User’s Manual
RL78 Family
EEPROM Emulation Library Pack02
Japanese Release
ZIP file name: JP_R_EEL_RL78_P02_Vx.xx_x_E
Rev.1.00 Ma
r
2014
16-Bit Single-Chip Microcontroller
Supported Devices:
RL78/D1A RL78/G1A
RL78/F12 RL78/I1A
RL78/F13 RL78/L13
RL78/F14 RL78/L1C
RL78/G13
RL78/G14
16
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(2012.4)
NOTES FOR CMOS DEVICES
(1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN: Waveform distortion due to input noise or a
reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL
(MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise
from entering the device when the input level is fixed, and also in the transition period when the input level
passes through the area between VIL (MAX) and VIH (MIN).
(2) HANDLING OF UNUSED INPUT PINS: Unconnected CMOS device inputs can be cause of malfunction. If
an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc.,
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be
connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling
related to unused pins must be judged separately for each device and according to related specifications
governing the device.
(3) PRECAUTION AGAINST ESD: A strong electric field, when exposed to a MOS device, can cause
destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop
generation of static electricity as much as possible, and quickly dissipate it when it has occurred.
Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended
to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and
transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors should be grounded. The operator should be grounded using a wrist
strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken
for PW boards with mounted semiconductor devices.
(4) STATUS BEFORE INITIALIZATION: Power-on does not necessarily define the initial status of a MOS
device. Immediately after the power source is turned ON, devices with reset functions have not yet been
initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A
device is not initialized until the reset signal is received. A reset operation must be executed immediately
after power-on for devices with reset functions.
(5) POWER ON/OFF SEQUENCE: In the case of a device that uses different power supplies for the internal
operation and external interface, as a rule, switch on the external power supply after switching on the internal
power supply. When switching the power supply off, as a rule, switch off the external power supply and then
the internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements
due to the passage of an abnormal current. The correct power on/off sequence must be judged separately
for each device and according to related specifications governing the device.
(6) INPUT OF SIGNAL DURING POWER OFF STATE : Do not input signals or an I/O pull-up power supply
while the device is not powered. The current injection that results from input of such a signal or I/O pull-up
power supply may cause malfunction and the abnormal current that passes in the device at this time may
cause degradation of internal elements. Input of signals during the power off state must be judged
separately for each device and according to related specifications governing the device.
How to Use This Manual
Target Readers This manual is intended for users who wish to understand the features of the RL78
microcontrollers EEPROM Emulation Library Pack 02 and to use the library in
designing and developing application systems.
The target products are as follows.
RL78/D1A, RL78/F12, RL78/F13, RL78/F14, RL78/G13, RL78/G14, RL78/G1A,
RL78/I1A, RL78/L13, RL78/L1C
Purpose This manual is intended to give users understanding of how to use EEPROM
Emulation Library Pack 02 to rewrite the flash data memory in RL78-family
microcontrollers (i.e. write constant data by the application).
Organization The RL78 EEPROM Emulation Library Pack 02 user’s manual is separated into the
following parts
:
• Overview of EEPROM Emulation
• Using EEPORM Emulation
• EEPROM Emulation Function
How to Read This Manual It is assumed that the readers of this manual have general knowledge of electrical
engineering, logic circuits, and microcontrollers.
• To gain a general understanding of features
-> Read this manual in order of the table of contents.
• For details on the functions of the library
-> Refer to section 5, User Interface, of this user’s manual.
Conventions Data significance: Higher-order digits to the left and lower-order digits to the right
Active low representations: xxx (overscore over pin and signal name)
Note: Footnote for item marked with Note in the text.
Caution: Information requiring particular attention
Remark: Supplementary information
Numeral representation: Binary ... xxxx or xxxxB
Decimal ... xxxx
Hexadecimal ... xxxxH or 0xXXXX
All trademarks and registered trademarks are the property of their respective owners.
EEPROM is a registered trademark of Renesas Electronics Corporation.
RL78 Family
EEPROM Emulation Library Pack02
R01US0068EJ0100 Rev.1.00 Page 5 of 53
Mar. 28, 2014
Contents
Chapter 1 Overview ..................................................................................................... 7
1.1 Outline ....................................................................................................................................... 7
1.2 Target Devices .......................................................................................................................... 7
1.3 Definition of Terms .................................................................................................................. 7
Chapter 2 EEPROM Emulation ................................................................................... 9
2. 1 Specifications of EEPROM Emulation ...................................................................................... 9
2. 2 Outline of Function ..................................................................................................................... 9
2. 3 EEL architecture ....................................................................................................................... 11
2. 3. 1 System Structure ........................................................................................................ 11
2. 3. 2 EEL Pool ...................................................................................................................... 11
2. 3. 3 Structure of EEL Block ............................................................................................... 13
2. 3. 4 EEL Block Header ....................................................................................................... 14
2. 3. 5 Structure of Stored Data ............................................................................................ 15
2. 3. 6 EEL Block Overview ................................................................................................... 16
Chapter 3 EEL Functional Specifications ................................................................ 17
3.1 EEL Functions / Commands of the EEL_Execute Function .............................................. 17
3. 1. 1 EEL_CMD_STARTUP command [Startup processing] ........................................... 17
3. 1. 2 EEL_CMD_SHUTDOWN command [Shutdown processing] .................................. 17
3. 1. 3 EEL_CMD_REFRESH command [Refresh processing] .......................................... 17
3. 1. 4 EEL_CMD_FORMAT command [Format processing] ............................................. 18
3. 1. 5 EEL_CMD_WRITE command [Write processing] .................................................... 18
3. 1. 6 EEL_CMD_READ command [Read processing] ...................................................... 18
3. 1. 7 EEL_CMD_VERIFY command [Verify processing] .................................................. 18
3.2 State Transitions .................................................................................................................... 19
3.3 Basic Flowchart ...................................................................................................................... 21
3.4 Command Operation Flowchart ........................................................................................... 23
3.5 BGO
（
Back Ground Operation
）
function ........................................................................... 24
Chapter 4 Using EEPROM Emulation ....................................................................... 25
4.1 Caution Points ........................................................................................................................ 25
4.2 Number of stored user data items and total user data size ............................................... 27
4.3 Initial Values to be set by User ............................................................................................. 28
Chapter 5 User Interface ........................................................................................... 31
5. 1 Request Structure (eel_request_t) Settings........................................................................... 31
5.1.1 User Write Access ...................................................................................................... 32
5.1.2 User Read Access ...................................................................................................... 32
5. 2 EEL Function Calls ................................................................................................................... 33
5. 3 Data Types ................................................................................................................................. 33
5. 4 EEL Function ............................................................................................................................. 34
FDL_Init ................................................................................................................................... 35
FDL_Open ............................................................................................................................... 36
FDL_Close............................................................................................................................... 37
EEL_Init ................................................................................................................................... 38
