4
www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2
Notes:
1. M2S090 FCSG325 package dimension is 11x13.5. 2. Highlighted devices can migrate vertically in the same package. 3. (G) indicates that the package is RoHS 6/6 Compliant/Pb-free.
SmartFusion2 Devices Features M2S005 M2S010 M2S025 M2S050 M2S060 M2S090 M2S150
Logic/DSP
Maximum Logic Elements (4LUT + DFF) 6,060 12,084 27,696 56,340 56,520 86,184 146,124
Mathblocks (18 x 18) 11 22 34 72 72 84 240
Fabric Interface Controllers (FICs) 1 2 1 2
PLLs and CCCs 2 6 8
Security AES256, SHA256, RNG AES256, SHA256, RNG, ECC, PUF
MSS
Cortex-M3 + instruction Cache Yes
eNVM (K Bytes) 128 256 512
eSRAM (K Bytes) 64
eSRAM (K Bytes) Non-SECDED 80
CAN, 10/100/1000 Ethernet, HS USB 1 each
Multi-Mode UART, SPI, I
2
C,Timer 2 each
Fabric Memory
LSRAM 18 K Blocks 10 21 31 69 109 236
uSRAM 1 K Blocks 11 22 34 72 112 240
Total RAM (K bits) 191 400 592 1,314 2,074 4,488
High-Speed
DDR Controllers (count × width) 1×18 2×36 1×18 2x36
SERDES Lanes 0 4 8 4 16
PCIe End Points 0 1 2 4
User I/O
MSIO (3.3 V) 115 123 157 139 271 309 292
MSIOD (2.5 V) 28 40 62 40 106
DDRIO (2.5 V) 66 70 176 76 176
Total User I/Os 209 233 267 377 387 425 574
Package Options
Package Type FCS(G)325 VF(G)256 FCS(G)536 VF(G)400 FCV(G)484 TQ(G)144 FG(G)484 FG(G)676 FG(G)896 FC(G)1152
Pitch (mm) 0.5 0.8 0.5 0.8 0.5 1.0 1.0 1.0 1.0
Length x Width
(mm)
11x11 14x14 16x16 17x17 19x19 20x20 23x23 27x27 31x31 35x35
Device I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes
M2S005 (S) — — 161 — — — 171 — — — 84 — 209 — — — — — — —
M2S010 (S/T/TS) — — 138 2 — — 195 4 — — 84 — 233 4 — — — — — —
M2S025 (T/TS) 180 2 138 2 — — 207 4 — — — — 267 4 — — — — — —
M2S050 (T/TS) 200 2 — — — — 207 4 — — — — 267 4 — — 377 8 — —
M2S060 (T/TS) 200 2 — — — — 207 4 — — — — 267 4 387 4 — — — —
M2S090 (T/TS) 180 4 — — — — — — — — — — 267 4 425 4 — — — —
M2S150 (T/TS) — — — — 293 4 — — 248 4 — — — — — — — — 574 16
• Embedded ARM Cortex-M3
Microcontroller Subsystem
• PCIe Gen2 endpoints starting at 10
K Logic Elements
• Embedded DDR3 memory controllers
• Small packages
• 1 mW in Flash*Freeze mode
• Instant-on
• Zero FIT FPGA Conguration Cells
• SECDED memory protection
• NRBG, AES-256, SHA-256, ECC
Cryptographic Engine
• User Physically Unclonable
Function (PUF)
• CRI DPA Pass through license
More resources in low density devices with ARM Cortex-M3 processor
SmartFusion2 SoC FPGAs deliver more resources in low density devices, with the lowest power, proven security and
exceptional reliability. These devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI
Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system
management and secure connectivity. Microsemi SoC FPGAs are used by customers in Communications, Industrial,
Medical, Defense, and Aviation markets.
SmartFusion2 Devices
I/Os Per Package
S m a r t Fu s i o n 2 SoC FPGAs I G L O O 2 FPGAs
