ability to handle up to
160Tb/s
<200 meter POF
Increased volume.
Wider adoption
Inability to compete with
glass fiber or single mode
technology
Less than 125 db/Km of
attenuation at temperatures
over 125C.
<100 meter POF
Increased volume.
Wider adoption
Market unwillingness to
accept Perflourinated graded
index fiber over multimode
glass fiber.
<1 meter
Cost vs electrical
methods
Continuing improvement in
copper methods
Cost effective technical
solution, especially a light
source
Off-chip
Cost vs electrical
methods
Continuing improvement in
copper methods
Cost effective technical
solution, especially a light
source
On-chip
Comparison to
carbon based
interconnects
Inability to compete with
alternates
Cost effective technical
solution, especially a light
source
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