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CC2530

DATASHEET

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FEATURES

APPLICATIONS

CC2530F32 , CC2530F64 , CC2530F128 , CC2530F256

www.ti.com

.......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009

A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications

– Accurate Digital RSSI/LQI Support

2345

• RF/Layout – Battery Monitor and Temperature Sensor

– 2.4-GHz IEEE 802.15.4 Compliant RF – 12-Bit ADC With Eight Channels and

Transceiver Configurable Resolution

– Excellent Receiver Sensitivity and – AES Security Coprocessor

Robustness to Interference

– Two Powerful USARTs With Support for

– Programmable Output Power Up to 4.5 dBm Several Serial Protocols

– Very Few External Components – 21 General-Purpose I/O Pins (19 × 4 mA, 2 ×

20 mA)

– Only a Single Crystal Needed for Mesh

Network Systems – Watchdog Timer

– 6-mm × 6-mm QFN40 Package • Development Tools

– Suitable for Systems Targeting Compliance – CC2530 Development Kit

With Worldwide Radio-Frequency

– CC2530 ZigBee

Development Kit

Regulations: ETSI EN 300 328 and EN 300

– CC2530 RemoTI™ Development Kit for

440 (Europe), FCC CFR47 Part 15 (US) and

RF4CE

ARIB STD-T-66 (Japan)

– SmartRF™ Software

• Low Power

– Packet Sniffer

– Active-Mode RX (CPU Idle): 24 mA

– IAR Embedded Workbench™ Available

– Active Mode TX at 1 dBm (CPU Idle): 29 mA

– Power Mode 1 (4 µ s Wake-Up): 0.2 mA

– Power Mode 2 (Sleep Timer Running): 1 µ A

• 2.4-GHz IEEE 802.15.4 Systems

– Power Mode 3 (External Interrupts): 0.4 µ A

• RF4CE Remote Control Systems (64-KB Flash

and Higher)

– Wide Supply-Voltage Range (2 V – 3.6 V)

• ZigBee Systems (256-KB Flash)

• Microcontroller

• Home/Building Automation

– High-Performance and Low-Power 8051

• Lighting Systems

Microcontroller Core With Code Prefetch

• Industrial Control and Monitoring

– 32-, 64-, 128-, or 256-KB

• Low-Power Wireless Sensor Networks

In-System-Programmable Flash

• Consumer Electronics

– 8-KB RAM With Retention in All Power

• Health Care

Modes

– Hardware Debug Support

• Peripherals

– Powerful Five-Channel DMA

– IEEE 802.15.4 MAC Timer, General-Purpose

Timers (One 16-Bit, Two 8-Bit)

– IR Generation Circuitry

– 32-kHz Sleep Timer With Capture

– CSMA/CA Hardware Support

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 RemoTI, SmartRF, Z-Stack are trademarks of Texas Instruments.

3 IAR Embedded Workbench is a trademark of IAR Systems AB.

4 ZigBee is a registered trademark of the ZigBee Alliance.

5 All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

DESCRIPTION

RESET

WATCHDOG

TIMER

IRQCTRL

FLASHWRITE

DEBUG

INTERFACE

CLOCKMUXand

CALIBRATION

MODULATOR

DEMODULATOR

DMA

8051CPU

CORE

MEMORY

ARBITRATOR

32-MHz

CRYSTAL OSC

32.768-kHz

CRYSTAL OSC

32-kHz

RC-OSC

HIGH-SPEED

RC-OSC

ON-CHIP VOLTAGE

REGULATOR

POWERONRESET

BROWNOUT

DIGITAL

ANALOG

MIXED

SLEEP TIMER

SLEEP MODECONTROLLER

CSMA/CA STROBE

PROCESSOR

RADIOREGISTERS

RADIODATA INTERFACE

FIFOandFRAMECONTROL

USART 1

USART 2

TIMER1(16-Bit)

TIMER3(8-Bit)

TIMER4(8-Bit)

TIMER2

(IEEE802.15.4MAC TIMER)

32/64/128/256-KB

FLASH

8-KBSRAM

ADC

AUDIO/DC

8CHANNELS

RECEIVE

CHAIN

TRANSMIT

CHAIN

AES

ENCRYPTION

AND

DECRYPTION

FREQUENCY

SYNTHESIZER

AGC

VDD(2V–3.6V)

DCOUPL

I/OCONTROLLER

RF_P RF_N

XOSC_Q2

RESET_N

XOSC_Q1

P2_4

P1_7

P0_7

P2_3

P1_6

P0_6

P2_2

P1_5

P0_5

P1_2

P0_2

P2_1

P1_4

P0_4

P1_1

P0_1

P2_0

P1_3

P0_3

P1_0

P0_0

B0300-02

CC2530F32 , CC2530F64 , CC2530F128 , CC2530F256

SWRS081A – APRIL 2009 – REVISED APRIL 2009 ..........................................................................................................................................................

www.ti.com

The CC2530 is a true system-on-chip (SoC) solution for IEEE 802.15.4, Zigbee and RF4CE applications. It

enables robust network nodes to be built with very low total bill-of-material costs. The CC2530 combines the

excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system

programmable flash memory, 8-KB RAM, and many other powerful features. The CC2530 comes in four different

flash versions: CC2530F32/64/128/256, with 32/64/128/256 KB of flash memory, respectively. The CC2530 has

various operating modes, making it highly suited for systems where ultralow power consumption is required.

Short transition times between operating modes further ensure low energy consumption.

Combined with the industry-leading and golden-unit-status ZigBee protocol stack ( Z-Stack™) from Texas

Instruments, the CC2530F256 provides a robust and complete ZigBee solution.

Combined with the golden-unit-status RemoTI stack from Texas Instruments, the CC2530F64 and higher provide

a robust and complete ZigBee RF4CE remote-control solution.

Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256

ABSOLUTE MAXIMUM RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

ELECTRICAL CHARACTERISTICS

CC2530F32 , CC2530F64 , CC2530F128 , CC2530F256

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

MIN MAX UNIT

Supply voltage All supply pins must have the same voltage – 0.3 3.9 V

– 0.3 VDD + 0.3,

Voltage on any digital pin V

≤ 3.9

Input RF level 10 dBm

Storage temperature range – 40 125 ° C

All pads, according to human-body model, JEDEC STD 22, method

2 kV

A114

ESD

(2)

According to charged-device model, JEDEC STD 22, method C101 500 V

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage.

MIN MAX UNIT

Operating ambient temperature range, T

– 40 125 ° C

Operating supply voltage 2 3.6 V

Measured on Texas Instruments CC2530 EM reference design with T

= 25 ° C and VDD = 3 V, unless otherwise noted.

Boldface limits apply over the entire operating range, T

= – 40 ° C to 125 ° C, VDD = 2 V to 3.6 V, and f

= 2394 MHz to

2507 MHz.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Digital regulator on. 16-MHz RCOSC running. No radio,

crystals, or peripherals active.

3.4 mA

Medium CPU activity: normal flash access

(1)

, no RAM access

32-MHz XOSC running. No radio or peripherals active.

6.5 8.9 mA

Medium CPU activity: normal flash access

(1)

, no RAM access

32-MHz XOSC running, radio in RX mode, – 50-dBm input

20.5 mA

power, no peripherals active, CPU idle

32-MHz XOSC running, radio in RX mode at -100-dBm input

24.3 29.6 mA

power (waiting for signal), no peripherals active, CPU idle

32-MHz XOSC running, radio in TX mode, 1-dBm output

28.7 mA

core

Core current consumption

power, no peripherals active, CPU idle

32-MHz XOSC running, radio in TX mode, 4.5-dBm output

33.5 39.6 mA

power, no peripherals active, CPU idle

Power mode 1. Digital regulator on; 16-MHz RCOSC and

32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD 0.2 0.3 mA

and sleep timer active; RAM and register retention

Power mode 2. Digital regulator off; 16-MHz RCOSC and

32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and 1 2 µ A

sleep timer active; RAM and register retention

Power mode 3. Digital regulator off; no clocks; POR active;

0.4 1 µ A

RAM and register retention

(1) Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently.

Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256

GENERAL CHARACTERISTICS

RF RECEIVE SECTION

CC2530F32 , CC2530F64 , CC2530F128 , CC2530F256

www.ti.com

Measured on Texas Instruments CC2530 EM reference design with T

= 25 ° C and VDD = 3 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

WAKE-UP AND TIMING

Digital regulator on, 16-MHz RCOSC and 32-MHz crystal

Power mode 1 → active 4 µ s

oscillator off. Start-up of 16-MHz RCOSC

Digital regulator off, 16-MHz RCOSC and 32-MHz crystal

Power mode 2 or 3 → active 0.1 ms

oscillator off. Start-up of regulator and 16-MHz RCOSC

Initially running on 16-MHz RCOSC, with 32-MHz XOSC

0.5 ms

OFF

Active → TX or RX

With 32-MHz XOSC initially on 192 µ s

RX/TX and TX/RX turnaround 192 µ s

RADIO PART

Programmable in 1-MHz steps, 5 MHz between channels

RF frequency range 2394 2507 MHz

for compliance with [1]

Radio baud rate As defined by [1] 250 kbps

Radio chip rate As defined by [1] 2 MChip/s

Measured on Texas Instruments CC2530 EM reference design with T

= 25 ° C, VDD = 3 V, and f

= 2440 MHz, unless

otherwise noted.

Boldface limits apply over the entire operating range, T

= – 40 ° C to 125 ° C, VDD = 2 V to 3.6 V, and f

= 2394 MHz to

2507 MHz.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

PER = 1%, as specified by [1]

– 97 – 92

Receiver sensitivity dBm

– 88

[1] requires – 85 dBm

PER = 1%, as specified by [1]

Saturation (maximum input level) 10 dBm

[1] requires – 20 dBm

Wanted signal – 82 dBm, adjacent modulated channel at

Adjacent-channel rejection, 5-MHz

5 MHz, PER = 1 %, as specified by [1].

49 dB

channel spacing

[1] requires 0 dB

Wanted signal – 82 dBm, adjacent modulated channel at

Adjacent-channel rejection, – 5-MHz

– 5 MHz, PER = 1 %, as specified by [1].

49 dB

channel spacing

[1] requires 0 dB

Wanted signal – 82 dBm, adjacent modulated channel at

Alternate-channel rejection, 10-MHz

10 MHz, PER = 1%, as specified by [1]

57 dB

channel spacing

[1] requires 30 dB

Wanted signal – 82 dBm, adjacent modulated channel at

Alternate-channel rejection, – 10-MHz

– 10 MHz, PER = 1 %, as specified by [1]

57 dB

channel spacing

[1] requires 30 dB

Channel rejection

Wanted signal at – 82 dBm. Undesired signal is an IEEE

≥ 20 MHz 802.15.4 modulated channel, stepped through all channels 57 dB

from 2405 to 2480 MHz. Signal level for PER = 1%.

≤ – 20 MHz 57

Wanted signal at – 82 dBm. Undesired signal is 802.15.4

Co-channel rejection modulated at the same frequency as the desired signal. Signal – 3 dB

level for PER = 1%.

Blocking/desensitization

5 MHz from band edge Wanted signal 3 dB above the sensitivity level, CW jammer, – 33

10 MHz from band edge PER = 1%. Measured according to EN 300 440 class 2. – 33

20 MHz from band edge – 32

dBm

50 MHz from band edge – 31

– 5 MHz from band edge – 35

– 10 MHz from band edge – 35

– 20 MHz from band edge – 34

– 50 MHz from band edge – 34

Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256

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