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MSM7625的datasheet
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Qualcomm Confidential and Proprietary
Restricted Distribution. Not to be distributed to anyone who is not an employee of either Qualcomm or a subsidiary
of Qualcomm without the express approval of Qualcomm’s Configuration Management.
Not to be used, copied, reproduced in whole or in part, nor its contents revealed in any manner to others without the
express written permission of Qualcomm.
QUALCOMM is a registered trademark of QUALCOMM Incorporated in the United States and may be registered in
other countries. Other product and brand names may be trademarks or registered trademarks of their respective
owners. CDMA2000 is a registered certification mark of the Telecommunications Industry Association, used under
license. ARM is a registered trademark of ARM Limited. QDSP is a registered trademark of QUALCOMM
Incorporated in the United States and other countries.
This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion
contrary to U.S. and international law is strictly prohibited.
QUALCOMM Incorporated
5775 Morehouse Drive
San Diego, CA 92121-1714
U.S.A.
MSM7625 Mobile Station Modem
Device Specification (Advance Information)
80-VJ153-1 Rev. C
November 11, 2008
Submit technical questions at:
https://support.cdmatech.com
Copyright © 2008 Qualcomm Incorporated.
All rights reserved.
nie.huaiyun-zte.com.cn
2008.11.30 at 17:49:11 PST
Terms and Conditions of Usage
This document may refer to or describe parts whose manufacture, use, sale, offer for sale, or
importation into the United States are limited or prohibited by one or more U.S. Federal Court
injunctions against QUALCOMM Incorporated. This document is not to be construed as an offer
to sell such parts for use or importation into the U.S., nor should it be construed as assistance in
making, using, selling, offering to sell, or the importation of any product in the U.S. containing
such parts. This document is intended solely to provide information for those products that are
outside the scope of the injunction. Recipient’s download and/or use of the information in this
document constitutes agreement with these terms.
80-VJ153-1 Rev. C 2 Qualcomm Confidential and Proprietary
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
nie.huaiyun-zte.com.cn
2008.11.30 at 17:49:11 PST
80-VJ153-1 Rev. C 3 Qualcomm Confidential and Proprietary
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
Information in this document is subject to change without notice.
Contents
1 Introduction
1.1 Documentation overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.2 Concise device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
1.3 Device features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.3.1 General MSM7625 device features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.3.2 CDMA 1X (IS-2000) features supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.3.3 CDMA 1xEV-DO (IS-856) features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
1.3.4 WCDMA Release-99 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
1.3.5 HSDPA features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
1.3.6 HSUPA features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
1.3.7 GSM features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.3.8 GPRS features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.3.9 EDGE features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.3.10 Position location features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
1.3.11 Microprocessor and memory subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
1.3.12 Supported connectivity features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.3.13 Supported multimedia features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.3.14 Audio processing features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1.4 Terms and acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1.5 Special marks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2 Pin Definitions
2.1 I/O parameter definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3 Electrical Specifications
3.1 DC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
3.1.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
3.1.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
3.1.3 Device thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
3.1.4 DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
3.1.5 Power consumption characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
3.1.6 Power sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
3.2 Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
3.2.1 Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
nie.huaiyun-zte.com.cn
2008.11.30 at 17:49:11 PST
80-VJ153-1 Rev. C 4 Qualcomm Confidential and Proprietary
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
Information in this document is subject to change without notice.
MSM7625 Mobile Station Modem Device Specification (Advance Information) Contents
3.2.2 Rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
3.2.3 Pad design methodology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
3.2.4 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
3.2.5 EBI1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
3.2.6 EBI2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
3.2.7 Auxiliary interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
3.3 Mixed-signal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
3.3.1 HKADC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
3.3.2 Touchscreen ADC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
3.3.3 PCM interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
3.3.4 I2S/stereo DAC interface specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
3.3.5 Codec specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
4 Device Marking and Ordering Information
4.1 Part marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
4.2 Device ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
5 Package and Carrier Information
5.1 Device physical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
5.2 Tape and reel information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
5.2.1 Package orientation in carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
5.2.2 Tape and reel features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
5.2.3 Tape handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
5.3 Barcode label and packing for shipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
6 PCB Mounting Guidelines
6.1 Storage conditions, unpacking, and handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
6.1.1 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
6.1.2 Device moisture sensitivity level (MSL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
6.1.3 Out-of-bag duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
6.1.4 Baking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
6.1.5 Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
6.2 Land pad and stencil design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
6.3 SMT development and characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
6.4 SMT peak package body temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
6.5 SMT process verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
7 Part Reliability Test Specification
7.1 Reliability qualifications summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
7.2 Qualification sample description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
nie.huaiyun-zte.com.cn
2008.11.30 at 17:49:11 PST
80-VJ153-1 Rev. C 5 Qualcomm Confidential and Proprietary
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
Information in this document is subject to change without notice.
MSM7625 Mobile Station Modem Device Specification (Advance Information) Contents
Figures
Figure 1-1 MSM7625 functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 2-1 Pin table definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 2-2 Pinout for the MSM7625 device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Figure 3-1 IV curve for VOL and VOH for VDD_PX = 1.8 V or 2.6 V . . . . . . . . . . . . . . . . . . 70
Figure 3-2 Timing diagram waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Figure 3-3 Rise and fall time in different load conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Figure 3-4 MSM7625 input signal switch points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Figure 3-5 MSM7625 output pad equivalent circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Figure 3-6 TCXO timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Figure 3-7 Sleep clock timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Figure 3-8 DDR SDRAM EBI1_DCLK and EBI1_DCLKB . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Figure 3-9 Differential clock signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Figure 3-10 DDR SDRAM read timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Figure 3-11 DDR SDRAM write timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Figure 3-12 Asynchronous 16-bit read-write accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Figure 3-13 Asynchronous bus-sized access to 16-bit memory . . . . . . . . . . . . . . . . . . . . . . . . . 81
Figure 3-14 LCD interface write timing (with LCD_EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Figure 3-15 LCD interface read timing (with LCD_EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Figure 3-16 LCD interface write timing (without LCD_EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Figure 3-17 LCD interface read timing (without LCD_EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Figure 3-18 NAND state machine registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Figure 3-19 NAND command and address cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Figure 3-20 Data write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Figure 3-21 Data read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Figure 3-22 OneNAND synchronous memory read timing diagram, 16-bit . . . . . . . . . . . . . . . . 89
Figure 3-23 OneNAND synchronous memory write timing diagram, 16-bit . . . . . . . . . . . . . . . 90
Figure 3-24 CAMIF CLK timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Figure 3-25 CAMIF signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Figure 3-26 JTAG interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Figure 3-27 SD card interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Figure 3-28 LCD controller timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Figure 3-29 PRIM_PCM_SYNC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Figure 3-30 PRIM_PCM_CODEC to MSM7625 timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Figure 3-31 MSM7625 to PRIM_PCM_CODEC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Figure 3-32 AUX_PCM_SYNC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Figure 3-33 AUX_PCM_CODEC to MSM7625 timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Figure 3-34 MSM7625 to AUX_PCM_CODEC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Figure 3-35 Clock timing for transmitter mode (stereo DAC) . . . . . . . . . . . . . . . . . . . . . . . . . 101
Figure 3-36 Clock timing for receiver mode (stereo ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Figure 3-37 Load capacitance CL1 and CL2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Figure 3-38 Load capacitance CL3, single-ended output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
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