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Murata Electronics Oy SCL3300-D01 Doc.No. 4921
www.murata.com Rev. 1
TABLE OF CONTENTS
1 Introduction ................................................................................................................................... 4
2 Specifications ............................................................................................................................... 4
2.1 Abbreviations ........................................................................................................................... 4
2.2 General Specifications ............................................................................................................. 4
2.3 Performance Specifications for Inclinometer ........................................................................... 5
2.4 Performance Specification for Temperature Sensor ............................................................... 7
2.5 Specification for Angle Outputs ............................................................................................... 7
2.6 Absolute Maximum Ratings ..................................................................................................... 7
2.7 Pin Description ........................................................................................................................ 8
2.8 Performance characteristics .................................................................................................... 9
2.9 Digital I/O Specification ......................................................................................................... 10
2.9.1 SPI DC Characteristics ..................................................................................................... 10
2.9.2 SPI AC Characteristics ..................................................................................................... 11
2.10 Measurement Axis and Directions ......................................................................................... 12
2.11 Package Characteristics ........................................................................................................ 13
2.11.1 Package Outline Drawing .............................................................................................. 13
2.12 PCB Footprint ........................................................................................................................ 14
3 General Product Description ..................................................................................................... 14
3.1 Factory Calibration ................................................................................................................ 15
4 Component Operation, Reset and Power Up ........................................................................... 15
4.1 Component Operation ........................................................................................................... 15
4.2 Start-up sequence ................................................................................................................. 16
4.3 Operation modes ................................................................................................................... 17
5 Component Interfacing .............................................................................................................. 17
5.1.1 General ............................................................................................................................. 17
5.1.2 Protocol ............................................................................................................................ 17
5.1.3 SPI frame ......................................................................................................................... 19
5.1.4 Operations ........................................................................................................................ 20
5.1.5 Return Status ................................................................................................................... 21
5.2 Checksum (CRC) .................................................................................................................. 21
6 Register Definition ...................................................................................................................... 22
6.1 Sensor Data Block ................................................................................................................. 24
6.1.1 Example of Acceleration Data Conversion ....................................................................... 25
6.1.2 Example of Temperature Data Conversion ...................................................................... 26
