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This document describes the EDK II Build Architecture. This specification was designed to support new build requirements for building EDK components within the EDK II build infrastructure. EDK II Build utilities described in this document use INI style text based meta-data files to describe components, modules, libraries, platforms, firmware volumes and firmware device images. This document describes the high level EDK II Build Architecture.
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EDK Build Specification
May 2010
Revision 1.22
Build
ii May, 2010 1.22
Acknowledgements
THIS SPECIFICATION IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR
ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. Intel products
are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or
"undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
A license is hereby granted to copy and reproduce this specification for internal use only.
No other license, express or implied, by estoppel or otherwise, to any other intellectual property rights is granted
herein.
Intel disclaims all liability, including liability for infringement of any proprietary rights, relating to use of information in
this specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted
herein.
This specification is an intermediate draft for comment only and is subject to change without notice. Readers should
not design products based on this document.
*Other names and brands may be claimed as the property of others.
Copyright © 2008 - 2010 Intel Corporation. All rights reserved.
Version 1.2 May, 2010 iii
Revision History
Revision Revision History Date
1.0 Initial release . February 2008
1.1 Update based on errata August 2008
1.2 Updates based on enhancement requests June 2009
1.21 Updates based on errata and enhancement requests
• Definitions in DSC file [defines] section are now global to
both DSC and FDF files
• Added language filters: RFC_LANGUAGES and
ISO_LANGUAGES
• Rule processing for file type lists is alphabetical, i.e., files
are added in alphabetical order
• Added warning for VFR file naming convention - cannot
use a name that is also used for a C file
• Use of the IDENTIFIER statement in tools_def.txt is
optional
• Whitespace characters are permitted in the meta-data
files, so tools must handle them (use of token based
processing is recommended)
• Tools must support any number of
FV_EXT_ENTRY_TYPE statements in an FDF file
• The build tools must auto compute the ExtHeaderOffset in
the FV Header.
• The build tools must auto compute the ExtHeaderSize in
the FV Ext Header based on the size of the FV Ext Header
and all the FV Ext Header Entries.
• The build tools must auto compute the ExtEntrySize field
in the FV Ext Header Entry structure based on the size of
the file specified by the FILE statement or the number of
bytes in the byte array of the DATA statement. If the size
is greater than 16-bits, the build should break.
• Specified parsing priority rules for definitions and values
• Added report generator syntax as part of the build
• Add support for “Auto” alignment for PE32 and TE images
• Add support for specifying block information for capsules
• FeatureFlagExpression processing should allow C-style
expression syntax and follow C rules for processing
January 2010
1.22 Grammatical and formatting changes. Added Module types
appendix.
May 2010
Build
iv May, 2010 1.22
1.22 May, 2010 v
Contents
1
Introduction..................................................................................................... 1
1.1 Overview ........................................................................................................................... 1
1.2 Target Audience................................................................................................................ 1
1.3 Related Information........................................................................................................... 1
1.4 Terms................................................................................................................................ 2
1.5 Conventions Used in this Document................................................................................. 5
1.5.1 Data Structure Descriptions .................................................................................. 5
1.5.2 Pseudo-Code Conventions ................................................................................... 6
1.5.3 Typographic Conventions ..................................................................................... 6
2
Design Discussion ......................................................................................... 9
2.1 Reference Implementation: UEFI & PI formats................................................................. 9
2.2 Development Environments.............................................................................................. 9
2.2.1 Reference Implementation: Build process restrictions .......................................... 9
2.3 UEFI/PI Firmware Images................................................................................................. 9
2.4 Boot Sequence ...............................................................................................................11
2.4.1 Security (SEC) .................................................................................................... 12
2.4.2 Pre-EFI Initialization (PEI)................................................................................... 12
2.4.3 Drive Execution Environment (DXE) ................................................................... 13
2.4.4 Boot Device Selection (BDS) .............................................................................. 13
2.4.5 Transient System Load (TLS) and Runtime (RT)................................................ 13
2.4.6 After Life (AL) ...................................................................................................... 13
2.5 Typical Flash Part Layout ............................................................................................... 13
2.6 Generic Build Process .................................................................................................... 16
2.6.1 EFI SECTION Files ............................................................................................. 17
2.6.2 Firmware Files..................................................................................................... 18
2.6.3 Firmware Volumes .............................................................................................. 20
2.6.4 Special Files - VTF & BSF .................................................................................. 22
2.6.5 EFI_FV_FILETYPE_SECURITY Notes .............................................................. 22
2.6.6 EFI_FV_FILETYPE_PEI_CORE Notes .............................................................. 22
2.6.7 EFI_FV_FILETYPE_PEIM Notes........................................................................ 23
2.6.8 EFI_FV_FILETYPE_COMBINED_PEIM_DRIVER Notes................................... 23
2.6.9 DXE, BDS, TLS and AL Notes............................................................................ 23
2.7 Creating EFI Images ....................................................................................................... 24
2.7.1 Compiling Code................................................................................................... 24
2.7.2 Creating a Terse Image ...................................................................................... 24
2.7.3 Removing reloc sections..................................................................................... 25
2.7.4 Generating LEAF EFI_SECTION Files ............................................................... 26
2.7.5 Generating Encapsulation EFI_SECTION Files.................................................. 28
2.7.6 Generating DEPEX EFI_SECTION Files ............................................................ 28
2.7.7 Generating Visual Forms (IFR - HII) Files........................................................... 29
2.7.8 Generating EFI FFS Files ................................................................................... 30
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