TECHNICAL
REPORT
IEC
TR 62380
First edition
2004-08
Reliability data handbook –
Universal model for reliability prediction
of electronics components, PCBs
and equipment
Reference number
IEC/TR 62380:2004(E)
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Customer: Jens VIGEN - No. of User(s): 1 - Company:
Order No.: WS-2005-001924 - IMPORTANT: This file is copyright of IEC, Geneva, Switzerland. All rights reserved.
This file is subject to a licence agreement. Enquiries to Email: custserv@iec.ch - Tel.: +41 22 919 02 11
TECHNICAL
REPORT
IEC
TR 62380
First edition
2004-08
Reliability data handbook –
Universal model for reliability prediction
of electronics components, PCBs
and equipment
:
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IEC 2004 Copyright - all rights reserved
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Customer: Jens VIGEN - No. of User(s): 1 - Company:
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– 2 – TR 62380 IEC:2004(E)
CONTENTS
FOREWORD ........................................................................................................................5
INTRODUCTION .................................................................................................................. 7
1 Scope ............................................................................................................................ 8
2 Normative references..................................................................................................... 8
3 Terms and definitions..................................................................................................... 9
4 Conditions of use ......................................................................................................... 10
4.1 Introductory remarks ........................................................................................... 10
4.2 Assumptions adopted for TR 62380 ..................................................................... 11
4.3 Influencing factors............................................................................................... 13
4.4 How to use the data ............................................................................................ 14
4.5 Uses and aims of a reliability prediction............................................................... 15
5 Environment influence.................................................................................................. 16
5.1 General remarks ................................................................................................. 16
5.2 Environment types defined .................................................................................. 16
5.3 Electrical environment conditions ........................................................................ 20
5.4 Validity model according to environment.............................................................. 20
5.5 Components choice............................................................................................. 20
5.6 Learning during the deployment phase of new equipment .................................... 21
5.7 Mission profile..................................................................................................... 22
5.8 Mission profile examples ..................................................................................... 23
6 Equipped printed circuit boards and hybrid circuits (IEC 60326) .................................... 25
6.1 Failure rate calculation of an equipped printed circuit board ................................. 25
6.2 Hybrid circuits ..................................................................................................... 26
7 Integrated circuits ........................................................................................................ 27
7.1 Validity domain ................................................................................................... 27
7.2 Junction temperature evaluation of an integrated circuit ....................................... 27
7.3 The reliability model ............................................................................................ 30
8 Diodes and thyristors, transistors, optocouplers (IEC 60747-xx) .................................... 36
8.1 Evaluating the junction temperature of diodes and transistors .............................. 36
8.2 Low power diodes ............................................................................................... 38
8.3 Power diodes ...................................................................................................... 40
8.4 Low power transistors ......................................................................................... 42
8.5 Power transistors ................................................................................................ 44
8.6 Optocouplers ...................................................................................................... 46
9 Optoelectronics............................................................................................................ 49
9.1 Light emitting diodes diode modules (IEC 60747-12-2, IEC 62007)....................... 49
9.2 Laser diodes modules - Failure rate..................................................................... 52
9.3 Photodiodes and receiver modules for telecommunications (IEC 60747-12).......... 53
9.4 Passive optic components ................................................................................... 54
9.5 Miscellaneous optic components ......................................................................... 54
10 Capacitors and thermistors (ntc)................................................................................... 55
10.1 Fixed plastic, paper, dielectric capacitors - Radio interference suppression
capacitors (plastic, paper) ................................................................................... 55
Customer: Jens VIGEN - No. of User(s): 1 - Company:
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TR 62380 IEC:2004(E) – 3 –
10.2 Fixed ceramic dielectric capacitors – Defined temperature coefficient – Class I
(IEC 60384) ........................................................................................................ 56
10.3 Fixed ceramic dielectric capacitors – Non defined temperature coefficient – Class
II – Radio interference suppression capacitors (Ceramic, class II) ........................ 57
10.4 Tantalum capacitors, solid electrolyte (IEC 60384)............................................... 58
10.5 Aluminum, non-solid electrolyte capacitors - Life expectancy ............................... 59
10.6 Aluminum electrolytic capacitor, solid electrolyte ................................................. 61
10.7 Aluminum electrolytic capacitor, polymer electrolyte (IEC 60384) ......................... 62
10.8 Variable ceramic capacitors, disks (Dielectric ceramic) (IEC 60384) ..................... 63
10.9 Thermistors with negative temperature coefficient (NTC) (IEC 60539) .................. 64
11 Resistors and potentiometers (IEC 60115).................................................................... 65
11.1 Fixed, low dissipation film resistors – High stability (rs), general purpose (rc),
“minimelf” ........................................................................................................... 65
11.2 Hot molded carbon composition, fixed resistors (IEC 60115) ................................ 66
11.3 Fixed, high dissipation film resistors (IEC 60115)................................................. 67
11.4 Low dissipation wirewound resistors (IEC 60115)................................................. 68
11.5 High dissipation wirewound resistors (IEC 60115)................................................ 69
11.6 Fixed, low dissipation surface mounting resistors and resistive array (IEC 60115) 70
11.7 Non wirewound cermet potentiometer (one or several turn) (IEC 60393)............... 71
12 Inductors and transformers (IEC 61248) ....................................................................... 73
13 Microwave passive components, piezoelectric components and surface acoustic wave
filters (IEC 61261, IEC 61019, IEC 60368).................................................................... 74
13.1 Microwave passive components .......................................................................... 74
13.2 Piezoelectric components.................................................................................... 74
13.3 Surface acoustic wave filters ............................................................................... 74
14 Relays ......................................................................................................................... 75
14.1 Evaluating voltage and current (vt, it) in transient conditions ................................ 75
14.2 Mercury wetted reed relays, low power (IEC 60255)............................................. 78
14.3 Dry reed relays (IEC 60255) ................................................................................ 80
14.4 Electromechanical relays, miniature or card – European type, thermal relays
(power up to 500 W) (IEC 60255) ........................................................................ 82
14.5 Industrial relays, high voltage vacuum relays, power mercury wetted relays (IEC
60255) ................................................................................................................ 84
15 Switches and keyboards (IEC 60948) ........................................................................... 86
16 Connectors .................................................................................................................. 87
16.1 Circular, rectangular............................................................................................ 87
16.2 Coaxial connectors.............................................................................................. 87
16.3 Connectors for PCBs and related sockets ............................................................ 87
17 Displays, solid state lamps ........................................................................................... 88
17.1 Displays (IEC 61747) .......................................................................................... 88
17.2 Solid state lamps (IEC 60747) ............................................................................. 88
18 Protection devices (IEC 60099, IEC 60269, IEC 60738, IEC 61051) .............................. 89
18.1 Thermistors (PTC)............................................................................................... 89
18.2 Varistors ............................................................................................................. 89
18.3 Fuses ................................................................................................................. 89
18.4 Arrestors............................................................................................................. 89
19 Energy devices, thermal management devices, disk drive ............................................. 90
19.1 Primary batteries................................................................................................. 90
19.2 Secondary batteries ............................................................................................ 90
Customer: Jens VIGEN - No. of User(s): 1 - Company:
Order No.: WS-2005-001924 - IMPORTANT: This file is copyright of IEC, Geneva, Switzerland. All rights reserved.
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