Exynos 4412
RISC Microprocessor
Revision 1.00
February 2012
2012 Samsung Electronics Co., Ltd. All rights reserved.
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警 告 本文件仅向经韩国三星电子株式会社授权的人员提供，
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采取法律措施，包括但不限于提出损害赔偿请求。
Copyright 2012 Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd.
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Trademarks
All brand names, trademarks and registered trademarks belong to their respective owners.
Exynos, Exynos4210, FlexOneNAND, and OneNAND are trademarks of Samsung Electronics.
ARM, Jazelle, TrustZone, and Thumb are registered trademarks of ARM Limited. Cortex, ETM, ETB,
Coresight, ISA, and Neon are trademarks of ARM Limited.
Java is a trademark of Sun Microsystems, Inc.
SD is a registered trademark of Toshiba Corporation.
MMC and eMMC are trademarks of MultiMediaCard Association.
JTAG is a registered trademark of JTAG Technologies, Inc.
Synopsys is a registered trademark of Synopsys, Inc.
I2S is a trademark of Phillips Electronics.
I2C is a trademark of Phillips Semiconductor Corp.
MIPI and Slimbus are registered trademarks of the Mobile Industry Processor Interface (MIPI) Alliance.
All other trademarks used in this publication are the property of their respective owners.
Chip Handling Guide
Precaution against Electrostatic Discharge
When handling semiconductor devices, be sure that the environment is protected against static electricity.
1. Operators should wear anti-static clothing and use earth band.
2. All objects that come in direct contact with devices should be made of materials that do not produce static
electricity that would cause damage.
3. Equipment and work table must be earthed.
4. Ionizer is recommended to remove electron charge.
Contamination
Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
Temperature/Humidity
Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may
deteriorate semiconductor device‟s characteristics. Therefore avoid storage or use in such conditions.
Mechanical Shock
Care should be exercised not to apply excessive mechanical shock or force on semiconductor device.
Chemical
Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device
characteristics.
Light Protection
In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may
cause device‟s malfunction. (But, some special products which utilize the light or have security function are
excepted from this guide)
Radioactive, Cosmic and X-ray
Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may
cause soft error during device operation. Therefore semiconductor devices must be shielded under environment
that may be exposed to radioactive, cosmic ray or X-ray.
EMS (Electromagnetic Susceptibility)
Note that semiconductor device‟s characteristics may be affected by strong electromagnetic wave or magnetic
field during operation under insufficient PCB circuit design for EMS.
Revision History
Revision No.
Date
Description
Author(s)
0.10
September, 2011
1st Draft version
Chongkun Lee
0.20
November, 2011
2nd Preliminary version
Chongkun Lee
0.30
December, 2011
3rd Preliminary version for EVT1.0
Chongkun Lee
0.40
January, 2012
4th Preliminary version for EVT1.0
Chongkun Lee
0.41
January, 2012
Correct some error.
Chongkun Lee
1.00
February, 2012
1st official version
Chongkun Lee
