ITC57300 分立器件动态参数测试系统 DS
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2012-12-10
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ITC57300
dynamic parametric test system
for discrete semiconductors
options
• Scope Substitutions
• Additional Power Supplies
• Additional Test Heads
• Large Package Adapters
test heads
• ITC57210 - R Switching Time for N- and P-channel
Power MOSFETs, MIL-STD-750, Method 3472
• ITC57220 - Trr/Qrr for power MOSFETs and Diodes,
MIL-STD-750, Method 3473
• ITC57230 - Gate Charge for power MOSFETs,
MIL-STD-750, Method 3471
• ITC57240 Inductive switching time for IGBT,
MIL-STD 750, Method 3477
• ITC57250 Short circuit (Isc) withstand time,
MIL-STD 750, Method 3479
• ITC57260 - Gate Resistance (Rg), Input Capacitance
(Ciss), Output Capacitance (Coss), and Reverse
Capacitance (Crss) for Power MOSFET’s,
JEDEC standard JESD24-11
system features
• Easily Changeable Test Heads
• Automated Testing of Different Parameters
• Ruggedized PC Compatible Computer
• User-Friendly Menu Driven Software
• Programmable Test Output Bins
• Spreadsheet Compatible Test Data
• Selectable Internal Inductance Loads
• GPIB Programmable Test Equipment
• Four channel high bandwidth Digitizing Oscilloscope
• Pulse Generator
• 1200V Power Supply
safety features
• Test Head High-Voltage Interlock
• Receiver High-Voltage Interlock
• High-Speed Drain Supply Switch
overview
The ITC57300 Dynamic Parametric Test System main-
frame accepts Test Heads that perform nondestructive
transient measurements on semiconductor devices
such as Insulated Gate Bipolar Transistors (IGBT), power
MOSFETs, diodes, and other bipolar devices(requires
additional optional bias power supplies and custom
personality boards). Included in the mainframe are all
test equipment and software necessary to analyze and
perform resistive and inductive switching time, switching
losses, gate charge, Trr/Qrr, and other transient tests.
Test Heads, which are designed for a specific type of
transient test, mate to a special Test Head Receiver on
the mainframe. While Test Heads are designed to
perform only one specific test, personality boards within
each Test Head reconfigure the Test Head for a specific
device, device package, and various device circuit
arraignments.
capabilities
• Test voltage: maximum of 1200 Vdc at 200 A
(Isc up to 1000A)
• Timing Measurement: minimum of 1 ns
• Drain Current Limit Monitor
data sheet
PRODUCTIVITY SOLUTIONS FOR PROBE & TEST
www.IntTechCorp.com
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