AMPAK Technology Inc.
3F, No.15-1 Zhonghua Road,Hsinchu Industrial Park, Hukou,Hsinchu,Taiwan, 30352
1.Introduction ................................................................................................... 3
2.Features ....................................................................................................... 4
3.Deliverables .................................................................................................. 5
3.1 Deliverables ............................................................................................. 5
3.2 Regulatory certifications .......................................................................... 5
4.General Specification.................................................................................... 6
4.1 General Specification .............................................................................. 6
4.2 Voltages ................................................................................................... 6
4.2.1 Absolute Maximum Ratings ................................................................ 6
4.2.2 Recommended Operating Rating ....................................................... 6
4.3 ESD sensitivity ......................................................................................... 7
5.Wi-Fi RF Specification .................................................................................. 8
5.1 2.4GHz RF Specification ......................................................................... 8
5.2 5GHz RF Specification .......................................................................... 10
6.Bluetooth Specification ............................................................................... 15
6.1 Bluetooth Specification .......................................................................... 15
7.Pin Assignments ......................................................................................... 16
7.1 Pin Outline ............................................................................................. 16
7.2 Pin Definition ......................................................................................... 16
8.Dimensions ................................................................................................. 18
8.1 Physical Dimensions ............................................................................. 18
8.2 Layout Recommendation ....................................................................... 19
9.External clock reference ............................................................................. 20
9.1 SDIO Pin Description ............................................................................. 20
10.Host Interface Timing Diagram ................................................................. 21
10.1 Power-up Sequence Timing Diagram .................................................. 21
10.2 SDIO Default Mode Timing Diagram ................................................... 23
10.3 SDIO High Speed Mode Timing Diagram ............................................ 24
10.4 SDIO Bus Timing Specifications in SDR Modes .................................. 25
10.5 SDIO Bus Timing Specifications in DDR50 Mode ................................ 27
11.Recommended Reflow Profile................................................................... 28
12. Package Information ................................................................................ 31
12.1 Label .................................................................................................... 31
12.2 Dimension............................................................................................ 32
12.3 MSL Level / Storage Condition ............................................................ 34
