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Exynos4412 User Manual (Public) version 1.0
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Exynos4412 User Manual (Public) version 1.0 Exynos 4412 RISC Microprocessor September 2012
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Exynos 4412
RISC Microprocessor
Public Version
September 2012
2012 Samsung Electronics Co., Ltd. All rights reserved.
Important Notice
Samsung Electronics Co. Ltd. (“Samsung”) reserves the
right to make changes to the information in this publication
at any time without prior notice. All information provided is
for reference purpose only. Samsung assumes no
responsibility for possible errors or omissions, or for any
consequences resulting from the use of the information
contained herein.
This publication on its own does not convey any license,
either express or implied, relating to any Samsung and/or
third-party products, under the intellectual property rights of
Samsung and/or any third parties.
Samsung makes no warranty, representation, or guarantee
regarding the suitability of its products for any particular
purpose, nor does Samsung assume any liability arising out
of the application or use of any product or circuit and
specifically disclaims any and all liability, including without
limitation any consequential or incidental damages.
Customers are responsible for their own products and
applications. "Typical" parameters can and do vary in
different applications. All operating parameters, including
"Typicals" must be validated for each customer application
by the customer's technical experts.
Samsung products are not designed, intended, or authorized
for use in applications intended to support or sustain life, or
for any other application in which the failure of the Samsung
product could reasonably be expected to create a situation
where personal injury or death may occur. Customers
acknowledge and agree that they are solely responsible to
meet all other legal and regulatory requirements regarding
their applications using Samsung products notwithstanding
any information provided in this publication. Customer shall
indemnify and hold Samsung and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, expenses, and reasonable attorney
fees arising out of, either directly or indirectly, any claim
(including but not limited to personal injury or death) that
may be associated with such unintended, unauthorized
and/or illegal use.
WARNING No part of this publication may be reproduced,
stored in a retrieval system, or transmitted in any form or by
any means, electric or mechanical, by photocopying,
recording, or otherwise, without the prior written consent of
Samsung. This publication is intended for use by designated
recipients only. This publication contains confidential
information (including trade secrets) of Samsung protected
by Competition Law, Trade Secrets Protection Act and other
related laws, and therefore may not be, in part or in whole,
directly or indirectly publicized, distributed, photocopied or
used (including in a posting on the Internet where
unspecified access is possible) by any unauthorized third
party. Samsung reserves its right to take any and all
measures both in equity and law available to it and claim full
damages against any party that misappropriates Samsung‟s
trade secrets and/or confidential information.
警 告 本文件仅向经韩国三星电子株式会社授权的人员提供,
其内容含有商业秘密保护相关法规规定并受其保护的三星电
子株式会社商业秘密,任何直接或间接非法向第三人披露、
传播、复制或允许第三人使用该文件全部或部分内容的行为
(包括在互联网等公开媒介刊登该商业秘密而可能导致不特
定第三人获取相关信息的行为)皆为法律严格禁止。此等违
法行为一经发现,三星电子株式会社有权根据相关法规对其
采取法律措施,包括但不限于提出损害赔偿请求。
Copyright 2012 Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd.
San #24 Nongseo-Dong, Giheung-Gu
Yongin-City, Gyeonggi-Do, Korea 446-711
Contact Us: mobilesol.cs@samsung.com
Home Page: http://www.samsungsemi.com
Trademarks
All brand names, trademarks and registered trademarks belong to their respective owners.
Exynos, Exynos4412, FlexOneNAND, and OneNAND are trademarks of Samsung Electronics.
ARM, Jazelle, TrustZone, and Thumb are registered trademarks of ARM Limited.
Cortex, ETM, ETB, Coresight, ISA, and Neon are trademarks of ARM Limited.
Java is a trademark of Sun Microsystems, Inc.
SD is a registered trademark of Toshiba Corporation.
MMC and eMMC are trademarks of MultiMediaCard Association.
JTAG is a registered trademark of JTAG Technologies, Inc.
Synopsys is a registered trademark of Synopsys, Inc.
I2S is a trademark of Phillips Electronics.
I2C is a trademark of Phillips Semiconductor Corp.
MIPI and Slimbus are registered trademarks of the Mobile Industry Processor Interface (MIPI) Alliance.
All other trademarks used in this publication are the property of their respective owners.
Chip Handling Guide
Precaution against Electrostatic Discharge
When using semiconductor devices, ensure that the environment is protected against static electricity:
1. Wear antistatic clothes and use earth band.
2. All objects that are in direct contact with devices must be made up of materials that do not produce static
electricity.
3. Ensure that the equipment and work table are earthed.
4. Use ionizer to remove electron charge.
Contamination
Do not use semiconductor products in an environment exposed to dust or dirt adhesion.
Temperature/Humidity
Semiconductor devices are sensitive to:
Environment
Temperature
Humidity
High temperature or humidity deteriorates the characteristics of semiconductor devices. Therefore, do not store or
use semiconductor devices in such conditions.
Mechanical Shock
Do not to apply excessive mechanical shock or force on semiconductor devices.
Chemical
Do not expose semiconductor devices to chemicals because exposure to chemicals leads to reactions that
deteriorate the characteristics of the devices.
Light Protection
In non- Epoxy Molding Compound (EMC) package, do not expose semiconductor IC to bright light. Exposure to
bright light causes malfunctioning of the devices. However, a few special products that utilize light or with security
functions are exempted from this guide.
Radioactive, Cosmic and X-ray
Radioactive substances, cosmic ray, or X-ray may influence semiconductor devices. These substances or rays
may cause a soft error during a device operation. Therefore, ensure to shield the semiconductor devices under
environment that may be exposed to radioactive substances, cosmic ray, or X-ray.
EMS (Electromagnetic Susceptibility)
Strong electromagnetic wave or magnetic field may affect the characteristic of semiconductor devices during the
operation under insufficient PCB circuit design for Electromagnetic Susceptibility (EMS).
Revision History
Revision No.
Date
Description
Author(s)
1.00
Sep. 17, 2012
Initial version
Chongkun Lee
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