2
P/N: PM1670
REV. 1.4, APR. 10, 2014
MX25L1006E
Contents
1. FEATURES ........................................................................................................................................................ 4
2. GENERAL DESCRIPTION ............................................................................................................................... 5
3. PIN CONFIGURATIONS .................................................................................................................................... 6
4. PIN DESCRIPTION ............................................................................................................................................ 6
5. BLOCK DIAGRAM ............................................................................................................................................. 7
6. DATA PROTECTION .......................................................................................................................................... 8
Table 1. Protected Area Sizes ................................................................................................................8
7. HOLD FEATURE ................................................................................................................................................ 9
Figure 1. Hold Condition Operation .......................................................................................................9
Table 2. Command Denition ...............................................................................................................10
8. MEMORY ORGANIZATION ..............................................................................................................................11
Table 3. Memory Organization ............................................................................................................ 11
9. DEVICE OPERATION ...................................................................................................................................... 12
Figure 2. Serial Modes Supported .......................................................................................................12
10. COMMAND DESCRIPTION ........................................................................................................................... 13
10-1. Write Enable (WREN) ..........................................................................................................................13
10-2. Write Disable (WRDI) ........................................................................................................................... 13
10-3. Read Identication (RDID) ...................................................................................................................13
10-4. Read Status Register (RDSR) .............................................................................................................14
Table 4. Status Register .......................................................................................................................14
10-5. Write Status Register (WRSR) ............................................................................................................. 15
Table 5. Protection Modes ....................................................................................................................15
10-6. Read Data Bytes (READ) ....................................................................................................................16
10-7. Read Data Bytes at Higher Speed (FAST_READ) ..............................................................................16
10-8. Dual Output Mode (DREAD) ................................................................................................................ 16
10-9. Sector Erase (SE) ................................................................................................................................16
10-10. Block Erase (BE) .................................................................................................................................17
10-11. Chip Erase (CE) ................................................................................................................................... 17
10-12. Page Program (PP) .............................................................................................................................17
10-13. Deep Power-down (DP) .......................................................................................................................18
10-14. Release from Deep Power-down (RDP), Read Electronic Signature (RES) ......................................18
10-15. Read Electronic Manufacturer ID & Device ID (REMS) .......................................................................19
Table 6. ID Denitions ..........................................................................................................................19
10-16. Read SFDP Mode (RDSFDP) .............................................................................................................. 20
Figure 3. Read Serial Flash Discoverable Parameter (RDSFDP) Sequence ......................................20
Table 7. Signature and Parameter Identication Data Values .............................................................21
Table 8. Parameter Table (0): JEDEC Flash Parameter Tables ...........................................................22
Table 9. Parameter Table (1): Macronix Flash Parameter Tables ........................................................24
11. POWER-ON STATE ....................................................................................................................................... 26
12. ELECTRICAL SPECIFICATIONS .................................................................................................................. 27
Table 10. Absolute Maximum Ratings ..................................................................................................27
Figure 4. Maximum Negative Overshoot Waveform ............................................................................27
Table 11. Capacitance TA = 25°C, f = 1.0 MHz ...................................................................................27
Figure 5. Maximum Positive Overshoot Waveform ..............................................................................27
Figure 6. Input Test Waveforms and Measurement Level .................................................................... 28
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